• 제목/요약/키워드: Line laser

검색결과 902건 처리시간 0.029초

레이저 용접 테일러드 블랭크의 성형특성 (Forming Characteristics of Laser Welded Tailored Blanks)

  • 박기철;한수식;김광선;권오준
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 1998년도 제2회 박판성형심포지엄 논문집 박판성형기술의 현재와 미래
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    • pp.121-130
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    • 1998
  • In order to analyze the forming characteristics of laser welded tailored blanks, laser welded blanks of different thickness and strength combinations were prepared and tensile, stretching, stretch flanging and deep drawing tests were done. The tensile elongation perpendicular to the weld line, stretching and stretch flanging formability decreased with increasing the deformation restraining force (strength ${\times}$ thickness) ratio between two welded sheets. The tensile elongation along weld line reached a value above 90% of the single sheet's elongation. Stretch flanging formability was reduced to approximately 10% of the single sheet value when the deformation restraining force ratio between two welded sheets was increased to two. Weld line movement of deep drawing test specimens was also affected by the strength ratio of the combined sheets, the weld line location and forming conditions. In all forming modes of tailored blanks, excessive weld line movement resulted from strain concentrations at the weaker sheet and resulted in fracture of the weaker side.

레이저 유리 접합 공정의 유한요소해석 (Finite Element Analysis of Laser Class Bonding Process)

  • 홍석관;강정진;변철웅
    • 한국레이저가공학회지
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    • 제11권3호
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    • pp.10-15
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    • 2008
  • This study is aimed to analyse the laser glass bonding process numerically. Due to the viscoelastic behaviour of glass, the extremely large deformation of the frit seal is resulted continuously over the transition temperature, so that the thermal boundary condition be changed in the entire calculation process. The commercial FEM algorithm is restrictively able to remesh the large geometrical boundary shape and to adapt the boundary conditions simultaneously. According to our manual adaptation of increasing the laser line intensity to 700 mW/mm, it is possible to estimate the thermal glass bonding process under the fracture stress in principle. But it should be studied further in the case of high laser line intensity.

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DP980강판의 레이저 조사에 따른 굽힘 변형특성 연구 (Bending Characteristics of DP980 Steel Sheets by the Laser Irradiation)

  • 송정한;장야징;이종섭;박성준;최두순;이근안
    • 소성∙가공
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    • 제21권6호
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    • pp.378-383
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    • 2012
  • Laser forming is an advanced process in sheet metal forming in which a laser heat source is used to shape the metal sheet. This is a new manufacturing technique that forms the metal sheet only by a thermal stress. Analyses of the temperature and stress fields are very important to identify the deformation mechanism in laser forming. In this paper, temperature distributions and deformation behaviors of DP980 steel sheets are investigated numerically and experimentally. FE simulations are first conducted to evaluate the response of a square sheet in bending. The effects of process parameters such as laser power and scanning speed are then analyzed numerically and experimentally. It is observed that experimental and numerical results are in good agreement. These results provide a relationship between the line energy and the angles for laser bending of DP980 steel sheets.

AIN 기판의 수동 소자 특성 (The Characteristic of Passive Elements on Aluminum Nitride Substrate)

  • 김승용;육종민;남충모
    • 한국전자파학회논문지
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    • 제19권2호
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    • pp.257-262
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    • 2008
  • 본 논문에서는 열전도도가 우수한 AIN 기판에 $CO_2$ Laser 장비 를 이용하여 Thru-hole과 scribing line을 형성하기 위해 $CO_2$ laser의 파라미터(촛점 거리, 공기량, 레이저 빔 시간, 펄스 개수)를 실험하고, 자체 정렬 마스킹 기법을 이용한 5 um 두께의 Cu 도금으로 AIN 기판에 전송 선로와 나선형 평면 인덕터를 제작하였다. AIN 기판에서의 마이크로스트립 라인의 전송 손실은 10 GHz에서 0.1 dB/mm, 6 nH 나선형 평면 인덕터는 1 GHz에서 56의 품질 계수를 얻었고, 이를 통해 열전도도가 우수한 AIN 기판의 고전력 RF 응용이 가능할 것으로 기대한다.

Diagnostics of Magnetron Sputtering Plasmas: Distributions of Density and Velocity of Sputtered Metal Atoms

  • Sasaki, Koichi
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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    • pp.98-99
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    • 2012
  • Deposition of thin films using magnetron sputtering plasmas is a well-developed, classical technology. However, detailed investigations using advanced diagnostics are insufficient in magnetron sputtering, in comparison with plasma-aided dry etching and plasma-enhanced chemical vapor deposition. In this talk, we will show examples of diagnostic works on magnetron sputtering employing metal targets. Diagnostic methods which have fine spatial resolutions are suitable for magnetron sputtering plasmas since they have significant spatial distributions. We are using two-dimensional laser-induced fluorescence spectroscopy, in which the plasma space is illuminated by a tunable laser beam with a planer shape. A charge-coupled device camera with a gated image intensifier is used for taking the picture of the image of laser-induced fluorescence formed on the planer laser beam. The picture of laser-induced fluorescence directly represents the two-dimensional distribution of the atom density probed by the tunable laser beam, when an intense laser with a relatively wide line-width is used. When a weak laser beam with a relatively narrow linewidth is used, the laser-induced fluorescence represents the density distribution of atoms which feel the laser wavelength to be resonant via the Doppler shift corresponding to their velocities. In this case, we can obtain the velocity distribution function of atoms by scanning the wavelength of the laser beam around the line center.

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레이저를 이용한 웨이퍼 다이싱 특성 (Characteristics of Laser Wafer Dicing)

  • 이용현;최경진;유승열
    • 반도체디스플레이기술학회지
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    • 제5권3호
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    • pp.5-10
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    • 2006
  • This paper investigates cutting qualities after laser dicing and predicts the problems that can be generated by laser dicing. And through 3 point bending test, die strength is measured and the die strength after laser dicing is compared with the die strength after mechanical sawing. Laser dicing is chiefly considered as an alternative to overcome the defects of mechanical sawing such as chipping on the surface and crack on the back side. Laser micromachining is based on the thermal ablation and evaporation mechanism. As a result of laser dicing experiments, debris on the surface of wafer is observed. To eliminate the debris and protect the surface, an experiment is done using a water soluble coating material and ultrasonic. The consequence is that most of debris is removed. But there are some residues around the cutting line. Unlike mechanical sawing, chipping on the surface and crack on the back side is not observed. The cross section of cutting line by laser dicing is rough as compared with that by mechanical sawing. But micro crack can not be seen. Micro crack reduces die strength. To measure this, 3 point bending test is done. The die strength after laser dicing decreases to a half of the die strength after mechanical sawing. This means that die cracking during package assembly can occur.

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레이저 절단에서 광소자를 이용한 가공공정 모니터링 (Process Monitoring in Laser Beam Cutting by Photo Diode)

  • 장욱진;김봉채;김재도
    • 한국정밀공학회지
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    • 제13권12호
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    • pp.30-37
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    • 1996
  • On-line process control equipment for CO$_{2}$ laser cutting is not available for industrial applications. The major part of the industrial laser cutting machines are adjusted off-line by highly educated engineers. The quality inspection of the sample is visual and referred to different quality scales. Due to the lack of automation the potential laser users hesitate to implement the cutting method. The first step toward an automation of the process is the development of a process monitoring system and the research is cincentrated on the area of on-line quality monitoring during CO$_{2}$ laser cutting. The method is based on the detection of the emitted light from the cutting front by photo diode. The developed monitoring system consists of the OP Amplifier, A/D convertor, power supply and PC. The signal from the photo diode has been undertaken from Fourier analysis and statistical analysis with real time. The photograph of striation pattern was taken by metallurgical microscope. As a result, it is possible to predict the striation pattern according to the beam traveling speed.

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그라비아 인쇄를 위한 Laser Stream Patterning 개선 (Laser Stream Patterning Improvement for Gravure Printing)

  • 안태용;김한규;이동훈
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2001년도 추계학술대회 논문집
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    • pp.186-189
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    • 2001
  • The main method in micro-etching process, used in manufacturing semiconductors, electronic components, circuits, is Photo Masking method that exposes and develops on the photo-sensitivity solutions or films. This method enables one to process highly precisely, $\pm$0.03 mm in end line location area. But this has limits in a high speed / wide width process, difficulties in endless masking, and the problem of high price. We have developed the direct masking method to make use of Gravure printing, widely used in grocery packing sheet printing. We made cylinder tools to influence the masking quality by laser stream process. We have confirmed that the end line location accuracy in the line width of the product is improved from 0.12 mm to $\pm$0.07 mm level, after etching process.

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레이저 용접 테일러드 블랭크의 기본 성형특성 I : 인장변형 특성 (Forming Characteristics of Laser Welded Tailored Blanks I : Tensile Deformation Characteristics.)

  • 박기철;한수식;김광선;권오준
    • 소성∙가공
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    • 제7권1호
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    • pp.23-35
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    • 1998
  • In order to analyze the tensile deformation characteristics of laser welded tailored blanks. laser welded blanks of different thikness and strength combinations were prepared and tensile tests were done. The tensile elongation along the direction perpendicular to weld line of laser welded blanks was reduced as increasing the deformation restraining force (strength X thicknes) ratio between two welded sheets and fracture occurred at weaker side of base sheets if void ration of welded sheets and fracture occurred at weaker side of base sheets if void ratio of weld section was less than 45% The tensile elongation along weld line reached above 90% of the elongation of base material if welding was done perfectly. Total elongation along the direction perpendicular to weld line was able to be predicted by force equilibrium and power law behavior of base sheets and it was related with the deformation of stronger sheet and formability of weaker side.

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광학 선형 패터네이터를 이용한 고압 환경 하에서의 분무 측정 (Spray Measurement Using Optical Line Patternator at High Ambient Pressure)

  • 고현석;신상희;윤영빈
    • 한국가시화정보학회지
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    • 제3권1호
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    • pp.63-70
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    • 2005
  • Optical Line Patternator(OLP) has been applied to get a distribution of the spray at high ambient pressure. OLP is a combined technique of extinction measurement and image processing. The attenuated intensity of laser beam after traversing spray region was measured by using a photo-detector, and the line image of Mie-scattering was captured simultaneously in the path of each laser beam by using a CCD camera. The distribution of extinction coefficient in the spray is obtained by processing these data with the algebraic reconstruction technique. From the distribution of extinction coefficient, the surface distribution of spray can be reconstructed. OLP does not use laser sheet but use laser beam so that the noise effect of multiple scattering, caused by increasing number density of droplet in high pressure environment, is reduced drastically. OLP is expected as a suitable method which can investigate the characteristics of relatively large spray under the high pressure environment such as liquid rocket engine.

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