• Environmental Engineering Research
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• v.15 no.1
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• pp.3-7
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• 2010

To better understand the ecology of tetrade forming organisms (TFOs) floating in a large amount of dairy wastewater treatment plant (WWTP) effluent (sequencing batch reactor [SBR]) during the inefficient phosphorus (P) removal process of an enhanced biological P removal system, the TFOs from the effluent of a full scale WWTP were separated and attempts made to culture the TFOs in presence/absence of oxygen. The intact TFOs only grew aerobically in the form of unicellular short-rods. Furthermore, to identify the intact TFOs and unicellular short-rods the DNAs of both were extracted, analyzed using their denaturing gradient gel electrophoresis (DGGE)-profiles and then sequenced. The TFOs and unicellular short-rods exhibited the same banding pattern in their DGGE-profiles, and those sequencing data resulted in their identification as Acinetobacter sp. The intact TFOs appeared in clumps and packages of tetrade cells, and were identified as Acinetobacter sp., which are known as strict aerobes and efficient P-removers. The thick layer of extracellular polymeric substance surrounding Acinetobacter sp. may inhibit phosphate uptake, and the cell morphology of TFOs might subsequently be connected with their survival strategy under the anaerobic regime of the SBR system.

• Environmental Engineering Research
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• v.24 no.2
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• pp.339-346
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• 2019

In this research, applicability of electrochemical technology in removing nitrogenous compounds from solid waste landfill leachate was examined. Novel cathode material was developed at laboratory by introducing a Cu layer on Al substrate (Cu/Al). Al and mild steel (MS) anodes were investigated for the efficiency in removing nitrogenous compounds from actual leachate samples collected from two open dump sites. Al anode showed better performances due to the effect of better electrocoagulation at Al surface compared to that at MS anode surface. Efficiency studies were carried out at a current density of $20mA/cm^2$ and at reaction duration of 6 h. Efficiency of removing nitrate-N using Al anode and developed Cu/Al cathode was around 90%. However, for raw leachate, total nitrogen (TN) removal efficiency was only around 30%. This is due to low ammonium-N removal as a result of low oxidation ability of Al. In addition to the removal of nitrogenous compounds, reactor showed about 30% removal of total organic carbon. Subsequently, raw leachate was diluted four times, to simulate pre-treated leachate. The diluted leachate was treated and around 88% removal of TN was achieved. Therefore, it can be said that the reactor would be good as a secondary or tertiary treatment step in a leachate treatment plant.

• Journal of Korean Society on Water Environment
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• v.31 no.2
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• pp.94-102
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• 2015

Electro-coagulation experiments were conducted with aluminum (Al) or iron (Fe) electrode in order to determine the optimal electrode material and operation conditions for algae removal. Al electrode showed higher removal rate of algae than Fe electrode because Al flocs have positive surface charges which electrostatically attract algae species having negative surface charges. Removal rate of algae and total phosphorous (T-P) was increased as current density and electrode area increases. It was also found that initial pH with neutral range was optimum for T-P removal by electro-coagulation. Bench-scale continuous flow experiments consisted of electro-coagulation reactor, agitation tank and settling tank were conducted. In electro-coagulation reactor, a large fraction of Al flocs were distributed to scum layer, due to the gas bubbles generated by electrolysis reaction. In agitation tank, most of Al flocs were settled and the optimal mixing intensity was found to be 50 rpm to achieve good settleability. The removal rate of algae was about 90-95%. Additionally, the removal rate of the T-P and COD was observed to be $73.8{\pm}8.0%$ and $75.0{\pm}3.8%$, respectively. Meanwhile, the removal rate of total nitrogen (T-N) was relatively low at only 24%.

• Proceedings of the KIEE Conference
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• 2004.07c
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• pp.1600-1604
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• 2004

As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric(IMD) layer with free-defect. The effect of alternative commerical slurries pads, and post-CMP cleaning alternatives are discuess, with removal rate, scratch dentisty, surface roughness, dishing, erosion and particulate density used as performance metrics. we investigated the performance of $SnO_2$-CMP process using commonly used silica slurry, ceria slurry, tungsten slurry. This study shows removal rate and nonuniformity of $SnO_2$ thin film used to gas sensor by using Ceria, Silica, W-Slurry after CMP process. This study also shows the relation between partical size and CMP with partical size analysis of used slurry.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.711-714
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• 2004

Chemical mechanical polishing (CMP) has been widely accepted for the global planarization of multi-layer structures in semiconductor manufacturing. However, it still has various problems to the CMP equipment, in particular, among the CMP components, process variables are very important parameters in determining the removal rate and non-uniformity. Using a design of experiment (DOE) approach, this study was performed investigating the interaction between the various parameters such as turntable and head speed, down force and back pressure during CMP. Using statistical analysis techniques, a better understanding of the interaction behavior between the various parameters and the effect on removal rate, no-uniformity and ETC (edge to center) is achieved.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.04b
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• pp.93-96
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• 2004

As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric(IMD) layer with free-defect. The effect of alternative commerical slurries pads, and post-CMP cleaning alternatives are discuess, with removal rate, scratch dentisty, surface roughness, dishing, erosion and particulate density used as performance metrics. we investigated the performance of $SnO_2$-CMP process using commonly used silica slurry, ceria slurry, tungsten slurry. This study shows removal rate and nonuniformity of $SnO_2$ thin film used to gas sensor by using Ceria, Silica, W-Slurry after CMP process. This study also shows the relation between partical size and CMP with partical size analysis of used slurry.

• Proceedings of the Korean Society of Soil and Groundwater Environment Conference
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• 1999.10a
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• pp.77-80
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• 1999

In this study, to evaluate the performance of leachate collection and removal system, the clogging of geotextile filter was tested and simulated for HELP. As a result of clogging test, the all permeability of geotextiles were decreased rapidly in several day. Also, $Ca^{2+}$ and CODcr concentrations were decreased during test. In model simulation for HELP, Daily discharge volume was shown insignificant change with the filter clogging. however, this result may effect on increasing of the hydraulic gradient in waste layer.r.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07a
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• pp.389-392
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• 2004

As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric(IMD) layer with free-defect. The effect of alternative commerical slurries pads, and post-CMP cleaning alternatives are discuess, with removal rate, scratch dentisty, surface roughness, dishing, erosion and particulate density used as performance metrics. we investigated the performance of $SnO_2$-CMP process using commonly used silica slurry, ceria slurry, tungsten slurry. This study shows removal rate and non-uniformity of $SnO_2$ thin film used to gas sensor by using Ceria, Silica, W-Slurry after CMP process. This study also shows the relation between particle size and CMP with particle size analysis of used slurry.

• Journal of the Semiconductor & Display Technology
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• v.18 no.4
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• pp.154-159
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• 2019

Undesirable negative image is occurred in photographs taken across partial reflections such as glass window and electronic display. Efficient removing reflections given a single image are in the spotlight in recent researches. This paper discusses and evaluates two published image reflection removal algorithms, and compares the performance of time and quality of those methods with a common dataset. As benchmarking test cases are presented, we propose to modify one of the methods to reduce the run-time with small effects on the similar image quality.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2002.04a
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• pp.251-254
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• 2002

The technique of high speed machining is widely studied in machining field. In this study, TiAIN single-layered and TiAIN/TiN double-layered coatings were applied to end-mill by an arc ion plating technique. Their performances were comparatively studied about cutting force, tool wear, tool life and surface roughness of workpiece under high speed cutting conditions. The TiAIN single-layer coated tool showed higher wear-resistance due to its higher hardness, while the TiAIN/TiN double-layer coated tool showed better performance for high metal removal, i.e., high fled per tooth condition due to its higher toughness. The surface roughness of the workpiece was not influenced by the wear amount of coated tools.