• Journal of the Korean Society for Precision Engineering
• /
• v.15 no.11
• /
• pp.76-82
• /
• 1998

In this study, the Ball screw and Servo motor Mechanism is considered as a High Speed Tool Feed System for the machining of a piston of a reciprocating engine. For the machining of a piston, that shapes oval, high speed servo mechanism is needed as a positioning of a cutting tool, and the stroke of tool is 0.1 mm ~ 1 mm. Ball screw and servo motor Mechanism is available very much because this mechanism is used widely in general machine. This Mechanism has been designed with the use of the decrease in mass and partial wear of the ball screw for high speed positioning of tool. Also the periodic learning control method with the inverse transfer function compensation has been applied to the positioning control for the high accuracy positioning of tool. These applications lead the achievement of the machining of a piston with an accuracy of 5${\mu}{\textrm}{m}$ at 2500 rpm in CNC turning.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2004.11a
• /
• pp.8-8
• /
• 2004

• Journal of the Microelectronics and Packaging Society
• /
• v.9 no.2
• /
• pp.39-43
• /
• 2002

The eutectic solder Sn-37Pb and the lead free solder alloys with the compositions of Sn-0.7Cu, Sn-3.5Ag, Sn-3.5Ag-0.75Cu, Sn-2.0Ag-0.7Cu-3.0Bi were applied to the 48 BGA packages, and then it was discussed for the shear strength at the solder joints as the hardness and the composition of the small solder ball. As a result of experiments, the high degree of hardness with the displacement of 0.043 mm was obtained in Sn-2.0Ag-0.7Cu-3.0Bi. The shear strength of the lead free solder was higher than that of Sn-37Pb solder, and it can be obtained the maximum value of about 52% in Sn-2.0Ag-0.7Cu-3.0Bi.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.20 no.1
• /
• pp.154-162
• /
• 1996

Ball screws are commonly used in linear motion feeding systems of various machine tools and automated systems. They are known to have relatively little backlash, high precision and efficiency compared to ordinary lead screws. Furthermore, the effectiveness of ball screw has made it the preferred choice of many newly developed high speed precision feeding units. The motivation of this work is to establish the groove edsigh basis of ball screws for the reduction of contact fatigue failure. In most instances, fatigue failure between ball and shaft groove is due to excessive contact pressure. Especially, the excessive load is causative of plastic flow below the contact surface, which can contribute to surface failure. But, in spite of small load, if groove conformity rate is large, contact pressure is increased and internal shear stress reach the yield value of the material. In such a point, the authors deal with design procedure for deciding the permissible conformity rate of a ball screw groove with the computational evaluation of contact pressure and maximum shear stress.

• Journal of the Korean Society for Precision Engineering
• /
• v.21 no.7
• /
• pp.62-69
• /
• 2004

This paper presents an experimental study on the dimensional error in ball-end milling. In the 3D free-formed surface machining using ball-end milling, while machining conditions are varied due to the Z component of the feed and existing hemisphere part of the ball-end mill, the mechanics of ball-end milling are complicated. In the finishing, most of cutting is performed the ball part of the cutter and the machined surface are required the high quality. But the dimensional errors in the ball-end milling are inevitably caused by tool deflection, tool wear, thermal effect and machine tool errors and so on. Among these factors, the most significant one of dimensional error is usually known as tool deflection. Tool deflection is related to the instantaneous horizontal cutting force and varied the finishing cutting path. It lead to decrease cutting area, thus resulting cutting forces but the dimensional precision surface could not be obtained. So the machining experiments are conducted fur dimensional error investigation and these results may be used for decrease dimensional errors in practice.

• Tribology and Lubricants
• /
• v.27 no.3
• /
• pp.140-146
• /
• 2011

A miniature pendular type impact testing machine was designed and developed, adopting a magnetic powder brake in order to investigate tensile and shear behavior of a small solder ball at high speed. In this testing system, the potential energy of the pendulum is transferred into the impact energy during its drop. Then, the impact energy is transmitted through the striker which is connected to the push rods to push the specimen for tensile loading. The tensile behavior of lead-free solder ball in diameter of 760 ${\mu}m$ was successfully investigated in a speed range of 0.15 m/s~1.25 m/s using this designed device. The maximum tensile strength of the solder joint decreases with the loading speed in the testing condition. The maximum tensile strength of the joint was 56 MPa in the low speed region.

• Tribology and Lubricants
• /
• v.24 no.1
• /
• pp.27-33
• /
• 2008

A micro-impression creep machine was designed and developed, adopting a small punch in diameter of 150 um, displacement gage with an accuracy of sub-${\mu}m$ scale, and load-cell with an accuracy of mN scale in order to investigate creep behavior of small solder ball in diameter of less than 1 mm. Creep behavior of lead-free solder ball(Sn-3.0Ag-0.5Cu) in diameter of $760\;{\mu}m$ was investigated in the stress range of $8{\sim}60\;MPa$ and at $303\;K{\sim}393\;K$. The applied load became decreased slightly and continuously in the creep rate of $10^{-4}/s$ range during the current experiments. Also, the machine frame was so sensitive to the environmental temperature that nm scaled displacement recording was unstable according to the change in environmental temperature.

• Journal of international Conference on Electrical Machines and Systems
• /
• v.2 no.4
• /
• pp.380-389
• /
• 2013

Application of linear electric motors to automation of manufacturing processes, gantry robots, machining processes, machining centers, additive manufacturing and laser scribing has been discussed. The paper focuses on replacement of ball lead screw mechanisms with linear electric motors, linear motor driven positioning stages, linear motor driven gantries, machining centers, machining of large objects and industrial lasers. The best linear electric motors for application to machining processes are permanent magnet (PM) linear synchronous motors (LSMs), especially those without PMs in the reaction tail, e.g., high thrust density linear (HDL) LSMs and PM flux switching (FS) LSMs.

• Journal of Welding and Joining
• /
• v.19 no.4
• /
• pp.406-412
• /
• 2001

This study is focussed on the numerical prediction of the thermal fatigue life of a ${\mu}BGA$(Micro Ball Grid Array) solder joint. Numerical method is used to perform three-dimensional finite element analysis for Sn-37mass%Pb. Sn-3.5mass%Ag solder alloys during the given thermal cycling. Strain values, along with the result of mechanical fatigue tests for solder alloys were then used to predict the solder joint fatigue life using the Coffin-Manson equation. In this study, a practical correlation for the prediction of the thermal fatigue life is suggested by using the dimensionless variable $\gamma$. As a result. it could be found that Sn-3.5mass%Ag has longer fatigue life than Sn-37mass%Pb in low cycle fatigue. In addition. the result with ${\gamm}ashow$a good agreement with the FEA results.

• Journal of the Microelectronics and Packaging Society
• /
• v.17 no.3
• /
• pp.17-26
• /
• 2010

Pb-Sn solder is rapidly being replaced by lead-free solder for board-level interconnection in microelectronic package assemblies due to the environmental protection requirement. There is a general lack of mechanical reliability information available on the lead-free solder. In this study, thermo-mechanical behaviors of wire-bond plastic ball grid array (WB-PBGA) package assemblies are characterized by high-sensitivity moire interferometry. Experiments are conducted for two types of WB-PBGA packages that have Pb-Sn solder and lead-free solder as joint interconnections. Using real-time moire setup, fringe patterns are recorded and analyzed for several temperatures. Bending deformations of the assemblies and average strains of the solder balls are investigated and compared for the two type of WB-PBGA package assemblies. Results show that shear strain in #3 solder ball located near the chip shadow boundary is dominant for the failure of the package with Pb-Sn solder, while normal strain in #7 most outer solder ball is dominant for that with lead-free solder. It is also shown that the package with lead-free solder has much larger bending deformation and 10% larger maximum effective strain than the package with Pb-Sn solder at same temperature level.