• Title/Summary/Keyword: Liquid Silicon

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Vertical Alignment of Nematic Liquid Crystal on the SiC Thin Film Layer with Ion-beam Irradiation

  • Oh, Yong-Cheul;Lee, Dong-Gyu
    • Transactions on Electrical and Electronic Materials
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    • v.7 no.6
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    • pp.301-304
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    • 2006
  • We studied the nematic liquid crystal (NLC) aligning capabilities using the new alignment material of the SiC (Silicon Carbide) thin film. The SiC thin film exhibits good chemical and thermal stability. The good thermal and chemical stability make SiC an attractive candidate for electronic applications. A vertical alignment of nematic liquid crystal by atomic beam exposure on the SiC thin film surface was achieved. The about $87^{\circ}$ of stable pretilt angle was achieved at the range from $30^{\circ}\;to\;45^{\circ}$ of incident angle. Consequently, the vertical alignment effect of liquid crystal electro-optical characteristic by the atomic beam alignment method on the SiC thin film layer can be achieved.

A Study on Properties of SiC material Fabricated by Liquid Phase Sintering (액상소결법에 의해 제조된 탄화규소 재료의 특성에 대한 연구)

  • Sang-Pill Lee;Jae-Hwan Kwak;Jin-Kyung Lee
    • Journal of the Korean Society of Industry Convergence
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    • v.26 no.6_2
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    • pp.1019-1024
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    • 2023
  • Ceramic materials have excellent material properties such as stability at high temperatures, chemical stability, corrosion resistance, and wear resistance, so they are applicable even in extreme environments of high temperature and pressure. In particular, silicon carbide can be applied in the field of structural ceramics due to its characteristics of high strength, hardness, corrosion resistance, and heat resistance even at high temperatures. In this study, considering the application of silicon carbide materials to next-generation turbines, silicon carbide materials were manufactured using a liquid phase sintering method. When manufacturing liquid phase sintered silicon carbide, sintering additives were added to lower the sintering temperature and densify the material. In Al2O3-SiO2, it was confirmed that the secondary product of the sintering additive was observed as a slightly dark area and was evenly distributed overall, and the fracture surface of Al2O3-SiO2 was in the form of transgranular fracture in which cracks progressed along the crystal plane, and the flexural strength for Al2O3-SiO2 was about 445.6 MPa.

Compressive Fracture Behavior of C/SiC composite fabricated by Liquid Silicon Infiltration (LSI 공법으로 제작된 C/SiC 복합재의 압축거동 평가)

  • Yoon, Dong Hyun;Kim, Jae Hoon
    • Journal of the Korean Society of Safety
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    • v.33 no.1
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    • pp.1-6
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    • 2018
  • The effects of the fiber direction, specimen size and temperature on the compressive strength of carbon fiber reinforced silicon carbide composite (C/SiC composite) manufactured by liquid silicon infiltration(LSI) is investigated. Tests were conducted in accordance with ASTM C 695 at room temperature and elevated temperatures. Experiments are conducted with two different specimens considering grain direction. With grain (W/G) specimens have a carbon fibers parallel to the load direction, but across grain (A/G) specimens have a perpendicular carbon fibers. To verify the specimen size effect of C/SiC composite, two types of specimens are manufactured. One has a one to two ratio of diameter to height and the other has a one to one ratio. The compressive strength of C/SiC composite increased as temperature rise. As specimens are larger, compressive strength of A/G specimens increased, however compressive strength of W/G decreased.

Low temperature growth of silicon thin film on sapphire substrate by liquid phase epitaxy for solar cell application (사파이어 기판을 사용한 태양전지용 실리콘 박막의 저온액상 에피탁시에 관한 연구)

  • Soo Hong Lee;Martin A. Green
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.4 no.2
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    • pp.131-133
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    • 1994
  • Deposition of silicon on pretreated sapphire substrates has been investigated by the liquid phase epitaxy method at low temperatures. An average 14 $\mu\textrm{m}$ thickness of silicon was grown over a large area on sapphire substrate originally coated with a much thinner silicon layer $[0.5 \mu\textrm{m} (100) Si/(1102) sapphire]$ at low temperatures from $(380^{\circ}C to 460^{\circ}C)$.

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Fabrication of Hydrogenated Amorphous Silicon Thin-Film Transistors for Flat Panel Display (평판 표시기를 위한 수소화된 비정질실리콘 박막트랜지스터의 제작)

  • Kim, Nam Deog;Kim, Choong Ki;Choi, Kwang Soo;Jang, Jin;Lee, Choo Chon
    • Journal of the Korean Institute of Telematics and Electronics
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    • v.24 no.3
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    • pp.453-458
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    • 1987
  • Amorphous silicon thin-film transtors (TFT's) have been designed and fabricated on glass substrates. The hydrogenated amorphous silicon (a-Si:H) thin-film has been deposited by decomposing silane(SiH4) in hydorgen ambient by rf glow discharge method. Amorphous silicon nitride(a-Si:H) has been chosen as the gate dielectric material. It has been prepared by decomposing the mixed gas of silane(SiH4) and ammonia(NH3). The electrical properties and performance characteristics of the thin-film transistrs have been measured and compared with the requirements for the switching elements in liquid crystal flat panel display. The results show that liquid crystal flat panel displays can be fabricated using the thin-film transistors described in this paper.

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Study on the phase explosion phenomena during high power laser ablation of silicon (고출력 레이저 어블레이션에 의한 실리콘 가공시 발생하는 상폭발 현상에 관한 연구)

  • ;J. H. Yoo;R. Grief;R. E. Russo
    • Laser Solutions
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    • v.3 no.3
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    • pp.39-45
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    • 2000
  • The volume and depth of the craters produced on silicon samples during high power laser ablation show a strong nonlinear change as the laser irradiance increases across a threshold value, approximately 2.2$\times$10$\^$10/ W/㎠. Time-resolved shadowgraph images of the ablation plume reveal the ejection of large particulates from the sample for laser irradiance above the threshold, with a time delay of about 300-400 ㎱. The numerically estimated thickness of the superheated liquid layer, considering the transformation of liquid metal into liquid dielectric near the critical state, agrees with the measured agrees with crater depths. It is suggested that a phase explosion of the deep superheated liquid layer near the critical state is responsible for the measured sudden increase of crater volume and the ejection of large particulates.

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SiAlON Bulk Glasses and Their Role in Silicon Nitride Grain Boundaries: Composition-Structure-Property Relationships

  • Hampshire, Stuart;Pomeroy, Michael J.
    • Journal of the Korean Ceramic Society
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    • v.49 no.4
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    • pp.301-307
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    • 2012
  • SiAlON glasses are silicates or alumino-silicates, containing Mg, Ca, Y or rare earth (RE) ions as modifiers, in which nitrogen atoms substitute for oxygen atoms in the glass network. These glasses are found as intergranular films and at triple point junctions in silicon nitride ceramics and these grain boundary phases affect their fracture behaviour. This paper provides an overview of the preparation of M-SiAlON glasses and outlines the effects of composition on properties. As nitrogen substitutes for oxygen in SiAlON glasses, increases are observed in glass transition temperatures, viscosities, elastic moduli and microhardness. These property changes are compared with known effects of grain boundary glass chemistry in silicon nitride ceramics. Oxide sintering additives provide conditions for liquid phase sintering, reacting with surface silica on the $Si_3N_4$ particles and some of the nitride to form SiAlON liquid phases which on cooling remain as intergranular glasses. Thermal expansion mismatch between the grain boundary glass and the silicon nitride causes residual stresses in the material which can be determined from bulk SiAlON glass properties. The tensile residual stresses in the glass phase increase with increasing Y:Al ratio and this correlates with increasing fracture toughness as a result of easier debonding at the glass/${\beta}-Si_3N_4$ interface.

Novel Fabrication and Testing of a Bubble-Powered Micropump (새로운 기포동력 마이크로펌프 제작 및 실험)

  • Jung, Jung-Yeul;Kwak, Ho-Young
    • Proceedings of the KSME Conference
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    • 2004.11a
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    • pp.1196-1200
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    • 2004
  • Micropump is very useful component in micro/nano fluidics and bioMEMS applications. In this study, a bubble-powered micropump was fabricated and tested. The micropump consists of two-parallel micro line heaters, a pair of nozzle-diffuser flow controller and a 1 mm in diameter, 400 ${\mu}m$ in depth pumping chamber. The two-parallel micro line heaters with 20 ${\mu}m-width$ and 200 ${\mu}m-length$ were fabricated to be embedded in the silicon dioxide layer of a wafer which serves as a base plate for the micropump. The pumping chamber, the pair of nozzle-diffuser unit and microchannels including the liquid inlet and outlet port were fabricated by etching through another silicon wafer. A glass wafer (thickness of $525{\pm}15$ ${\mu}m$) having two holes of inlet and outlet ports of liquid serve as upper plate of the pump. Finally the silicon wafer of the base plate, the silicon wafer of pumping chamber and the glass wafer were aligned and bonded (Si-Si bonding and anodic bonding). A sequential photograph of bubble nucleation, growth and collapse was visualized by CCD camera. Clearly liquid flow through the nozzle during the period of bubble growth and slight back flow of liquid at the end of collapsing period can be seen. The mass flow rate was found to be dependent on the duty ratio and the operation frequency. As duty ratio increases, flow rate decreases gradually when the duty ratio exceeds 60%. Also as the operation frequency increases, the flow rate of the micropump decreases slightly.

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Cryogenic Machining of Open-Cell Silicone Foam (액화질소를 이용한 오픈 셀 실리콘 폼의 냉동 절삭조건 최적화)

  • Hwang, Jihong;Cho, Kwang-Hee;Park, Min-Soo
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.23 no.1
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    • pp.32-37
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    • 2014
  • Open-cell silicon foam is difficult to cut using conventional machining processes because of its low stiffness. That is, open-cell silicon foam is easily pressed down when the tool is engaged, which makes it difficult to remove the material in the form of chip. This study proposes an advanced method of machining open-cell silicon foam by freezing the material using liquid nitrogen. Furthermore, the machining conditions are optimized to maximize the efficiency of material removal and minimize the usage of liquid nitrogen by conducting experiments under various machining conditions. The results show that open-cell silicone foam products with free surface can be successfully machined by employing the proposed method.