• Title/Summary/Keyword: Laser spot size

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Comparison of Theoretical model with Experiment in Bead Shape of Laser Welding (레이저 용접의 비드 형상에 대한 실험치와 이론 결과의 비교)

  • Kim, J.D.;Kim, J.D.
    • Journal of the Korean Society for Precision Engineering
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    • v.11 no.1
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    • pp.201-210
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    • 1994
  • A theoretical heat-flow model incorporating with a constant moving CO$_{2}$ laser beam has been analyzed to predict depth and the shape of bead section during last beam welding. The laser beam is exponentially attenuated with an abosrption coefficient in the material. The solution can be expressed in terms of normalized variables. The experimental data were generated by usint CW 2 CO$_{2}$ laser with multi beam mode and CW 3 kW CO$_{2}$laser with Gaussian mode. The specimens were made as bead-on-plate welds for SM 10C, STS 304, STS 316, STS 420 and pure Nickel. The maximum possible penetration depth and the shape of beas section for given sources of laser power, travel speed and beam spot size can be prdicted with this model in a given material.

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A study on the micro wire joining using single mode fiber laser (Single mode fiber laser를 이용한 micro wire joining에 관한 연구)

  • Park K.W.;Na S.J.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2006.05a
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    • pp.663-664
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    • 2006
  • In the electronic, medical, aerospace and automobile industries, many products and parts are manufactured by joining. Recently, as these get smaller, micro joining is becoming more and more important. In this study, micro wire-to-micro wire parallel joining was performed using single mode fiber laser. Maximum power of the fiber laser is 100 W. The CCD(Charge- Coupled Device, CCD) camera to observe the specimen was made up. The objective was applied to micro joining system to make a small spot size of laser beam. In order to control the target position, micro-multi-axis-stage was set up. This paper presents results for the single mode fiber laser joining of micro wires.

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Principles of Laser Laryngeal Microsurgery (레이저 후두미세수술의 원칙)

  • Moon, Jeong Hwan;Lee, Sang Joon;Chung, Phil-Sang
    • Journal of the Korean Society of Laryngology, Phoniatrics and Logopedics
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    • v.24 no.1
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    • pp.13-17
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    • 2013
  • Laser laryngeal microsurgery is currently the primary method of treatment of various laryngeal diseases. The development of laryngeal microsurgery came from the introduction of a small spot $CO_2$ laser micromanipulator and more precise microlaryngeal instruments. $CO_2$ laser laryngeal microsurgery has enabled very precise surgery because it has small focus size and hemostatic effect. There are some limitations to the use of the $CO_2$ Laser such as adjacent tissue damage and vocal fold scarring. These problems can be minimized through understanding the mechanisms by which lasers function and correctly manipulating the parameters under a surgeon's control. We should also recognize the safety of $CO_2$ laser for the surgeon to precisely perform the procedure.

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Effectiveness of a Fractional Picosecond 1,064-nm Laser in Improving Traumatic Scars with Depression

  • Ahn, Kwang Hyeon;Park, Eun Soo;Choi, Chang Yong
    • Medical Lasers
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    • v.9 no.2
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    • pp.179-183
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    • 2020
  • The picosecond laser has been widely used to remove tattoos, and improve wrinkles, acne scarring, and pigmented scars. This study was performed to investigate the efficacy and safety of a 1,064-nm fractional picosecond laser treatment for depressed traumatic scars. A total of twenty Korean patients with depressed scars were treated with a 1,064-nm fractional picosecond laser at a two-week interval with a spot size of 3 mm, fluence of 3.5 to 5.5 J/cm2, and frequency of 2 Hz with a combination of microlens arrays. At 4 weeks after the final treatment, there was a statistically significant improvement in the modified Vancouver Scar Scale (mVSS) and the patient satisfaction score without any significant complication. A 1,064-nm fractional picosecond laser treatment is a safe and effective method to improve traumatic wound scars with depression.

Residual Stress Prediction in LSP Surface Treatment by Using FEM (유한요소법을 이용한 LSP 표면처리 공정의 잔류응력 예측)

  • Bang, Boo-Woon;Son, Seung-Kil;Kim, Jae-Min;Cho, Chong-Du
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.33 no.8
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    • pp.767-772
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    • 2009
  • Laser shock peening(LSP) is proving to be better surface treatment than conventional one such as shot peening. The LSP process has a compressive residual stress into a metal alloy and a significant improvement in fatigue life. Our research is focused on applying finite element method to the prediction of residual stress through the LSP processing in some LSP conditions such as pressure and spot size induced by laser. Two analysis methods are considered to calculating the compressive residual stress. But the explicit solution and the static one after partially explicit solving are almost same. In LSP, because of very high strain rate($10^6s^{-1}$), HEL(Hugoniot Elastic Limit) is the most important parameter in material behavior modeling. As the circular laser spot is considered, 2-D axisymmetric elements are used and the infinite elements are applied to boundaries for no reflection. The relations of material properties and the LSP are also important parts in this study.

Study of Laser Trimming and Cutting of Printed Circuit Board by using UV Laser with Nanosecond Pulse Width (나노초 펄스폭을 갖는 자외선 레이저를 이용한 전자회로기판의 저항체 트리밍과 절단공정 특성에 관한 연구)

  • Ryu, Kwang-Hyun;Shin, Suk-Hoon;Park, Hyeong-Chan;Nam, Gi-Jung;Kwon, Nam-Ic
    • Journal of the Korean Society for Precision Engineering
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    • v.27 no.10
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    • pp.23-28
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    • 2010
  • Resistance trimming and cutting processes of printed circuit board by making use of high power UV laser with nano-second pulse width have been proposed and investigated experimentally. Also laser-based application system with high flexibility and complex has been designed and adopted power controller, auto beam size control, auto-focusing and control program developed for ourselves. The function of each module shows that they can be reliable for industrial equipments. Resistance trimming method used a plunge and double cut process with $20{\mu}m$ spot size beam. Results show that double cut process is more effective to control resistance trimming in precision than plunge cut process.

Design of 1.55-mm InGaAsP Laser Diode Integrated with a Tapered Ridge Mode Transformer (테이퍼 모드 변환기를 집적한 1.55-$\mu m$ 레이저다이오드의 설계)

  • 이기민
    • Proceedings of the Optical Society of Korea Conference
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    • 1999.08a
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    • pp.216-217
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    • 1999
  • A tapered ridge mode laser diode with increased spot size is designed and analyzed . The mode evolution concept is applied to design the taper and the method does not require regrowth or multiple-step etching technique. Three-dimensional BPM results show that the designed taper can transfer more than 97% of the mode power in the active region to the expanded mode.

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Fabrication of Fresnel zone plate with femtosecond laser lithography technology (펨토초 레이저 리소그라피 기술을 이용한 Fresnel zone plate 제작 연구)

  • Sohn, I.B.;Noh, Y.C.;Ko, M.J.
    • Laser Solutions
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    • v.14 no.2
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    • pp.13-16
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    • 2011
  • We fabricated the Fresnel zone plate using femtosecond laser lithography-assisted micro-machining, which is a combined process of nonlinear lithography and wet etching. We investigated the focusing properties by launching a 632.8nm wavelength He-Ne laser beam into the zone plate. The spot size of the primary focal point was $27{\mu}m$ and the intensity of focal point was 0.565W/$cm^2$.

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LTPS 공정 Diode Laser Annealing 방식을 이용한 Poly-Si 결정화

  • Lee, Jun-Gi;Kim, Sang-Seop
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.08a
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    • pp.336-336
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    • 2011
  • AMOLED에 대한 관심이 높아짐에 따라 LTPS (Low Temperature Poly Silicon) TFT에 대한 연구가 활발히 이루어지고 있다. 다결정 실리콘은 단결정 실리콘에 비해 100 cm2/V 이상의 이동도를 보이는 우수한 특성으로 인해 AMOLED 디스플레이에 적합하며 여러 기업에서 LTPS 공정을 이용한 TFT제작을 연구 중이다. LTPS 공정은 현재 ELA (Excimer Laser Annealing) 방식으로 대면적 유리기판에 ELA 방법을 적용함에 있어 설비투자 비용이 지나치게 높아진다는 단점을 가지고 있다. 설비투자 비용의 문제점을 해결하기 위해 Diode Laser을 이용하여 Annealing하는 방법에 대해 연구하였다. 본 연구는 Diode Laser Annealing 방식을 이용하여 poly-Si을 구현하였다. 단결정 실리콘을 제작하기 위해 ICP-CVD장비를 이용하여 150$^{\circ}C$에서 SiH4, He2 혼합, He/SiH4의 flow rate는 20/2[sccm], RF power는 400 W에서 700 W으로 가변, 증착 압력은 25mTorr으로 하였다. 940 nm 파장의 30 W Diode Laser를 8 mm Spot Size로 a-Si에 순간 조사하여 결정화, 그 결과 grain을 형성한 polycrystalline 구조를 확인하였다.

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