• Journal of the Korean Society for Precision Engineering
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• v.27 no.10
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• pp.23-28
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• 2010

Resistance trimming and cutting processes of printed circuit board by making use of high power UV laser with nano-second pulse width have been proposed and investigated experimentally. Also laser-based application system with high flexibility and complex has been designed and adopted power controller, auto beam size control, auto-focusing and control program developed for ourselves. The function of each module shows that they can be reliable for industrial equipments. Resistance trimming method used a plunge and double cut process with $20{\mu}m$ spot size beam. Results show that double cut process is more effective to control resistance trimming in precision than plunge cut process.

• Proceedings of the Korean Society of Laser Processing Conference
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• 1999.05a
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• pp.18-23
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• 1999

• Proceedings of the Korean Society of Laser Processing Conference
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• 2001.05a
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• pp.16-21
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• 2001

• Journal of the Korean Wood Science and Technology
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• v.24 no.4
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• pp.87-92
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• 1996

When cutting 2.0cm-thick red oak and hard maple with an air-jet-assisted carbon-dioxide laser of 2kW output power, maximum feed speed at the point of full penetration of the beam decreased with increasing the angle between grain and cutting direction. Feed speed averaged 3.75 and 3.38 meters per minute for red oak and hard maple, respectively. Gray-level of laser-cut surfaces were analyzed by image analysis system. The highest gray level of laser-cut surface was obtained when red oak was cut parallel to grain by laser. Surface profiler was used to scan the sawn and laser-cut surfaces. Center line average roughnesses of laser-cut surfaces were higher than those of sawn surfaces. Scanning electron micrographs showed the cell walls which were melted by laser.

• Laser Solutions
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• v.12 no.1
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• pp.25-33
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• 2009

In laser-assisted machining (LAM), laser beam is used to locally increase the temperature of a workpiece and thus to enhance the machinability. In order to set the temperature of the material removal area of a workpiece at an optimal value, process parameters, such as laser power, feed rate, and rotational velocity, have to be carefully controlled. In this work, the effects of laser power and feed rate on the temperature distribution of a silicon nitride rotating at a constant velocity were experimentally investigated. Using a pyrometer, temperatures at various locations of the silicon nitride were measured both in circumferential and axial directions. The measured temperatures were fitted to a quadratic equation to approximate the temperature at the cutting location. The machining results showed that cutting force and tool wear were decreased when the temperature at the cutting location was increased.

• Journal of Electrical Engineering and Technology
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• v.7 no.4
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• pp.576-581
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• 2012

A 23 W continuous wavelength $CO_2$ laser system exited by a high-frequency LCC resonant converter is adapted to cut a biodegradable rope fabricated with polybutylene succinate. As the biodegradable rope consists of three twisted strands, the thickness changes relative to the position of the laser beam and we thus propose a method to determine exact cutting depth. In order to obtain the parameters related to the rope cutting, the experimental and theoretical cutting depths are compared and analyzed for a range of laser heat sources. The melted thickness and groove width of the cut biodegradable rope are also examined. The proposed theoretical cutting depth depends on the incident power and target velocity ratio. From these experimental results, the biodegradable rope with a diameter of 22 mm can be cut with a heat source of 50 J/cm resulting in a melted thickness of 1.96 mm and a groove width of 0.65 mm. The laser system is shown to be perfect tool for the processing of biodegradable rope without the occurrence of raveling.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.9
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• pp.90-97
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• 2002

Ceramics are being increasingly used in industry due to their outstanding physical and chemical properties. But these materials are difficult to machine by traditional machining processes, because they are hard and brittle. Recently, as one of various alternative processes, laser-beam machining is widely used in the cutting of ceramics. Although the use of lasers presents a number of advantages over other methods, one of the problems associated with this process is the uncertain formation of cracks that result from the thermal stresses. This paper presents a Bayesian probabilistic modeling of crack formation over thin alumina plates during laser cutting.

• Laser Solutions
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• v.13 no.2
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• pp.10-16
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• 2010

Laser-assisted machining is dependent on absorbed energy density into workpiece. Generally, the absorptivity of laser beam is dependent on wave length of laser, materials, surface roughness, etc. Various shapes and energy densities for beam irradiation can be used to laser-assisted machining. In this thesis, efficient method of heat source modeling was developed and designed by using one fundamental experimental trials. And then, laser-assisted machining of rod-shaped cast iron was simulated by using commercial FEM code MARC. Simulations and experiments with various conditions were carried out to determine suitable condition of pre-heating for laser-assisted turning process. Temperature distribution of cutting zone could be predicted by simulation.

• Proceedings of the Optical Society of Korea Conference
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• 1990.02a
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• pp.37-41
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• 1990

The quality of cutting surface such as surface roughness, heat affected zone, serf width can be improved by controlling the parameters of cuting process. These parameters includes cutting velocity, laser beam power, material depth and assistant gas. Thermodynamic analysis and systematical experiments are attempted to pedict and determine the optimal cutting condition. There exists the optimal cutting condition to ensure high quality surface. Under this operation, the minimum surface roughness of the mild steel, the stainless steel and the titanium becomes 3.8${\mu}{\textrm}{m}$ 13${\mu}{\textrm}{m}$ and 10${\mu}{\textrm}{m}$ respectively.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2005.05a
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• pp.219-223
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• 2005

Nowadays laser cutting is the most promising method of cutting FPD(Flat Panel Display) glass in mass-production line. And this method can also be used to cut other brittle materials such as quartz, sapphire, ceramic and semiconductor The concept of this method is shown in picture 1. Laser beam heats glass up to strain point, not to melting point and cooling system chills glass to induce maximun thermal stress in glass surface and then the thermal stress generates micro thermal crack, in other words blind depth of crack, along laser beam and cooling line.