• Laser Solutions
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• v.12 no.3
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• pp.7-13
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• 2009

The process of thermal-degradation of thin-film polymeris studied in this work for various laser sources from CW to fs. Samples composed of a thin polymer layer sandwiched between two glass plates are irradiated by the lasers and the threshold irradiance of polymer carbonization is experimentally measured. In the numerical analysis, the transient temperature distribution is calculated and the number density of carbonization in the polymer layer is also estimated. It is shown that pulsed lasers can result in more uniform distribution of temperature and carbonization than the CW laser.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09a
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• pp.521-522
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• 2006

Laser additive direct deposition of metals is a new rapid manufacturing technology, which combines with computer aided design, laser cladding and rapid prototyping. The advanced technology can build fully-dense metal components directly from CAD files with neither mould nor tool. Based on the theory of this technology, a promising rapid manufacturing system called "Laser Metal Deposition Shaping (LMDS)" is being developed significantly. The microstructure and mechanical properties of the LMDS-formed samples are tested and analyzed synthetically. As a result, significant processing flexibility with the LMDS system over conventional processing capabilities is recognized, with potentially lower production cost, higher quality components, and shorter lead time.

• Laser Solutions
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• v.14 no.3
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• pp.7-11
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• 2011

As an active emission display using emissive polymer has had much attention recently, needs for a selective patterning of emissive layer for those displays have been increased abruptly. Therefore, the various laser sources in terms of its wavelength has been used for laser direct patterning. In this work, the feasibility of those processes is examined using numerical analysis and the experimental investigation. A sample has multi-layered structure, emissive polymer on aluminum which is deposited on a glass substrate. Key factors for optimizing the laser patterning of the emissive polymer are considered into the control of ablation products, large-sized particle, and the choice of the appropriate wavelength for minimizing the heat affected zone and the remnant layer.

• Journal of Institute of Control, Robotics and Systems
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• v.21 no.4
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• pp.309-314
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• 2015

In this study, an embedded ranging system based on a laser structured light image is developed. The distance measurement by the structured light image processing has efficient computation because the burdensome correspondence problem is avoidable. In order to achieve robustness against environmental illumination noise and real-time laser structured light image processing, a bandpass optical filter is adopted in this study. The proposed ranging system has an embedded image processor performing the whole image processing and distance measurement, and so reduces the computational burden in the main control system. A system calibration algorithm is presented to compensate for the lens distortion.

• Laser Solutions
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• v.13 no.1
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• pp.16-20
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• 2010

The studies on the fine processing on the surface of the metal utilizing the technique for LST (Laser surface texturing) have been performed recently. This study has acquired the lower frictional coefficient and endurance in the harsh environment of motion in the low lubricating range of low frictional coefficient in addition to storing of lubricant through fine processing on the frictional part of metal.

• Laser Solutions
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• v.14 no.1
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• pp.14-18
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• 2011

Semiconductor industry demands decrease in line/space dimensions of IC substrates. Particularly for IC substrates for CPU, line/space dimensions below $10{\mu}m/10{\mu}m$ are expected to be used in production since 2014. Conventional production technologies (SAP, etc.) based on photolithography are widely agreed to be reaching capability limits. To address this limitation, the embedded circuit fabrication technology using laser ablation has been recently developed. In this paper, we used a nanosecond UV laser and a picosecond UV laser to fabricate embedded circuit patterns into a buildup film with $SiO_2$ powders for IC substrate. We conducted SEM and EDS analysis to investigate surface quality of the embedded circuit patterns. Experimental results showed that due to higher recoil pressure, picosecond UV laser ablation of the buildup film generated a better surface roughness.

• Proceedings of the Korea Information Processing Society Conference
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• 2000.04a
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• pp.846-851
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• 2000

4-state 바코드의 정보는 우편번호, 배달순서코드, 고객 정보 등을 수록되며, 판독율 향상을 위한 오류정정 코드워드를 적용할 수 있다. 이 4-state 바코드는 우편물 자동구분처리의 효율화 및 우편물류의 정보표현, 전달, 처리를 효율적으로 지원되도록 개발하고 있다. 본 논문은 우편물 접수 및 처리과정에서 필요로 하는 4-state 고객 바코드 인쇄규격 검증 및 판독시스템 개발에 관한 것으로 4개의 높이로 구성된 바들의 특성과 바의 두께 및 공간 값이 균일한 간격으로 바가 인쇄되는 특징을 고려하여 Laser Diode 배열방법을 적용하였다. 또한, 우편물을 자동으로 이송시키고, 일정한 영역에 배열한 Laser Diode에 의하여 바의 두께, 공간, 높이 값을 정확하게 판독될 수 있도록 한 것이다.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.10
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• pp.40-44
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• 2010

Laser drilling is an enabling technology for Through Silicon Via (TSV) interconnect applications. Recent advances in picoseconds laser drilling of blind, micron sized vias in silicon is presented here highlighting some of the attractive features of this approach such as excellent sidewall quality. In this study, we dealt with comparison of heat affection around drilled hole between a picosecond laser and a nanosecond laser process under the UV wavelength. Points which special attention should be paid are that picosecond laser process lowered experimentally recast layer, surface debris and micro-crack around hole in comparison with nanosecond laser process. These finding suggests that laser TSV process has possibility to drill under $10{\mu}m$ via. Finally, the laser drilling platform was constructed successfully.

• Current Optics and Photonics
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• v.8 no.4
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• pp.355-365
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• 2024

Wavefront coding (WFC) imaging systems can redistribute the energy of an interference laser spot on an image plane sensor by wavefront phase modulation and reduce the peak intensity, realizing laser protection while maintaining imaging functionality by leveraging algorithmic post-processing. In this paper, a spiral axicon WFC imaging system is proposed, and the performance for laser protection is investigated by constructing a laser transmission model. An Airy disk on an image plane sensor is refactored into a symmetrical hollow ring by a spiral axicon phase mask, and the maximum intensity can be reduced to lower than 1% and single-pixel power to 1.2%. The spiral axicon phase mask exhibits strong robustness to the position of the interference laser source and can effectively reduce the risk of sensor damage for an almost arbitrary lase propagation distance. Moreover, we revealed that there is a sensor hazard distance for both conventional and WFC imaging systems where the maximum single-pixel power reaches a peak value under irradiation of a power-fixed laser source. Our findings can offer guidance for the anti-laser reinforcement design of photoelectric imaging systems, thereby enhancing the adaptability of imaging systems in a complex laser environment. The laser blinding-resistant imaging system has potential applications in security monitoring, autonomous driving, and intense-laser-pulse experiments.

• Laser Solutions
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• v.18 no.1
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• pp.18-22
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• 2015

In this paper, controlling shape of optical fiber tip for endoscope was investigated for eliminating blind spot. The blind spot of endoscope is generated by divergence angle of optical fiber, so it is easy to generate blind spot when tightly focusing. In order to eliminate this region, fiber tip is necessary to be controlled as convex or concave. Illumination simulation of convex and concave type of fiber tip in the endoscope was in progress, so the distance of non- blind region was investigated in each case. As well as the simulation, the tip was fabricated as concave shape by UV laser machining. Then the beam radiation was measured to observe the blind region. The result showed that controlling the fiber tip as convex or concave shape makes the narrow blind region of illumination in endoscope.