• 설비공학논문집
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• 제19권10호
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• pp.710-717
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• 2007

Electric and telecommunication industries are constantly striving towards miniaturization of electronic devices. Miniaturization of chips creates extra space on PCBs that can be populated with additional components, which decreases the heat transfer surface area and generates very high heat flux. Even though an air-cooling technology for telecommunication equipment has been developed in accordance with rapid growth in electrical industry, it is confronted with the limitation of cooling capacity due to the rapid increase of heat density. In this study, liquid-cooling heat exchangers with MPCM slurries were designed and tested by varying geometry and operating conditions. The liquid-cooling heat exchangers with 4-paths showed higher cooling performance than the others. The cooling performance of liquid cooling heat exchanger with MPCM slurries was more enhanced than that of the air cooling system. It's performance was also slightly superior to that of the water cooling system at the inlet temperature of $19^{\circ}C$.

• 한국초전도ㆍ저온공학회논문지
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• 제9권3호
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• pp.72-82
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• 2007

This paper relates to reducing the temperature of a cryogenic liquid by contacting it with gas bubbles, which can be characterized by diffusion-driven evaporative cooling, The characteristic of diffusion-driven evaporative cooling is thoroughly examined by theoretical. analytical and experimental methods specifically for the case of helium injection into liquid oxygen. The results reveal that if the gaseous oxygen partial pressure in helium bubbles is lower than the liquid oxygen vapor pressure, cooling occurs autonomously due to diffusion mass transfer. The method of lowering the injected helium temperature turns out to be very effective for cooling purpose.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회B
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• pp.2206-2210
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• 2007

As a power transmission line supplying power to a densely populated city, the high temperature superconducting (HTS) cable is expected to one of the most effective cables with a compact size because of its high current density. The verification of HTS power cable system have been progressed by KEPRI. A cooling system for a 3-phase 100m HTS power cable with 22.9kV/1.25kA was installed and tested at KEPCO's Gochang power testing center in Korea. The system consists of a liquid nitrogen decompression cooling system with a cooling capacity of 3kW and a closed circulation system of subcooled liquid nitrogen. Several performance tests of the cable system with respect to the cooling such as cooling capacity, heat load and temperature stability, were performed at several temperatures. Thermal cycle test, cool-down to liquid nitrogen temperature and warm-up to room temperature, was also performed to investigate thermal cycle influences. The outline of the installed cooling system and performance test results are presented in this paper.

• JSTS:Journal of Semiconductor Technology and Science
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• 제12권3호
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• pp.297-312
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• 2012

For future multi-core processors, 3D integration is regarded as one of the most promising techniques since it improves performance and reduces power consumption by decreasing global wire length. However, 3D integration causes serious thermal problems since the closer proximity of heat generating dies makes existing thermal hotspots more severe. Conventional air cooling schemes are not enough for 3D multi-core processors due to the limit of the heat dissipation capability. Without more efficient cooling methods such as liquid cooling, the performance of 3D multi-core processors should be degraded by dynamic thermal management. In this paper, we examine the architectural impact of cooling methods on the 3D multi-core processor to find potential benefits of liquid cooling. We first investigate the thermal behavior and compare the performance of two different cooling schemes. We also evaluate the leakage power consumption and lifetime reliability depending on the temperature in the 3D multi-core processor.

• 한국초전도학회:학술대회논문집
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• 한국초전도학회 1999년도 High Temperature Superconductivity Vol.IX
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• pp.7-11
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• 1999

The recent progress in new cooling techniques of the high Tc superconductor(HTS) systems is reported and discussed with some practical examples. At the beginning stage of the HTS development in research laboratories, liquid nitrogen(LN$_2$) is the standard medium for an effective cooling. The success of HTS in many different application areas, however, has required a variety of need in the cooling temperature and the cooling capacity with specific design restrictions. While the utilization of alternative liquid cryogens such as liquid neon (LNe) or liquid hydrogen (LH$_2$) has been tired in some of them, even solid cryogens such as solid nitrogen (SN$_2$) or solid hydrogen (SH$_2$) may be another option in special applications. The gaseous helium cooled by a cryogenic refrigerator has also been a good candidate in many cases. One of the best cooling methods for the HTS is the direct conduction-cooling by a closed-cycle refrigerator with no cryogen at all. The refrigeration may be based on Joul-Thomson, Brayton, Stirling, Gifford-McMahon, or pulse tube cycles. The pros and cons of the newly proposed cooling methods are described and some significant design issues are presented.

• 대한기계학회논문집
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• 제19권4호
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• pp.1095-1101
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• 1995

Numerical analysis of vertical solidification process allowing solid-liquid density change is performed by a hybrid method between a winite volume method (FVM) and a finite element method (FEM). The investigation focuses on the influence of solid-liquid density change and cooling rates on the motion of solid-liquid interface, solidified mass fraction, temperatures and thermal stresses in the solid region. Due to the density change of pure aluminium, solid-liquid interface moves more slowly but the solidified mass fraction is larger. The cooling rate of the wall is shown to have a significant influence on the phase change heat transfer and thermal stresses, while the density change has a small influence on the motion of the interface, solidified mass fraction, temperature distributions and thermal stresses. As the cooling rate increases, the thermal stresses become higher at the early stage of a solidification process, but it has small influence on the final stresses as the steady state is reached.

• 한국자동차공학회논문집
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• 제12권1호
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• pp.1-9
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• 2004

The general method which changes sub-cooling of refrigerant is to control the expansion valve in the state of mixing with liquid and gas phase. In this study, the performance of vehicle air conditioning system is to control either changing the expansion valve or adding the sub condenser. Therefore, this research finally is tested in case of the fourth test procedure, the second test was suitable for a valve opening area due to adjusting valve slope in comparison with the other test. The other test except for the second test happened to do liquid back due to the excessively liquified refrigerant into the system. In conclusion, the second test was appeared not to be influenced upon liquid back, and it is to expect positive performance by controlling an expansion valve. Therefore, it will be also useful to research for an increase of compressor efficiency Performance improvement of an air conditioner is to reinforce the suction performance of the evaporator and increase the sub-cooling, which make use of the sub-cooling system.

• 한국추진공학회:학술대회논문집
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• 한국추진공학회 2005년도 제24회 춘계학술대회논문집
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• pp.179-182
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• 2005

액체추진기관을 사용하는 발사체의 극저온 추진제 온도 conditioning 방안의 일환으로 헬륨분사에 의한 액체산소 과냉각 시험을 수행하였다. 동일한 질량의 액체산소에 대하여 서로 다른 유량의 헬륨을 분사하고 냉각 특성을 비교하였다. 시험조건 하에서 약 $5\sim6^{\circ}C$의 냉각 효과를 얻을 수 있었으며 외부 단열상태에서 특정 온도까지 냉각되는 시간은 헬륨 분사량에 반비례함을 알 수 있었다.

• 한국분무공학회지
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• 제19권1호
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• pp.19-24
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• 2014

In this study, the cooling performance of a liquid CPU cooler using the water/propylene glycol(PG)-based $Al_2O_3$ nanofluids is experimentally investigated. Water/PG-based $Al_2O_3$ nanofluids are manufactured by two-step method with ultrasonic energy for 10 hours. The volume fractions of the nanofluids are 0.25% and 0.35%. Thermal conductivity and viscosity of the nanofluids are measured to theoretically predict the thermal performance of the liquid CPU cooler using performance factor. Performance factor results indicate that the cooling performance of the liquid CPU cooler can be improved using the manufactured nanofluids. To evaluate the cooling performance of the liquid CPU cooler experimentally, temperature differences between ambient air and heater are measured for base fluid and nanofluids respectively. Based on the results, it is shown that performance of the liquid CPU cooler using $Al_2O_3$ nanofluids is improved maximum up to 8.6% at 0.25 Vol.%.

• 한국추진공학회지
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• 제16권6호
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• pp.16-22
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• 2012

액체로켓 추력실의 성능 예측 및 초음속 노즐부 형상 설계에 활용 중인 in-house 해석 도구를 이용하여 재생냉각 연소기에 대한 성능/냉각 통합해석을 수행하였으며, 막냉각 유량 및 외곽 분사기열의 혼합비 변화에 따른 연소 성능과 냉각 성능 간 trade-off 경향을 고찰하였다. 향후 막냉각 및 주요 설계 인자의 최적화 도구로 활용될 수 있도록 개발 연소기에 대한 시험 결과와의 비교 등을 통하여 수치해석 도구를 검증/개선해나갈 계획이다.