• Proceedings of the KWS Conference
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• 1994.05a
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• pp.1-20
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• 1994

In order for manufacturing companies to remain competitive it Is necessary for them to review continually their fabrication methods. The use of power beams for welding and cutting offer significant opportunities for industry to improve its product quality and increase profitability. This paper discusses a number of current industrial applications for electron beam and laser welding.

• Proceedings of the Korean Society of Laser Processing Conference
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• 2004.10a
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• pp.50-61
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• 2004

Nowadays Laser Controllable Thermo-cleaving is the most promising method of cutting FPD(Flat Panel Display) glass in mass-production line. And this method can be used to cut other brittle materials such as quartz, sapphire, ceramic and semiconductor. The concept of this method is shown in Picture 1. Laser beam heats glass up to strain point not to melting point and cooling system chills glass to make maximum thermal stress in glass and then the thermal stress generates micro thermal crack in other words blind crack. Laser Controllable Thermo-cleaving controls the thermal stress to optimize the blind crack up to level of mass-production line.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.934-937
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• 2001

It is well-known that the micro fabrication technology of micro parts are the high energy beam or silicon-based micro machining method such as LIGA Process, Laser machining, photolithography and etching technology. But, for fabricating complex 3-D structure it is better to use mechanical machining. This machining method by the mechanical machine tool with nanometer accuracy is getting attention in some field-especially micro optics machining such as grating, holographic lens, micro lens array, fresnel lens, encoder disk etc.. In this study, we survey the micro fabrication by mechanical cutting method and set up the mechanical micro machining system. And we carried out micro cutting experiments for micro parts with v-shape groove.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.05a
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• pp.767-770
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• 2000

A novel process is newly developed for building RP(Rapid Prototyping) parts using a sheet lamination technique. The build process of existing sheet lamination type RP machines consists of the following steps : feeding, lamination and cutting. In this process, the laminated part of an object is often scratched by a cutter or damaged by a laser beam due to the cutting operation preceded by lamination, In addition, decubing of the unused portion from the laminated block is difficult. In the new process, cutting operation is performed before lamination. The cutting operation takes place while a paper sheet is firmly attached on the plate using electrostatic force. Then liquid glue is applied to the calculated region of the given contour for lamination. The process aims to manufacture a $2k RP machine, what we call the Freeform Mater I, that can use A4 or latter-size used papers. A prototype machine that demonstrates the design concept is built and further research issues are discussed.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.11a
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• pp.524-527
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• 2000

In this paper, we have studied minimization of the burr which occurred after $\mu$-BGA(ball grid array) singulation process, singulation of the multilayer with a pulsed Nd:YAG(266, 532 nm) laser is used to cut the metal layer which doesn't well absorb laser beam. Especially, the photoresist and $N_2$blowing is effective to minimize of the surface demage and burr. In this experiment, the $N_2$ blowing reduces a laser energy loss by debris and suppress a surface oxidation. The SEM(scanning electron microscopes) and non-contact 3D inspector are used to measure cutting line-width and surface demage. The $\mu$-BGA singulation threshold energy is 75.0 J/cm$^2$at 30 ${\mu}{\textrm}{m}$/s scan speed.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.203-203
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• 2012

The SWCNTs network are formed on various plastic substrates such as poly(ethylene terephthalate) (PET), polyimide (PI) and soda lime glass using roll-to-roll printing and spray process. Selective patterning of carbon nanotubes film on transparent substrates was performed using a femtosecond laser. This process has many advantages because it is performed without chemicals and is easily applied to large-area patterning. It could also control the transparency and conductivity of CNT film by selective removal of CNTs. Furthermore, selective cutting of carbon nanotube using a femtosecond laser does not cause any phase change in the CNTs, as usually shown in focused ion beam irradiation of the CNTs. The patterned SWCNT films on transparent substrate can be used electrode layer for touch panels of flexible or flat panel display instead indium tin oxide (ITO) film.

• Journal of Advanced Marine Engineering and Technology
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• v.33 no.7
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• pp.1026-1033
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• 2009

Fine ceramics have high strength, excellent wear resistance, chemical stability and high strength at high temperature and are receiving attention in various fields such as construction, engineering, aerospace and marine science. Finish machining process is required to obtain precise ceramics components because sintering process necessary for obtaining high strength and high quality ceramics reduces the dimensions of components and precision of shape. But high strength and brittleness of ceramics materials cause difficulty in processing. So a process for obtaining wanted dimensions is studying using high temperature which makes ceramics softened and thermal affected recently. Laser beam is a very useful optical device for these kinds of processes. Laser process such as laser cutting, laser machining, laser heat treatment and laser-assisted machining(LAM) is researching to manufacture practical ceramics components using intense laser source which can cause local softening and damage of workpiece. In this paper, microstructural and mechanical properties of silicon nitride heated are studied as a basic study for researching of ceramics process by laser beam. The surface variation of HIP and SSN-silicon nitride was analyzed with SEM and EDS. A processing at $1,300^{\circ}C$ or above causes N element to combine into $N_2$ gas and the gas busts from surface. These phenomena make bloat, craters and heat defects on the surface of silicon nitride. Also, oxygen content is largely increased to oxidize the surface and it causes changing of phases and reducing of hardness of surface.

• Journal of the Korea Computer Industry Society
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• v.8 no.1
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• pp.49-56
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• 2007

Various kind of laser had been used on addition to endoscope for obstetrics and gynecology, gas laser such as CO2 laser had been used mainly much in laparoscope surgical operation mainly Thermal effect of beam displays other result different component parts of cellular tissue and different close of a marketplace of laser beam and priority solidification of temperature increase consists in cellular tissue, and cutting or carbonization process happens and evaporation by breakdown of cellular tissue happens more than $300^{\circ}$. <중략> Ostabilization of pulse transformer by high tension output module of CO2analog laser for obstetrics and gynecology that accomplish marks of honor kind switching and accuracy is required, and stabilize with laser output applying Turn-off in existent hard switching forward converter, on city happened switching damage, damage increase of output diode station recovery special quality, parasitism shock, design and result that manufacture, brought result that improve than existing product. Will be bought to get into superior result if supplement as systematic late.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2006.10a
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• pp.125-134
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• 2006

Process & mechanism $\blacklozenge$ The process consists from two steps which are laser processing step and separation steop. $\blacklozenge$ The wavelength of laser beam is transmissible wavelength for the wafer. However, inside of Si wafer is processed due to temperature dependence of optical absorption coefficient Advantage & Application $\blacklozenge$ Advantages are high speed dicing, no debris contaminants, completely dry process, etc. $\blacklozenge$ The cutting edges were fine, The lifetime and endurances did not degrade the device characteristics $\blacklozenge$ A separation of a wafer with DAF was introduced as an application for SiP

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.9 no.3
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• pp.56-61
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• 2010

Recently, UV pulse laser is widely used in micro machining of the research, development and industry field of IT, NT and BT products because the laser short wavelength provides not only micro drilling, micro cutting and micro grooving which has a very fine line width, but also high absorption coefficient which allows a lot of type of materials to be machined more easily. To analyze the dynamic deformation during a very short processing time, which is nearly about several tens nanoseconds, the commercial Finite Element Analysis (FEA) code, LS-DYNA 3D, was employed for the computitional simulation of the UV laser micro machining behavior for thin copper material in this paper. A finite element model considering high strain rate effect is especially suggested to investigate the micro phenomena which are only dominated by mechanically pressure impact in disregard of thermally heat transfer. From these computational results, some of dynamic deformation behaviors such as dent deformation shapes, strains and stresses distributions were observed and compared with previous experimental works. These will help us to understand micro interaction between UV laser beam and material.