• JSTS:Journal of Semiconductor Technology and Science
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• 제2권1호
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• pp.82-86
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• 2002

It is demonstrated that the conventional current-pulse laser drivers are not adequate in driving VCSELs operating at multi-Gb/s speeds. Simulation results, including the bonding parasitics, show that high-performance VCSELs are more efficiently driven using voltage-pulse mode of operation. The optical output power is almost doubled in the voltage-mode of operation, while the total electrical power consumption of the transmitter decreases by 20%.

• 전력전자학회:학술대회논문집
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• 전력전자학회 2014년도 전력전자학술대회 논문집
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• pp.59-60
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• 2014

In this paper, development of laser diode driver with 2.5kW rating is presented. The driver is configured with interleaved PFC converter, high frequency full bridge DC-DC converter, two laser diode drivers and ${\mu}$-processor based controller. The system has two laser diode drivers for providing high current and low current. High current driver delivers normal output power of diode; low current driver is for providing critical current of diode for long lifetime. Computer simulation and experiment was performed for verification, as the results, developed driver performs well.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 추계 기술심포지움
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• pp.222-225
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• 2001

Optical disk drives read information by replacing a laser beam on the disk track. As information has become larger, the more accurate position control of a laser beam is necessary. In this paper, we report the analysis and fabrication of the micro mirror for optical disk drivers. The mirror was fabricated by using MEMS technology and it's characteristics investigated. Also, electrode structure for reducing squeeze effect was discussed.

• 한국레이저가공학회지
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• 제17권1호
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• pp.17-21
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• 2014

Head up display is in increasing demand for advanced devices in the modern luxury vehicles. It helps drivers focus on driving environment on the road. While HUD technology with LED has advanced, the brightness in daylight can be still an issue to be resolved. Laser light source is a possible solution to overcome the brightness problem and optimal optics design is required for the best performance. Sample design of optics is proposed and detail procedure of lens design evaluation is presented in this paper. The results were characterized by using a ray tracing method and qualitative analysis for spot and DEE is also presented. The overall error or image distortion remained in the target range of $25{\mu}m$ and the simulated image demonstrated possible use in the automotive applications.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2004년도 Asia Display / IMID 04
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• pp.153-156
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• 2004

A newly developed flexible active-matrix (AM-) electrophoretic display (EPD) is reported. The AM-EPD features: (1) low-temperature polycrystalline silicon (LTPS) thin film transistor (TFT) technology, (2) fully integrated scan- and data-drivers, (3) flexibility and light-weight realized by transferring the whole circuits onto a plastic substrate using $SUFTLA^{TM}$ (Surface Free Technology by Laser Annealing/Ablation) process. A large storage capacitor is formed in each pixel so that driving electric field can be kept sufficiently strong during a writing period Two-phase driving scheme, a reset-phase which erases a previous image and a writing-phase for writing a new image, was chosen to cope with EPD's high driving voltage. The flexible AM-EPD has been successfully operated with a driving voltage of 8.5 V.

• 한국정밀공학회지
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• 제19권11호
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• pp.211-220
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• 2002

Optical disk drives read information by replacing a laser beam on the disk track. As information has become larger, the more accurate position control of a laser beam is necessary. In this paper, we report the analysis and fabrication of the micro mirror for optical disk drivers. A coupled simulation of gas flow and structural displacement of the micro mirror using the Finite-Element-Method is applied to this. The mirror was fabricated by using MEMS technology. Especially, the process using the lapping and polishing step after the bonding of the mirror and electrode plates was employed for the Process reliability. The mirror size was 2.5mm${\times}$3mm and it needed about 35V for displacement of 3.2 ${\mu}$.

• 대한임베디드공학회논문지
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• 제6권3호
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• pp.157-167
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• 2011

Although vehicles become more intelligent for convenience and safety of drivers, traffic accidents are increased more and more. Especially, car-to-car single rear impacts in the urban area are increased rapidly because of driver inattention. To prevent rear impacts in the urban area, commercial automobile vendor applies the low-speed short-distance collision warning system. This paper presents low-speed short-distance collision warning algorithm for the city driving by using sensor fusion of laser sensor and ultrasonic sensor. An experiment using embedded microprocessor in the driving track was used to demonstrate the feasibility of the collision warning algorithm.

• Journal of Forest and Environmental Science
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• 제39권4호
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• pp.254-260
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• 2023

A sensor system has been developed that uses an ultrasonic sensor to detect the downhill slope on the side of a forest road and prevents a vehicle-type forest machine from rolling down a mountainside. A specular reflection of ultrasonic wave might cause severe issues in measuring distances to targets. By investigating the installation angle of the sensor to minimize the negative effects of specular reflection, the installation angle of lateral monitoring ultrasonic sensor could be determined based on the width of road shoulder. Obstacles such as small rocks or piece of log in a forest road may cause the forest machine to be overturned while the machine riding over due to excessive its posture change. It was determined that the laser sensor could be a part of a sensor system capable of specifying the location and size of small obstacles. Not only this sensor system including ultrasonic and laser sensors can issue a warning of dangerous sections to drivers in forest forwarders currently in use, but also it can be used as a driving safety sensor in autonomous forest machine or remote-control forest machine in the future.

• 마이크로전자및패키징학회지
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• 제17권4호
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• pp.73-76
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• 2010

A two-facet approach was used to investigate the parametric performance of functional high-speed DDR3 (Double Data Rate) DRAM (Dynamic Random Access Memory) die placed in different types of BGA (Ball Grid Array) packages: wire-bonded BGA (FBGA, Fine Ball Grid Array), flip-chip (FCBGA) and lead-bonded $microBGA^{(R)}$. In the first section, packaged live DDR3 die were tested using automatic test equipment using high-resolution shmoo plots. It was found that the best timing and voltage margin was obtained using the lead-bonded microBGA, followed by the wire-bonded FBGA with the FCBGA exhibiting the worst performance of the three types tested. In particular the flip-chip packaged devices exhibited reduced operating voltage margin. In the second part of this work a test system was designed and constructed to mimic the electrical environment of the data bus in a PC's CPU-Memory subsystem that used a single DIMM (Dual In Line Memory Module) socket in point-to-point and point-to-two-point configurations. The emulation system was used to examine signal integrity for system-level operation at speeds in excess of 6 Gb/pin/sec in order to assess the frequency extensibility of the signal-carrying path of the microBGA considered for future high-speed DRAM packaging. The analyzed signal path was driven from either end of the data bus by a GaAs laser driver capable of operation beyond 10 GHz. Eye diagrams were measured using a high speed sampling oscilloscope with a pulse generator providing a pseudo-random bit sequence stimulus for the laser drivers. The memory controller was emulated using a circuit implemented on a BGA interposer employing the laser driver while the active DRAM was modeled using the same type of laser driver mounted to the DIMM module. A custom silicon loading die was designed and fabricated and placed into the microBGA packages that were attached to an instrumented DIMM module. It was found that 6.6 Gb/sec/pin operation appears feasible in both point to point and point to two point configurations when the input capacitance is limited to 2pF.

• 센서학회지
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• 제11권1호
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• pp.39-47
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• 2002

광 저장장치는 디스크 트랙에 레이저빔을 위치시켜 정보를 저장한다. 정보의 용량이 증대되면서 좀더 높은 저장 밀도를 요구하게 되었고, 그만큼 정밀한 레이저빔의 위치제어가 필요하게 되었다. 본 논문에서는 광 저장장치용 정전형 마이크로 미러를 MEMS기술을 이용해 제조하고 그 특성을 조사하였다. 마이크로 미러는 벌크 마이크로머시닝 기술에 의하여 제조되었으며, 특히 접합공정이 이루어지고 난 후에 연마공정에 의해서 실리콘 웨이퍼의 두께 및 미러면의 형태를 형성하는 공정을 적용함으로서 제현성을 높였다. 제작된 미러의 크기는 $3.0mm{\times}2.5mm$ 이고, 35V에서 변위는 $3.2{\mu}m$ 였다.