• Title/Summary/Keyword: Layer Metallic

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Failure and Phase Transformation Mechanism of Multi-Layered Nitride Coating for Liquid Metal Injection Casting Mold

  • Jeon, Changwoo;Lee, Juho;Park, Eun Soo
    • Korean Journal of Materials Research
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    • v.31 no.6
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    • pp.331-338
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    • 2021
  • Ti-Al-Si target and Cr-Si target are sputtered alternately to develop a multi-layered nitride coating on a steel mold to improve die-casting lifetime. Prior to the multi-layer deposition, a CrN layer is developed as a buffer layer on the mold to suppress the diffusion of reactive elements and enhance the cohesive strength of the multi-layer deposition. Approximately 50 nm CrSiN and TiAlSiN layers are deposited layer by layer, and form about three ㎛-thickness of multi-layered coating. From the observation of the uncoated and coated steel molds after the acceleration experiment of liquid metal injection casting, the uncoated mold is severely eroded by the adhesion of molten metallic glass. On the other hand, the multi-layer coating on the mold prevents element diffusion from the metallic glass and mold erosion during the experiment. The multi-layer structure of the coating transforms the nano-composite structured coating during the acceleration test. Since the nano-composite structure disrupts element diffusion to molten metallic glass, despite microstructure changes, the coating is not eroded by the 1,050 ℃ molten metallic glass.

Fabrication of metallic nano-stamper to replicate nanoscale patterns (나노패턴 성형을 위한 금속 나노 스탬퍼 제작)

  • 김영규;이동철;강신일
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2003.05a
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    • pp.481-484
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    • 2003
  • In this study, we fabricated the master metallic nano-stamper with nano pillar patterns to apply replication processes which is adequate for mass production. Master nano patterns with various hole diameters between 300 nm and 1000 nm was fabricated by e-beam lithography. After the seed layer was deposited on the master nano patterns using e-beam evaporation, the nickel was electroformed. In each step, the shape and surface roughness of their patterns were analyzed using SEM and AFM.

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Application of the electroless plating method to the fabrication of metallic bus electrodes of PDP

  • Oh, Young-Joo;Jeung, Won-Young
    • 한국정보디스플레이학회:학술대회논문집
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    • 2003.07a
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    • pp.829-831
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    • 2003
  • In the present study, the electroless plating method was applied instead of the sputtering as a formation method of metallic bus electrodes. No additional blackening step is needed in this method since this process provides a metallic seed layer with black color by a single step. The parameters which affects color and morphology of the metallic seed layer in the electroless plating solution were investigated

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Hot-dipped Al-Mg-Si Coating Steel - Its Structure, Electrochemical and Mechanical Properties -

  • Tsuru, Tooru
    • Corrosion Science and Technology
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    • v.9 no.6
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    • pp.233-238
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    • 2010
  • Hot-dipped Al-Mg-Si coatings to alternate Zn and Zn alloy coatings for steel were examined on metallographic structure, corrosion resistance, sacrificial ability, formation and growth of inter-metallic compounds, and mechanical properties. Near the eutectic composition of quasi-binary system of Al-$Mg_2Si$, very fine eutectic structure of ${\alpha}$-Al and $Mg_2Si$ was obtained and it showed excellent corrosion resistivity and sacrificial ability for a steel in sodium chloride solutions. Formation and growth of Al-Fe inter-metallic compounds at the interface of substrate steel and coated layer was suppressed by addition of Si. The inter-metallic compounds layer was usually brittle, however, the coating layer did not peel off as long as the thickness of the inter-metallic compounds layer was small enough. During sacrificial protection of a steel, amount of hydrogen into the steel was more than ten times smaller than that of Zn coated steel, suggesting to prevent hydrogen embrittlement. Al-Mg-Si coating is expected to apply for several kinds of high strength steels.

A Study on the Characteristics of Heat Transfer in Heat Pipe with Composition Wick of Screwed Groove - Metallic Mesh (나선형그루브-금망의 복합윅을 갖는 히이트파이프의 전열특성에 관한 연구)

  • Chang, Young-Suk;Lee, Young-Soo;Seoh, Jeong-Il
    • The Magazine of the Society of Air-Conditioning and Refrigerating Engineers of Korea
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    • v.15 no.3
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    • pp.273-282
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    • 1986
  • The purpose of this research was to study the characteristics of heat transfer in Heat Pipe which used the composition wick of screened groove - metallic mesh by ADI method and experimental results. As the results, the more than number of metallic mesh screen layers in a heat pipe increased, the fewer the effect of heat recovery decreased. In case of 1 - layer metallic mesh screen wick, the response of the effect in heat recovery was more rapidly showed than in case of other layers and in spite of high load, the evaporation section of Heat pipe with 1 - layer metallic mesh screen wick showed the stable response and did not show excessive super heat. There was a interrelation between thermal resistance and the variable layers, between thermal resistance and the variable gaps of metallic meshes, the heat transfer characteristics of Heat pipe were depended on the thermal resistance of composition wick.

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Study of Au-PTFE/Al Metallic bipolar plate for PEMFC (고분자 전해질형 연료전지용 Au-PTFE/Al 금속분리판 연구)

  • Yoo, Seung-Eul;Kim, Myong-Hwan;Goo, Young-Mo
    • New & Renewable Energy
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    • v.3 no.1 s.9
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    • pp.75-82
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    • 2007
  • Aluminum was used as metallic bipolar plate material to reduce a stack weight. The functional materials such as conductive material, Au and nonconductive material, PTFE [polytetrafluoroethylene] were coated on the bipolar plate to enhance electrical contact and corrosion prevention in PEMFC. The active area of bipolar plate is divided into the top layer part that electric current mainly passes, and the bottom layer part that gas and water pass. The bottom layer part in the flow channel needs not to have electrical conductivity because it doesn't pass electric current directly. In this reason, Au on the top layer and PTFE on the bottom layer were coated to apply high electrical conductivity and/or good corrosion resistance. Although the single cell performance using Au-PTFE/Al bipolar plate was shown 78% in comparison with that of graphite, specific power of Au-PTFE/Al bipolar plate(0.4 W/g) was twice as much as graphite bipolar plate.

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Fabrication of $100{\mu}m$ High Metallic Structure Using Negative Thick Photoresist and Electroplating (Negative Thick Photoresist를 이용한 $100{\mu}m$ 높이의 금속 구조물의 제작에 관한 연구)

  • Chang, Hyun-Kee;Kim, Yong-Kweon
    • Proceedings of the KIEE Conference
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    • 1998.07g
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    • pp.2541-2543
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    • 1998
  • This paper describes the fabrication process to fabricate metallic structure of high aspect ratio using LlGA-like process. SU-8 is used as an electroplating mold. SU-8 is an epoxy-based photoresist, designed for ultrathick PR structure with single layer coating [1,2]. We can get more than $100{\mu}m$ thick layer by single coating with conventional spin coater, and applying multiple coating can make thicker layers. In the experiments, we used different kinds of SU-8, having different viscosity. To optimize the conditions for mold fabrication process, experiments are performed varying spinning time and speed, soft-bake, develop and PEB (Post Expose Bake) condition. With the optimized condition, minimum line and space of $3{\mu}m$ pattern with a thickness of $40{\mu}m$ and $4{\mu}m$ pattern with a thickness of $130{\mu}m$ were obtained. Using the patterned PR as a plating mold, metallic structure was fabricated by electroplating. We have fabricated a electroplated nickel comb actuator using SU-8 as plating mold. The thickness of PR mold is $45{\mu}m$ and that of plated nickel is$40{\mu}m$. Minimum line of the mold is $5{\mu}m$. Patterned metallic layer or polymer layer, which has selectivity with the structural plated metallic layer, can be used as sacrificial layer for fabrication of free-standing structure.

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Monitoring of the Transfer of Tetrachloroaurate(III) Ions by Thin-layer Electrochemistry and Electrochemical Deposition of Metallic Gold over a Graphite Electrode

  • Song, Ji-Seon;Shin, Hyo-Sul;Kang, Chan
    • Bulletin of the Korean Chemical Society
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    • v.29 no.10
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    • pp.1983-1987
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    • 2008
  • This study demonstrates the electrochemical conversion of the synthetic procedure of monolayer-protected clusters using a thin toluene layer over an edge plane pyrolytic graphite electrode. A thin toluene layer with a thickness of 0.31 mm was coated over the electrode and an immiscible liquid/liquid water/toluene interface was introduced. The transfer of the tetrachloroaurate ($AuCl_4^-$) ions into the toluene layer interposed between the aqueous solution and the electrode surface was electrochemically monitored. The $AuCl_4^-$ ions initially could not move through into the toluene layer, showing no reduction wave, but, in the presence of the phase transfer reagent, tetraoctylammonium bromide (TOABr), a cathodic wave at 0.23 V vs. Ag/AgCl was observed, indicating the reduction of the transferred $AuCl_4^-$ ions in the toluene layer. In the presence of dodecanethiol together with TOABr, a self-assembled monolayer was formed over the electro-deposited metallic gold surface. The E-SEM image of the surface indicates the formation of a highly porous metallic gold surface, rather than individual nanoparticles, over the EPG electrode.

Change of crystallization and properties of YBCO thin film by phase transition of $CeO_2$ ($CeO_2$의 상전이에 따른 YBCO 박막의 결정성 및 특성의 변화)

  • Kim, Sung-Min;Lee, Sang-Yeol
    • Proceedings of the KIEE Conference
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    • 1999.07d
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    • pp.1590-1592
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    • 1999
  • We have fabricated good quality superconducting $YBa_2Cu_3O_{7-{\delta}}$ thin films on Hastelloy(Ni-Cr-Mo alloys) with $CeO_2$ buffer layers by in-situ pulsed laser deposition in a multi-target processing chamber. Using one of electrical properties of YBCO superconducting which the resistance approaches to zero dramatically on transition temperature, we have researched to make power transmission line, we have deposited YBCO thin film on flexible metallic substrate. However, it is difficult to make films on flexible metallic substrates due to both interdiffusion problem between metallic substrate and superconducting layer and non-crystallization of YBCO on amorphous substrate. From early research, two ways-using textured metallic substrate and buffer layer-were proposed to overcome theses difficulties. We have chosen $CeO_2$ as a buffer layer which has cubic structure of $5.41{\AA}$ lattice parameter and only 0.2% of lattice mismatch with $3.82{\AA}$ of a-axis lattice parameter of YBCO on (110) direction of $CeO_2$. In order to enhance the crystallization of YBCO films on metallic substrates we deposited $CeO_2$ buffer layers at varying temperature $700^{\circ}C$ to $800^{\circ}C$ and $O_2$ pressure. By X-ray diffraction, we found that each domination of (200) and (111) orientations were strongly relied upon the deposition temperature in $CeO_2$ layer and the change of the domination of orientation affects the crystallization of YBCO upper layer.

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Fabrication and Characterization of High Temperature Superconducting Thin Film on Metallic Substrate Using Laser Ablation (레이저 증착법을 이용한 금속기판상 고온초전도 박막증착 및 특성분석)

  • Lee, Sang-Yeol
    • Proceedings of the KIEE Conference
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    • 1995.11a
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    • pp.329-331
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    • 1995
  • Laser ablation was used to fabricate superconducting $YBa_2Cu_3O_{7-x}$ (YBCO) thin films on metallic substrates with an YSZ buffer layer. An ArF excimer laser with an wavelength of 193 nm was used to deposit both YSZ buffer layer and superconducting thin film. The characterizations of thin films were performed and compared. With a 200 nm YSZ buffer layer, c-axis orientation and $T_c$=85 K were obtained for a 200 nm-thick YBCO film.

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