• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2009.05a
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• pp.74-77
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• 2009

Demands for high quality and productivity of precision mechanical parts are increasing greatly nowadays due to the rapid growth of information technologies and convergence industries. Therefore, core technologies for fabrication of precision mechanical parts are the fundamental issues, which are the precision machining, micro powder injection molding technologies, MR polishing, micro polymer processes, micro actuation modules and so on. These technologies are directly related to the mass production of high functional devices and machineries. Therefore, this study investigates the fabrication technologies of micro precision molds for advanced devices for possible commercialization in a near future.

• Journal of the Optical Society of Korea
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• v.10 no.3
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• pp.124-129
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• 2006

We have developed a compact and cost-effective camera module on the basis of wafer-scale-replica processing. A multiple-layered structure of several aspheric lenses in a mobile-phone camera module is first assembled by bonding multiple glass-wafers on which 2-dimensional replica arrays of identical aspheric lenses are UV-embossed, followed by dicing the stacked wafers and packaging them with image sensor chips. This wafer-scale processing leads to at least 95% yield in mass-production, and potentially to a very slim phone with camera-module less than 2 mm in thickness. We have demonstrated a VGA camera module fabricated by the wafer-scale-replica processing with various UV-curable polymers having refractive indices between 1.4 and 1.6, and with three different glass-wafers of which both surfaces are embossed as aspheric lenses having $230{\mu}m$ sag-height and aspheric-coefficients of lens polynomials up to tenth-order. We have found that precise compensation in material shrinkage of the polymer materials is one of the most technical challenges, in orderto achieve a higher resolution in wafer-scaled lenses for mobile-phone camera modules.

• Journal of the Institute of Electronics and Information Engineers
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• v.50 no.6
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• pp.131-137
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• 2013

The barrel distortion makes serious problems in a wide-angle camera employing a lens of a short focal length. This paper presents a low-complexity hardware architecture for a real-time barrel distortion corrector and its implementation. In the proposed barrel distortion corrector, the conventional algorithm is modified so that the correction is performed incrementally, which results in the reduction of the number of required hardware modules for the distortion correction. The proposed barrel distortion corrector has a pipelined architecture so as to achieve a high-throughput correction. The correction rate is 74.86 frames per sec at the operating frequency of 314MHz in a $0.11{\mu}m$ CMOS process, where the frame size is $2048{\times}2048$. The proposed barrel distortion corrector is implemented with 14.3K logic gates.

• Korean Journal of Optics and Photonics
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• v.10 no.1
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• pp.73-79
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• 1999

Semiconductor optical switch modules of 1$\times$2, 1$\times$4, and 4$\times$4 types for 1550 nm optical communication systems were fabricated by using laser welding technique, embodying in 30-pin butterfly package. For better coupling efficiency between switch chip and optical fiber, tapered fibers of 10~15mm lens radii were used, which provided up to 60% optical coupling efficiency. With the help of new laser hammering process, we could recover the lost optical power almost completely up to average 82% of initially obtained power. The fabricated optical switch modules showed good thermal stability of less than 5% degradation even after 200 times thermal cycling test. The 2.5 Gbps optical transmission characteristics of the 4$\times$4 switch module showed low sensitivities of less than -30dB for all possible switching paths. The transmission penalties of 1$\times$2 switch module at $10^{-10}$ BER were 0.6dB and 0.7dB for 50Xm and 90 Km optical fibers, respectively.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2012.10a
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• pp.13-14
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• 2012

Than fluorescent lamps or light bulbs, long life, small power consumption and to the development of modern technology, LED (Light Emitting Diode) devices have the advantage of easy control. For these reasons, using the LED device, lighting has been widely used. LED using optical fiber technology using LED lighting technology with the development of wireless communication technology is attracting attention again. Using LED lights this study analyzed the performance of the technology transfer and implementation of the information transmission system of the visible light communication using LED lighting of the White Visible Light Communication (VLC) based PC module transmitter and receiver modules. Has made a system that can transmit information more than the value of the initial distance ~ 50cm, depending on the presence or absence of the lens, in order to increase the efficiency of the LED modules with different efficiencies that could confirm the performance of the implementation of the research, analysis, and application methods. and about the possibility that you want to check.

• Journal of Internet Computing and Services
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• v.16 no.1
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• pp.1-8
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• 2015

Ultra-wide-angle wireless endoscopes are demonstrated in this paper. The endoscope is composed of an ultra-wide-angle camera module and wireless transmission module. A lens unit with the ultra-wide FOV of 162 degrees is designed and manufactured. The lens, image sensor, and camera processor unit are packaged together in a $3{\times}3{\times}9-cm3$ case. The wireless transmission modules are implemented based on UWB- and WiFi-based platform, respectively. The UWB-based module can transmit HD video to a computer in resolution of $2048{\times}1536$ (QXGA) and the frame rate of 15 fps in MJPEG compression mode. The maximum data transfer rate reaches 41.2 Mbps. The FOV and the resolution of the endoscope is comparable to a medical-grade endoscope. The FOV and resolution is ~3X and 16X higher than that of a commercial high-performance WiFi endoscope, respectively. The WiFi-based module streams out video to a smart device with th maximum date transfer rate of 1.5 Mbps at the resolution of $640{\times}480$ (VGA) and the frame rate of 30 fps in MJPEG compression mode. The implemented components show the feasibility of cheap medical-grade wireless electronic endoscopes, which can be effectively used in u-healthcare, emergency treatment, home-healthcare, remote diagnosis, etc.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.04a
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• pp.129-132
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• 2000

The PDP(Plasma Display Panel) barrier rib material on the glass substrate was patterned for fabrication of the PDP cell using Nd:YAG laser(1064 nm) which can generate the second(532 nm) and forth(266 nm) harmonic wave by HGM(harmonic generation modules). At a scan speed of 20 ${\mu}m/s$ with the second harmonic wave(532 nm) of Nd:YAG laser, the etching threshold laser fluence of the PDP material was 6.5 $mJ/cm^2$ and a sample(thickness = 180 ${\mu}m$) on the glass substrate was removed clearly at a laser fluence of 19.5 $mJ/cm^2$. In order to increase the throughput of the fabrication we divided a single-beam into multi-beams by using a metal mask between the sample and the focusing lens. As a result, 10 lines of PDP cell were formed by one laser beam scanning at a scan speed of 200 ${\mu}m/s$ and a laser fluence of 2.86 $J/cm^2$.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1079-1082
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• 2005

This paper deals with the algorithm development that inspects defects such as Lens Focus, Focus check, Black Defect, Dark Defect, Dim Defect, Color Defect, and Line Defect, Angle Defect, IrisAgc Defect caused by the process of 2M Class Compact Camera Module (CCM). Domestic market was majorly comprised of VGA(0.3 million pixel) market. But in the middle of year 2004, camera phone with Mega Pixel has appeared, and it is estimated that the camera phone with Mega Pixel will take up to 28% of total phone sales if it is released in the end of year 2004. Since the inspection of finished products is done manually, it is major obstacle in production increment In this paper, to solve these problems, we developed the imaging processing algorithm to inspect the defects in captured image of assembled CCM. The performances of the developed inspection system and we can recognize various types of defect of CCM modules with good accuracy and high speed

• Journal of the Optical Society of Korea
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• v.20 no.1
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• pp.150-155
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• 2016

To evaluate the autofocusing performance of recent mobile phone cameras, it is necessary to determine the peak position of the center field MTF (Modulation Transfer Function), -known as the through focus MTF- of the module. However, the MTF peak position found by conventional methods deviates from the ideal position due to the focus scanning resolution of mobile phone cameras. This inaccurate peak position results in false judgements of the optical performance, leading to yield losses or customer complaints. An increase in the focus scanning resolution can address this problem, but the manufacturing UPH (Unit per Hour) level will also unfortunately increase as well, resulting in a loss of manufacturing capabilities. In this paper, several fitting models are studied to find an accurate MTF peak position within a short period of time. With an analysis of a large amount of manufacturing data, it is demonstrated that the fitting methods can reduce false judgements and simultaneously increase the capabilities of the manufacturing system.

• Proceedings of the KIEE Conference
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• 1995.11a
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• pp.552-554
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• 1995

In long-haul high speed optical communications, the distance between a transmitter and a receiver depends on the amount of light coupled to a single mode optical fiber from the laser diode(LD) as well as the LD characteristic itself. And the transmitter module must have long lifetime. high reliability, and even simple structure. Such points have induced laser welding technique to be a first choice in opto-electronic module packaging because it can provide strong weld joint in a short time with very small coupling loss. In this paper, packaging considerations and characteristics for high speed LD modules are discussed. They include optical path design factors for larger aligning tolerance, and novel laser welding processes for component assembly. For low coupling loss after laser welding processes, the optical path for optimum coupling of a single mode optical fiber into the LD chip was designed with the GRIN lens system providing sufficiently large aligning tolerance both in the radial and axial directions. The measured sensitivity of the LD module was better than -33.7dBm(back to back) at a BER of $10^{-10}$ with a 2.5Gbps NRZ $2^{23}-1$ PRBS.