• 제목/요약/키워드: Liquid Phase deposition

검색결과 90건 처리시간 0.028초

Monitoring of the Transfer of Tetrachloroaurate(III) Ions by Thin-layer Electrochemistry and Electrochemical Deposition of Metallic Gold over a Graphite Electrode

  • Song, Ji-Seon;Shin, Hyo-Sul;Kang, Chan
    • Bulletin of the Korean Chemical Society
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    • 제29권10호
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    • pp.1983-1987
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    • 2008
  • This study demonstrates the electrochemical conversion of the synthetic procedure of monolayer-protected clusters using a thin toluene layer over an edge plane pyrolytic graphite electrode. A thin toluene layer with a thickness of 0.31 mm was coated over the electrode and an immiscible liquid/liquid water/toluene interface was introduced. The transfer of the tetrachloroaurate ($AuCl_4^-$) ions into the toluene layer interposed between the aqueous solution and the electrode surface was electrochemically monitored. The $AuCl_4^-$ ions initially could not move through into the toluene layer, showing no reduction wave, but, in the presence of the phase transfer reagent, tetraoctylammonium bromide (TOABr), a cathodic wave at 0.23 V vs. Ag/AgCl was observed, indicating the reduction of the transferred $AuCl_4^-$ ions in the toluene layer. In the presence of dodecanethiol together with TOABr, a self-assembled monolayer was formed over the electro-deposited metallic gold surface. The E-SEM image of the surface indicates the formation of a highly porous metallic gold surface, rather than individual nanoparticles, over the EPG electrode.

열처리 온도에 따른 액상 증착 실리콘 산화막의 특성 변화

  • 박성종;노용한
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2009년도 추계학술대회 논문집
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    • pp.119-119
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    • 2009
  • 선택적 액상증착(Selective Liquid Phase Deposition)을 이용하면, 기존의 열에 의한 손상 없이 섭씨 50도 이하의 낮은 온도로 실리콘 산화물을 증착시킬 수 있다. 형성된 액상증착 실리콘 산화물은 조직이 매우 치밀하며 표면이 매우 고르게 형성됨을 확인하였다. 뿐만 아니라, 액상증착 실리콘 산화물의 누설 전류 또한 매우 낮음을 확인하였다. 또한 형성된 박막에 다양한 온도 하에서 열처리하여 산화막의 특성 변화를 관찰하였으며, 열처리 후에도 박막의 표면 거칠기나 누설전류의 변화가 미미한 것을 확인하였다. 이것은 액상증착 실리콘 산화물이 열처리 유무와 관계없이 집적회로에서 좋은 절연소재로 사용될 수 있는 가능성을 내포한다.

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Characteristics of Sticking Coefficient in BSCCO Thin Film

  • 조춘남;안준호;오재한;최운식;박용필
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2000년도 제2회 학술대회 논문집 일렉트렛트 및 응용기술전문연구회
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    • pp.59-63
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    • 2000
  • BSCCO thin films are fabricated via a co-deposition process by an ion beam sputtering with an ultra-low growth rate, and sticking coefficients of the respective elements are evaluated. The sticking coefficient of Bi element exhibits a characteristic temperature dependence : almost a constant value of 0.49 below $730^{\circ}C$ and decreases linearly with temperature over $730^{\circ}C$ This temperature dependence can be elucidated from the evaporation and sublimation rates of bismuth oxide, $Bi_2O_3$, from the film surface. It is considered that the liquid phase of the bismuth oxide plays an important role in the Bi(2212) phase formation in the co-deposition process.

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Bi 고온 초전도 박막의 부착 공정 (Sticking processing of Bi high $T_c$ superconducting thin films)

  • 천민우;김태곤;박용필
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2005년도 춘계학술대회 논문집
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    • pp.94-97
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    • 2005
  • Bismuth high Tc superconducting thin films are fabricated via a co-deposition process by an ion beam sputtering with an ultra low growth rate, and sticking processing of the respective elements are evaluated. The sticking processing of bismuth element in bismuth high Tc superconducting thin film formation was observed to show a unique temperature dependence; it was almost a constant value of 0.49 below about $730^{\circ}C$ and decreased linearly over about $730^{\circ}C$. This temperature dependence can be elucidated from the evaporation and sublimation rates of bismuth oxide, $Bi_2O_3$, from the film surface. It is considered that the liquid phase of the bismuth oxide plays an important role in the bismuth phase formation in the co-deposition process.

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미립액상 분말에 의한 $YBa_{2}Cu_{3}O_{x}$ 초전도체의 PECVD 증착법 (A study on the $YBa_{2}Cu_{3}O_{x}$ phase deposition by liquid aerosol PECVD)

  • 정용선;오근호
    • 한국결정성장학회지
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    • 제6권2호
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    • pp.229-237
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    • 1996
  • 액상의 미립자를 이용하여 저온 플라즈마 반응로 안에서 $YBa_{2}Cu_{3}O_{x}$ 초전도체상을 MgO 단결정 위에 in-situ 증착하였다. 금속화합물의 용해도, 분해온도와 용매의 증기압이 이공정 방법에서 중용한 인자로 나타났으며, 초전도체상의 증착실험 조건은 산소분압이 0.3에서 2.7 kPa, 증착온도가 $800^{\circ}C$에서 $940^{\circ}C$까지이었다. 초전도체상을 위한 최적의 증착조건은 CuO 상전이선에 근접하게 나타났다.

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The Influence of Bi-Sticking Coefficient in Bi-2212 Thin Film

  • Lee, Hee-Kab;Park, Yong-Pil;Lee, Joon-Ung
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2000년도 춘계학술대회 논문집 전자세라믹스 센서 및 박막재료 반도체재료 일렉트렛트 및 응용기술
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    • pp.152-156
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    • 2000
  • Bi-thin films are fabricated by an ion beam sputtering, and sticking coefficients of the respective elements are evaluated. The sticking coefficient of Bi element exhibits a characteristic temperature dependence : almost a constant value of 0.49 below $730^{\circ}C$ and decreases linearly with temperature over $730^{\circ}C$. This temperature dependence can be elucidated from the evaporation and sublimation rates of bismuth oxide, $Bi_2O_3$, from the film surface. It is considered that the liquid phase of the bismuth oxide plays an important role in the Bi(2212) phase formation in the co-deposition process.

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액체 운반 유기 금속 화학 기상 증착법에 의한 $(Ba,Sr)RuO_3$ 하부전극의 특성 (Characteristics of (Ba,Sr)RuO$_3$Bottom Electrodes by Liquid Delivery Metalorganic Chemical Vapor Deposition)

  • 최은석;윤순길
    • 한국재료학회지
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    • 제11권11호
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    • pp.997-1000
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    • 2001
  • Conducting perovskite oxide, $(Ba,Sr)RuO_3(BSR)$, which has many advantages for $(Ba,Sr)TiO_3(BST)$ due to their similarity in crystal structure, lattice constant and chemical composition, was prepared on n-type Si (100) by liquid delivery metalorganic chemical vapor deposition(LDMOCVD). The deposition characteristics of BSR were controlled by gas-phase mass-transfer in the experiment. The BSR films deposited at 50$0^{\circ}C$ and oxygen flow rate of 100 sccm(standard cc/min) showed an average roughness of 22 $\AA$and resistivity of 810 $\mu$$\Omega$-cm. The roughness of BSR films with oxygen flow rate showed a close relationship with the resistivity of films. BSR (110) peak shifted toward lower Bragg angle with increase of x in the$(Ba_x,Sr_{1-x})TiO_3$. The resistivity of BSR films increased from 810 to 924 $\mu$$\Omega$-cm with increase of Ba content(x).

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알루미늄 플랩 밸브와 상변화 구동 마이크로 펌프의 제작 (The fabrication of a micro pump with a flap valve and a phase change actuator)

  • 이상우;심우영;양상식
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1998년도 추계학술대회 논문집 학회본부 C
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    • pp.1023-1025
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    • 1998
  • This paper presents the fabrication of a micro pump consisting of a pair of Al f1ap wave and a phase change actuator. The phase change actuator is composed of a heater, a silicone rubber diaphragm and a working liquid chamber. The diaphragm is actuated by the evaporation and the condensation of the working liquid. The actuator pumps fluid through the valves. The micro pump is fabricated by the anisotropic etch, the boron deposition and the metal evaporation. The forward and the backward flow characteristics of the f1ap valves were obtained. Also, the flow rate of the micro pump has been measured. When the square wave input of 12 V, 60% duty ratio and 0.2 Hz is applied, the average flow rate is $0.15{\mu}{\ell}/sec$ for zero pressure difference.

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흡기매니폴드내 벽면으로의 연료수송 (Mechanism of a Spray Transport on Intake Manifold Walls)

  • 이용길;전흥신;박경석
    • 한국분무공학회지
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    • 제1권1호
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    • pp.28-34
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    • 1996
  • Study on the mechanism of droplet transport and the droplet eddy diffusivity in the intake manifold of internal conbustion engine with carburetor has been carried out in this paper The theory and experiments were studied and performed respectively, to elucidate the mechanism and to measure typical rates of deposition, on the walls of a straight type intake manifold, of water droplets suspended in a turbulent air streams. Accordingly, the results are that Mechanism of a spray transport to the walls is caused by the fluctuation component of radial velocity. Deposition rate of a spray on the walls is mainly dependent upon air velocity and mean diameter of spray, and Droplet eddy diffusivity in the intake manifold is around $80\sim105cm^2/sec$.

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Direct Liquid Injection Metal Organic Chemical Vapor Deposition of $HfO_2$ Thin Films Using $Hf(dimethylaminoethoxide)_4$.

  • 송문균;강상우;이시우
    • 한국반도체및디스플레이장비학회:학술대회논문집
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    • 한국반도체및디스플레이장비학회 2003년도 추계학술대회 발표 논문집
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    • pp.45-49
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    • 2003
  • 본 논문에서는 gate 산화막을 위한 Hf oxide 박막을 $Hf(dmae)_4$ (dmae=dimethylaminoethoxide) 전구체로 Direct Liquid Injection Metal Organic Chemical Vapor Deposition (DLI-MOCVD)방법을 이용하여 p-type Si(100) 기판 위에 증착하였다. 이 전구체를 이용하여 $150^{\circ}C$의 낮은 증착 온도에서도 낮은 carbon 농도와 roughness를 가지는 양질의 박막을 증착할 수 있었다. 증착된 박막은 비정질 구조를 나타내었지만 annealing 온도를 증가시킴에 따라서 결정성(monoclinic phase)을 나타내었다. $500{\AA}$으로 증착한 박막을 C-V 와 I-V curve를 통하여 전기적 특성을 평가하였다. 열처리 온도가 증가함에 따라 유효유전상수(k)는 증가하지만 열처리 온도가 $900^{\circ}C$ 이상이 되면 계면층의 형성에 의해 유효유전상수는 감소하게 되고 이에 따라 누설 전류도 감소하게 된다. 산소분위기 $800^{\circ}C$에서 annealing한 $HfO_2$ 박막의 유전상수는 20.1이고, 누설 전류 밀도는 SV에서 $2.2\times10^{-6}A/\textrm{cm}^2$ 로 좋은 전기적 특성을 가진다.

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