• Proceedings of the Korean Society of Laser Processing Conference
• /
• 2005.06a
• /
• pp.66-69
• /
• 2005

• Proceedings of the Korean Society of Laser Processing Conference
• /
• 2005.11a
• /
• pp.105-108
• /
• 2005

• Proceedings of the Korean Society of Laser Processing Conference
• /
• 2005.11a
• /
• pp.101-104
• /
• 2005

• Proceedings of the Korean Society of Laser Processing Conference
• /
• 2006.11a
• /
• pp.25-30
• /
• 2006

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2002.05a
• /
• pp.503-507
• /
• 2002

Mask manufacturing is a high COC and COO process in developing of semiconductor devices, because of the mass production tool with high resolution. Direct writing has been thought to be one of the patterning method to cope with development or small-lot production of the device. This study focused on the development of the direct, mastless patterning process using stereolithography tool for the easy and convenient application to micro and miso scale products. Experiments are utilized by three dimensional CAD/CAM as a mask and photo-curable resin as a photo-resist in a conventional stereo-lithography apparatus. Results show that the resolution of the pattern was achieved about 300 micron because of complexity of SLA apparatus settings, inspite of 100 micro of inherent resolution. This paper concludes that photo resist and laser spot diameter should be adjusted to get finer patterns and the proposed method is significantly feasible to mastless and low cost patterning with micro and miso scale.

• Journal of the Korean Society for Precision Engineering
• /
• v.17 no.8
• /
• pp.134-139
• /
• 2000

In order to understand the removal mechanism and seek the optimal conditions. KrF excimer laser ablation of Cr films on glass substrates is investigated. The surface morphology of the laser-irradiated spot is examined by SEM. The measured single-shot ablation rate is found to be about two times the result of numerical analysis based on a surface vaporization model and heat conduction theory. Surface morphology examination indicates that the Cr film is removed by the sequence of melting-surface vaporization-,melt expulsion by plasma recoil and that the outmost ripple of the diffraction pattern gives a strong effect on the morphology of molten Cr during the melting and vaporization processes. To seek the optimal process parameters for micro patterning morphological investigation is carried out experimentally on samples having different chromium film thicknesses. Optimal processing conditions are determined to enhance the accuracy and quality of thin film removal for micro patterning.

• Transactions of Materials Processing
• /
• v.13 no.3
• /
• pp.268-272
• /
• 2004

Transparent materials such as fused silica are widely utilized in optical and optoelectronics field because of its outstanding properties, such as transparency in a wide wavelength range, strong damage resistance for laser irradiation, and high thermal and chemical stability. In this study, we made a few micro patterns on the surface of fused silica plate using laser induced wet etching. KrF excimer laser was used as a light source. There were no burrs and micro cracks on the etched surface of fused silica and the flatness of the etched surface was fairly good. We investigated the influence of etchant upon the etch rate and quality in laser induced wet etching. Pyrene-acetone solution and toluene were used as etchant. In the side of etch rate, toluene solution was better than pyrene-acetone solution. But we made in wider range of energy density using pyrene-acetone solution. But pyrene-acetone solution gave us wider window of energy density for successful micro patterning.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2003.06a
• /
• pp.1889-1892
• /
• 2003

The fabrication of micro-size patterning on alumina substrate is generated by laser direct writing, which has high precision and selectivity of various laser beam energies. The depth and width of patterns is affected by laser parameter such as laser power, scan rate. Through the chemical and mechanical polishing Pd seeds was effectively got rid of alumina substrate for selectivity electroless Ni plating. Thermal treatment is good method for changing electrical property of conductor line, because the treatment can control of the grain size.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2011.06a
• /
• pp.119-120
• /
• 2011

• Laser Solutions
• /
• v.13 no.2
• /
• pp.6-9
• /
• 2010

In printed electronics, printing rolls are used to transfer electronic ink onto a flexible substrate. Generally printing rolls are being made by the indirect laser method which is based on the etch process, thus not environment-friendly and not suitable for making a large printing roll. For the pursuit of making a large printing roll for mass printing of electronic devices, we have directly engraved micro-patterns into a Zn plated printing roll using a 30W pulse-modulated fiber laser. We have successfully engraved line patterns ranging from about 15-30${\mu}m$ in width.