• Journal of the Korean Institute of Telematics and Electronics A
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• v.30A no.2
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• pp.46-52
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• 1993

The estimation of yield for semiconductor devices requires not only establishment of critical area but also a new parameter of process defect density that contains inspection mean defect density related cleanness of manufacure process line, minimum feature size and the total number of mask process. We estimate the repaired yield of memory devide, leads the semiconductor technique, repaired by redundancy scheme in relation with defect density distribution function, and we confirm the repaired yield for different devices as this model. This shows the possibility of the yield estimation as statistical analysis for the condition of device related cleanness of manufacture process line, design and manufacture process.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.7
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• pp.1280-1287
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• 2002

The old technique of sandblasting which has been used for decoration of glass surface has recently been developed into a powder blasting technique for brittle materials such as glass, silicon and ceramics, capable of producing micro structures larger than $100{\mu}$ m. This paper describes the performance of powder blasting technique in micro-line grooving of glass and the effect of the number of nozzle scanning on the depth and width of line groove. Experimental results showed that increasing the no. of nozzle scanning resulted in the increase of depth and width in grooves. Increase of width which may cause several problems in the precision machining results from wear of mask film. Therefore, well-controlled masking process is the most important factor for micro machining of glass with accuracy.

• Journal of the Optical Society of Korea
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• v.18 no.5
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• pp.611-615
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• 2014

We report high-speed pulse train generation from a relatively low-speed 10-GHz mode-locked laser by means of line-by-line spectral coding. To increase the pulse repetition rate multiplication (RRM) factor, we combine coding schemes for both spectral intensity and phase by placing a simple mask at the coder focal plane. The resulting RRM factor, determined by multiplying the RRM factors of the individual coding schemes, rises as high as 16. To verify the generated pulses, the optical spectra and autocorrelation traces are examined.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.1472-1475
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• 2009

The microfluidics channel were fabricated using thermal roll-imprinting process on plastic substrates. As rollimprinting surface is heated directly at $100^{\circ}C$ and printing process proceed 380/400 kgf pressure, we fabricated microfluidic patterns separated line of $40.04{\mu}m$, serpentine line of $113.89{\mu}m$ and depth of imprint pattern is $15.35{\mu}m$, it means to get fine pattern has more than 70% imprint rate in designed mask.

• Journal of Sensor Science and Technology
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• v.14 no.5
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• pp.357-361
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• 2005

Low-stress silicon nitride (LSN) thin films with embedded metal line have been developed as free standing structures to keep microspheres in proper locations and localized heat source for application to a chip-based sensor array for the simultaneous and near-real-time detection of multiple analytes in solution. The LSN film has been utilized as a structural material as well as a hard mask layer for wet anisotropic etching of silicon. The LSN was deposited by LPCVD (Low Pressure Chemical Vapor Deposition) process by varing the ratio of source gas flows. The residual stress of the LSN film was measured by laser curvature method. The residual stress of the LSN film is 6 times lower than that of the stoichiometric silicon nitride film. The test results showed that not only the LSN film but also the stack of LSN layers with embedded metal line could stand without notable deflection.

• The Journal of Korea Robotics Society
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• v.14 no.1
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• pp.1-7
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• 2019

Recently, smart factories have attracted much attention as a result of the 4th Industrial Revolution. Existing factory automation technologies are generally designed for simple repetition without using vision sensors. Even small object assemblies are still dependent on manual work. To satisfy the needs for replacing the existing system with new technology such as bin picking and visual servoing, precision and real-time application should be core. Therefore in our work we focused on the core elements by using deep learning algorithm to detect and classify the target object for real-time and analyzing the object features. We chose YOLO CNN which is capable of real-time working and combining the two tasks as mentioned above though there are lots of good deep learning algorithms such as Mask R-CNN and Fast R-CNN. Then through the line and inside features extracted from target object, we can obtain final outline and estimate object posture.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.162-162
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• 2014

최근 들어 wearable computing에 대한 수요가 증가하면서 flexible device에 대한 연구가 활발히 진행되고 있다. 하지만, flexible device를 구현하기 위해서는 기판의 damage를 줄이기 위한 저온공정, device life-time 향상을 위한 passivation, 와이어 본딩 등 다양한 문제들이 해결 되어야 한다. 이러한 문제들 중, polymer 기판과 금속간의 접착력을 향상시키기 위해서 많은 연구자들은 기판의 표면에 adhesive layer를 도포하거나 금속잉크의 solvent를 변화시키는 등의 연구를 진행해왔다. 종래의 연구는 기존 device를 대체 할 수 있을 정도의 생산성과 polymer 기판에 대한 열 적인 손상 이 문제가 되었다. 종래의 문제를 해결하기 위하여 저온공정, in-line system이 가능한 준 준 대기압 플라즈마를 사용하였다. 본 연구에서는 금속잉크를 Ink-jet으로 jetting하여 와이어 본딩 하는 과정에서 전도성 ink의 선폭을 유지시키고 접착력을 향상하기 위하여 준 대기압 플라즈마 공정을 이용하여 이러한 문제점을 해결하고자 하였다. Polymer 기판 표면에 roughness를 만들기 위해 대략 수백 nm 크기를 갖는 graphene flake를 spray coating하여 마스크로 사용하고 준 대기압 플라즈마를 이용하여 표면을 식각 함으로써 roughness를 형성시켰다. 준 대기압 플라즈마를 발생시키기 위해 double discharge system에서 6 slm/1.5 slm (He/O2) gas composition을 하부 전극에 흘려보내고 60 kHz, 5 kV 파워를 인가하였다. 동시에 상부 전극에는 30 kHz, 5 kV 파워를 인가하여 110초 동안 표면 식각 공정을 진행하였다. Graphene flake mask가 coating되어 있는 유연기판을 산소 플라즈마 처리 한 후 물에 3초 동안 세척하여 표면에 남아있는 graphene flake를 제거하고 6 slm/0.3 slm (He/SF6)의 유량으로 주파수와 파워 모두 동일 조건으로 110초 동안 표면 처리를 하였다. Figure 1은 표면 개질 과정과 graphene flake를 mask로 사용하여 얻은 roughness 결과를 SEM을 이용하여 관찰한 결과이다. 이와 같이 실험한 결과 ink와 기판간의 접촉면적을 늘려주고 접촉 각을 조절하여 Wenzel model 을 형성 할 수 있는 표면 roughness를 생성하였고 표면의 화학적 결합을 C-F group으로 치환하여 표면의 물과 접촉각 이 $47^{\circ}$에서 $130^{\circ}$로 증가하는 것을 확인하였다.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.6
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• pp.483-489
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• 2014

In this study, experiments were conducted for micro pattern printing to combine solution atomization process and stencil printing based on electrospray deposition. The stencil mask fabricated by etching the photosensitive glass placed below 0.3 mm distance to substrate has 100 um line width. The process parameters of electrospray deposition system for the atomization of the solution are applied voltage and supply flow rate of the solution. Meniscus angle of cone-jet was optimized by varying the supply flow rate from 0.3 ml/hr to 0.7 ml/hr. Voltage condition was verified having symmetric cone-jet angle and no pulsation at 8.5 kV applied voltage. In addition, a number of micro patterns are printed using a single 1 step process by solution atomization process. Variable line width of approximate 100 um was confirmed by changing conditions of solution atomization regardless of the pattern size of stencil mask.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.50 no.3
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• pp.157-164
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• 2022

In this paper, we describe how to implement the mountainous terrain, radar, and air defense network for UAV path planning in a 3-D environment, and perform path planning and re-planning using the PRM algorithm, a sampling-based path planning algorithm. In the case of the original PRM algorithm, the calculation to check whether there is an obstacle between the nodes is performed 1:1 between nodes and is performed continuously, so the amount of calculation is greatly affected by the number of nodes or the linked distance between nodes. To improve this part, the proposed LineGridMask method simplifies the method of checking whether obstacles exist, and reduces the calculation time of the path planning through parallelization. Finally, comparing performance with existing PRM algorithms confirmed that computational time was reduced by up to 88% in path planning and up to 94% in re-planning.

• Proceedings of KOSOMES biannual meeting
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• 2005.11a
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• pp.203-208
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• 2005

The CGO (Chip on Glass) to be measured a few micro unit is captured by line scan camera for the accuracy of chip inspection. But it is very sensitive to scan speed and lighting conditions. In this paper, we propose the methods to increase the accuracy of faulty detection by image subtraction. Image subtraction is detected faultiness by subtracting the image of a ' perfect ' COG from trot of the sample under tests. For image subtraction to be successful, the two images must be pre챠sely registered The two images is registered by the area segmentation pattern matching, and the result image get by operating the gradient mask image and the image to practice subtraction. A series of experimentation showed that the proposed algorithm shows substantial improvement over the other image subtraction methods.