• Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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• 2003.02a
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• pp.178-181
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• 2003

Intermediate cooling for current lead is used of thermal link in conduction cooling and cooled of itself in liquid cooling because it is put in liquid. If a existing formula for cooling load and optimal diameter-length of current lead is applied, it generate some more cooling load. Therefore, variation of thermal link height and holding depth in liquid is considered. This result is used of reducing cooling load of current lead occupying most of superconducting system load and applying liquid/conduction cooling systems.

• Journal of the Korean Society for Precision Engineering
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• v.24 no.12
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• pp.95-103
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• 2007

This paper presents a liquid cooling concept for heat rejection of high power electronic devices existing in notebook computers etc. The design, fabrication, and performance of the planar ECF pump and farced-liquid cooling system are summarized. The electro-conjugate fluid (ECF) is a kind of dielectric and functional fluids, which generates jet flows (ECF-jets) by applying static electric field through a pair of rod-like electrodes. The ECF-jet directly acts on the working fluid, so the proposed planar ECF pump needs no moving part, produces no vibration and noise. The planar ECF pump, consists of a pump housing and electrode substrate, achieves maximum flow rate and output pressure of $5.5\;cm^3/s$ and 7.2 kPa, respectively, at an applied voltage of 2.0 kV. The farced-liquid cooling system, constructed with the planar ECF pump, liquid-cooled heat sink and thermal test chip, removes input power up to 80 W keeping the chip surface temperature below $70\;^{\circ}C$. The experimental results demonstrate that the feasibility of forced-liquid cooling system using ECF is confirmed as an advanced cooling solution on the next-generation high power electronic devices.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.3
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• pp.1-6
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• 2013

3D integrated circuit(IC) technology with TSV(through Si via) liquid cooling system is discussed. As a device scales down, both interconnect and packaging technologies are not fast enough to follow transistor's technology. 3D IC technology is considered as one of key technologies to resolve a device scaling issue between transistor and packaging. However, despite of many advantages, 3D IC technology suffers from power delivery, thermal management, manufacturing yield, and device test. Especially for high density and high performance devices, power density increases significantly and it results in a major thermal problem in stacked ICs. In this paper, the recent studies of TSV liquid cooling system has been reviewed as one of device cooling methods for the next generation thermal management.

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.2206-2210
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• 2007

As a power transmission line supplying power to a densely populated city, the high temperature superconducting (HTS) cable is expected to one of the most effective cables with a compact size because of its high current density. The verification of HTS power cable system have been progressed by KEPRI. A cooling system for a 3-phase 100m HTS power cable with 22.9kV/1.25kA was installed and tested at KEPCO's Gochang power testing center in Korea. The system consists of a liquid nitrogen decompression cooling system with a cooling capacity of 3kW and a closed circulation system of subcooled liquid nitrogen. Several performance tests of the cable system with respect to the cooling such as cooling capacity, heat load and temperature stability, were performed at several temperatures. Thermal cycle test, cool-down to liquid nitrogen temperature and warm-up to room temperature, was also performed to investigate thermal cycle influences. The outline of the installed cooling system and performance test results are presented in this paper.

• Progress in Superconductivity and Cryogenics
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• v.19 no.2
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• pp.1-8
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• 2017

Recently, Research and development activity of HTS (High Temperature Superconducting) power application is very progressive worldwide. Especially, HTS cable system and HTSFCL (HTS Fault current limiter) system are proceeding to practical stages. In such system and equipment, cryogenic cooling system, which makes HTS equipment cooled lower than critical temperature, is one of crucial components. In this article, cryogenic cooling system for HTS application, mainly cable, is reviewed. Cryogenic cooling system can be categorized into conduction cooling system and immersion cooling system. In practical HTS power application area, immersion cooling system with sub-cooled liquid nitrogen is preferred. The immersion cooling system is besides grouped into open cycle system and closed cycle system. Turbo-Brayton refrigerator is a key component for closed cycle system. Those two cooling systems are focused in this article. And, each design and component of the cooling system is explained.

• Membrane and Water Treatment
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• v.8 no.4
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• pp.355-367
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• 2017

In India, the current operation of condenser cooling system & effluent disposal system in existing power plants aims to reduce drawal of seawater and to achieve Zero Liquid Discharge to meet the demands of statutory requirements, water scarcity and ecological system. Particularly in the Steam-Electric power plants, condenser cooling system adopts Once through cooling (OTC) system which requires more drawal of seawater and effluent disposal system adopts sea outfall system which discharges hot water into sea. This paper presents an overview of closed-loop technology for condenser cooling system and to achieve Zero Liquid Discharge plant in Steam-Electric power plants making it lesser drawal of seawater and complete elimination of hot water discharges into sea. The closed-loop technology for condenser cooling system reduces the drawal of seawater by 92% and Zero Liquid Discharge plant eliminates the hot water discharges into sea by 100%. Further, the proposed modification generates revenue out of selling potable water and ZLD free flowing solids at INR 81,97,20,000 per annum (considering INR 60/Cu.m, 330 days/year and 90% availability) and INR 23,760 per annum (considering INR 100/Ton, 330 days/year and 90% availability) respectively. This proposed modification costs INR 870,00,00,000 with payback period of less than 11 years. The conventional technology can be replaced with this proposed technique in the existing and upcoming power plants.

• Transactions of the Korean Society of Automotive Engineers
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• v.12 no.1
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• pp.1-9
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• 2004

The general method which changes sub-cooling of refrigerant is to control the expansion valve in the state of mixing with liquid and gas phase. In this study, the performance of vehicle air conditioning system is to control either changing the expansion valve or adding the sub condenser. Therefore, this research finally is tested in case of the fourth test procedure, the second test was suitable for a valve opening area due to adjusting valve slope in comparison with the other test. The other test except for the second test happened to do liquid back due to the excessively liquified refrigerant into the system. In conclusion, the second test was appeared not to be influenced upon liquid back, and it is to expect positive performance by controlling an expansion valve. Therefore, it will be also useful to research for an increase of compressor efficiency Performance improvement of an air conditioner is to reinforce the suction performance of the evaporator and increase the sub-cooling, which make use of the sub-cooling system.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.19 no.10
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• pp.710-717
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• 2007

Electric and telecommunication industries are constantly striving towards miniaturization of electronic devices. Miniaturization of chips creates extra space on PCBs that can be populated with additional components, which decreases the heat transfer surface area and generates very high heat flux. Even though an air-cooling technology for telecommunication equipment has been developed in accordance with rapid growth in electrical industry, it is confronted with the limitation of cooling capacity due to the rapid increase of heat density. In this study, liquid-cooling heat exchangers with MPCM slurries were designed and tested by varying geometry and operating conditions. The liquid-cooling heat exchangers with 4-paths showed higher cooling performance than the others. The cooling performance of liquid cooling heat exchanger with MPCM slurries was more enhanced than that of the air cooling system. It's performance was also slightly superior to that of the water cooling system at the inlet temperature of $19^{\circ}C$.

• Progress in Superconductivity and Cryogenics
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• v.20 no.2
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• pp.34-39
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• 2018

A cryogenic cooling system is designed for a 154 kV/ 2 kA three-phase hybrid type superconducting fault current limiter (SFCL). The superconducting modules of the SFCL have the operating condition of 71 K at 500 kPa. The total heat load of the SFCL including the cooling system is estimated at 9.6 kW. The cooling system of the closed loop is configured to meet the operating condition, depending on cooling methods of forced flow cooling and re-liquefaction cooling. The cooling system is composed of three cryostats with superconducting modules, cryocoolers, liquid nitrogen circulation pumps, a subcooler and a pressure builder. The basic cooling concept is to circulate liquid nitrogen between three SFCL cryostats and the cryocooler, while maintaining the operating pressure. The design criterion for the cooling system is based on the operation results of the cooling system for a 154 kV/2 kA single-phase hybrid SFCL. The specifications of system components including the piping system are determined according to the design criterion.

• 한국전산유체공학회:학술대회논문집
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• 2002.10a
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• pp.1-7
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• 2002

Liquid rocket regenerative cooling design procedure is introduced with the example of the 250 kg thrust, LOx/kerocine experimental test rocket system. The presentation may be useful for numerical analysists who have limited experiences with real rocket system.