• Journal of the Korean Institute of Telematics and Electronics A
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• v.31A no.12
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• pp.16-22
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• 1994

In this paper, transmitter and receiver modules for free space optical interconnection are implemented and characterized. In the transmitter module, bias circuitry which inject current into the direct modulated laser diode is fabricated and in the receiver module, p-i-n diode is integrated with an MMIC amplifying stage. Laser diode has a direct-modulated bandwidth of 2 GHz at 1.4 Ith bias while p-i-n diode and amplifying stage has a bandwidth of 1.3 GHz and 1.5 GHz, repectively. Optical interconnection has a bandwidth of 1.3 GHz and linearly transmit modulated voltage signal up to 1.5 Vp-p. Measured loss of optical interconnection is 5dB which is composed of optoelectronic conversion loss of 15 dB, electrical impedance mismatch loss of 6.7 dB in transmitter module and gain of 18 dB in receiver module. Seperation between transmitter and receiver can be extended up to 50 cm by using a lens.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.34D no.11
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• pp.20-24
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• 1997

We have successfully fabricated high power (~20W) laser diode array, which are useful for pumping Nd:YAG lasers. The laser diode aray has 20 100.mu.m-wide cahnnels of which space was adjusted to 350.mu.m to improve thermal characteristics. And channel width is 100.mu.m. For an uncoated LD array, the output power of 15.66W has been obtained at 41A under quasi-CW operation, which results in about 0.42W/A slope efficiency. After aR(5%) and HR (95%) coatings on both facets, the output power was improved up to 21.18W at 40A under the same operation as above and the slope efficiency was 0.795W/A. On the other hand, by using a near field measurement system consisting of objective lens, eyepiece, CCD camera and image processing board, the typical near field patten of 1*20 LD array was observed.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.16 no.5
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• pp.140-144
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• 2007

As an electron scanning microscopes has traditionally required a considerably large room equipped with several service and pipe lines due to its inherent size. As an alternative, a small sized SEM, simply called a mini-SEM, is introduced even if the performance in terms of magnification and resolution is a little inferior to a classical thermal SEM. However, the size and fabrication cost is dramatically reduced, dedicating to opening a new market. The optical system in the mini-SEM is redesigned and specimen stage is quitely reduced and vertical axis is excluded. The design tools and calibration techniques to develope the mini-SEM are introduced and its performance is verified through numerical analysis experiments.

• Proceedings of the Optical Society of Korea Conference
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• 2009.10a
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• pp.288-289
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• 2009

We report an optimum fabrication condition for formation of concave lens shaped core cross-section of silica single-mode fibers with hydrofluoric (HF) acid solutions and arc discharge. A desired depth of curved cross-section of the silica fiber core and its surface smoothness were obtained with optimized concentration of the HF solution, etching time, and arc discharge condition.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2009.05a
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• pp.68-69
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• 2009

Heat Assisted Magnetic Recording (HAMR) is one of the most promising candidates for high density magnetic storages over 1 Tb/$in^2$ areal density. Since the precise light delivery to the head is a key factor to realize HAMR application, it is required to establish the light delivery using micro laser module and micro actuator. For the careful control of micro actuator, a laser module was designed including laser diode, optical fiber, collimating lens, and fabricated V-groove substrate. In addition, the basic aligning method between the laser module and HAMR head was studied by the detection of current change in photo diode due to the amount of reflected light from the head.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.78-78
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• 1999

Experimental studies of laser micromachining on Mo metal using piezo Q-switched Nd:YAG laser have been performed. Miniaturized microcolumn electron gun arrays as a potential electron beam lithography or portable mini-scanning electron microscope application have recently extensively examined. For these purpose, the electro-static electron lens and deflector system called microcolumn has to be assembled. The conventional microcolumn fabrication technique would gave a limitation on the minimization of aberration. The current technique of a 1 $\mu$m misalignment would lead to ~1.3 nm coma. In order to reduce aberration, assembling the microcolumn component followed by laser drilling should be very beneficial. In this report, we will address the preliminary report of laser micromachining on Mo substrate using piezo Q-switched Nd:YAG laser. The geometrical figures, such as the diameter and the depth of the frilled aperture are dependent upon the total energy of the laser pulse train, laser pulsewidth, and the diameter of laser beam in addition to the materials-dependent parameters.

• Transactions of the Society of Information Storage Systems
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• v.10 no.2
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• pp.55-60
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• 2014

Laser projector has many advantages of high brightness, high resolution and small size, but the huge drawback of image degradation called speckle which generated by coherence of laser and roughness of surface interrupts their general use. There are many methods to reduce speckle pattern, but they need effective optical systems to realize display to the far field with huge volume. We designed speckle reduction element by using microlens with controlled curvature to reduce spatial coherence. Vibration element was also applied to reduce temporal coherence which considered response time of eye. Designed element was fabricated by simple reflow method and imprinting method. From the results, the fabricated element performed 48.33% of speckle reduction efficiency and 41.29% of optical efficiency with a single doublet lens.

• Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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• 2006.05a
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• pp.154-156
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• 2006

A few ten mW white LED can substitute for the indicator light source and it is required to study several watt multi-chip semiconductor light sources in order to replace the light sources for general illumination such as incandescent lights and fluorescent lanes. Since the optical technology used for several mW white LED light source uses only 30% to 52% of the light it is required to develop the design technology of optical system and lens to improve the efficiency more than 80% for insuring the high power of white LED. In this paper, we designed and fabricated new structure reflector to increase the efficiency and is easy to make high power multi-chip LED lamp.

• Laser Solutions
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• v.10 no.2
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• pp.17-24
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• 2007

We have studied a laser direct writing lithography(LDWL). This is more important to apply to micro patterning using UV laser. We demonstrate the possibility of LDWL and construct the fabrication system. We use Galvano scanner to process quickly micro patterns from computer data. And laser beam is focused with $F-{\theta}$ lens. AZ5214 and SU-8 photoresist are chosen as experimental materials and a kind of well-known positive and negative photoresist respectively. Laser ablation mechanism depends on the optical properties of polymer. In this paper, therefore we investigate the phenomenon of laser ablation according to the laser fluence variation and measure the shape profile of micro patterned holes. From these experimental results, we show that LDWL is very useful to process various micro patterns directly.

• Journal of the Optical Society of Korea
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• v.10 no.3
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• pp.124-129
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• 2006

We have developed a compact and cost-effective camera module on the basis of wafer-scale-replica processing. A multiple-layered structure of several aspheric lenses in a mobile-phone camera module is first assembled by bonding multiple glass-wafers on which 2-dimensional replica arrays of identical aspheric lenses are UV-embossed, followed by dicing the stacked wafers and packaging them with image sensor chips. This wafer-scale processing leads to at least 95% yield in mass-production, and potentially to a very slim phone with camera-module less than 2 mm in thickness. We have demonstrated a VGA camera module fabricated by the wafer-scale-replica processing with various UV-curable polymers having refractive indices between 1.4 and 1.6, and with three different glass-wafers of which both surfaces are embossed as aspheric lenses having $230{\mu}m$ sag-height and aspheric-coefficients of lens polynomials up to tenth-order. We have found that precise compensation in material shrinkage of the polymer materials is one of the most technical challenges, in orderto achieve a higher resolution in wafer-scaled lenses for mobile-phone camera modules.