• Bulletin of the Korean Chemical Society
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• 제23권2호
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• pp.309-314
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• 2002

The ablation dynamics and cluster formation of $C_n^+$ ions ejected from 355 nm laser ablation of a graphite target in vacuum are investigated using a reflectron time-of-flight (RTOF) mass spectrometer. At low laser fluence, odd-numbered cluster ions with $3{\leq}n{\leq}15$ are predominantly produced. Increasing the laser fluence shifts the maximum size distribution towards small cluster ions, implying the fragmentation of larger clusters within the hot plume. The temporal evolution of $C_n^+$ ions was measured by varying the delay time of the ion extraction pulse with respect to the laser irradiation, providing significant information on the characteristics of the ablated plume. Above a laser fluence of $0.2J/cm^2$ , large cluster ions ($n{\geq}30$) are produced at relatively long delay times, indicating that atoms or small carbon clusters aggregate during plume propagation. The dependence of the intensity of ablated $C_n^+$ ions on delay time after laser irradiation shows that the most probable velocity of each cluster ion decreases with cluster size.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2004년도 추계학술대회
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• pp.1152-1157
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• 2004

Temporal behavior of the laser induced incandescence (LII) signal is often used for soot particle sizing, which is possible because the cooling behavior of a laser heated particle is dependent on the particle size. In present study, LII signals of soot particles are modeled using two non-linear coupled differential equations deduced from the energy- and mass-balance of the process. The objective of this study is to see the effects of particle size, laser fluence on soot temperature characteristics and cooling behavior. Together with this, we focus on validating our simulation code by comparing with other previous results. Results of normalized LII signals obtained from various laser fluence conditions showed a good agreement with that of Dalzell and Sarofim's. It could be found that small particles cool faster at a constant laser fluence. And it also could be observed that vaporization is dominant process of heat loss during first 100ns after laser pulse, then heat conduction played most important role while thermal radiation had little influence all the time.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2006년도 춘계학술대회 논문집
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• pp.657-658
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• 2006

Although there are many numerical models to simulate fs laser ablation of metals, no model can analyze the ablation phenomena over a wide range of fluence. In this work, a numerical code for simulating the fs laser ablation phenomena of metals has been developed. The two temperature model is employed to predict the ablation rate and the crater shape of metals using phase explosion mechanism in the relatively high fluence regime. Also, the ultrashort thermoelastic model is used for the low fluence regime to account for spallation of the sample by high strain rate. It has been demonstrated that the thermoelastic stress generated within the sample can exceed the yield stress of the material even near the threshold fluence. Numerical computation results are compared with the experiment for Cu and Ni and show good agreement. Discussions are made on the hydrodynamic model considering phase change and hydrodynamic flow.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1999년도 하계학술대회 논문집 D
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• pp.1849-1851
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• 1999

The PDP(Plasma Display Panel) barrier rib was fabricated by focused $Ar^+$ laser ($\lambda$=514nm) and Nd:YAG($\lambda$=532, 266 nm) laser irradiation. The depth of the etched groove increases with increasing a laser fluence. and decreasing a scan speed. Using the second harmonic of the Nd:YAG laser, the threshold laser fluence was $6.5mJ/cm^2$ for the sample of PDP barrier rib dried at $120^{\circ}C$. The thickness of $150{\mu}m$ of the sample on the glass was etched without any damage on the glass substrate by fluence of $19.5J/cm^2$. The barrier rib sample on hot plate was etched by Nd:YAG laser(532 nm) as increasing a temperature of the sample. In this case, the etch rate was $95{\mu}m/s$, $190{\mu}m/s$ at room temperature, $175^{\circ}C$ respectively.

• 한국정밀공학회지
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• 제24권2호
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• pp.134-139
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• 2007

Usually nanosecond pulsed laser processing of metal is mainly affected by the thermal ablation. Many studies of the theoretical analysis and modeling to predict the laser ablation of metal are suggested on the basis of the photothermal mechanism at higher laser fluence. In this paper, we investigate the etching depth and laser fluence of laser ablation of copper foils and propose the simplified SSB Model(Srinivasan-Smrtic-Babu model) to study the photothermal effect of nanosecond pulsed laser ablation. The experimental results show that the photothermal ablation of the 355nm DPSS $NdYVO_{4}$ laser is useful to process the copper thin foils.

• 한국레이저가공학회지
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• 제5권2호
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• pp.31-38
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• 2002

This paper describes the process of nanoparticle synthesis by laser ablation of consolidated microparticles. We have generated nanoparticles by high-power pulsed laser ablation of Al, Cu and Ag microparticles using a Q-switched Nd:YAG laser (wavelength 355 nm, FWHM 5 ㎱, fluence 0.8∼2.0 J/㎠). Microparticles of mean diameter 18∼80 ㎛ are ablated in the ambient air The generated nanoparticles are collected on a glass substrate and the size distribution and morphology are examined using a scanning electron microscope and a transmission electron microscope. The effect of laser fluence and collector position on the distribution of particle size is investigated. The dynamics of ablation plume and shock wave is analyzed by monitoring the photoacoustic probe-beam deflection signal. Nanosecond time-resolved images of the ablation process are also obtained by laser flash shadowgraphy. Based on the experimental results, discussions are made on the dynamics of ablation plume.

• Bulletin of the Korean Chemical Society
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• 제13권5호
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• pp.553-556
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• 1992

The ${CO}_2$ laser absorption measurement of ${CH}_3{CH}_2Br$ utilizing photoacoustic (PA) technique was performed using a cw and a pulsed ${CO}_2$ lasers. The absorption profile in the ${CO}_2$ laser wavelength region (9-10 ${\mu}$m) and the macroscopic small signal absorption cross section at 10P(20) (10.59 ${\mu}$m, 944 $cm^{-1}$) laser line were measured using a cw ${CO}_2$ laser. The laser fluence dependence on infrared multiphoton absorption (IRMPA) was also studied with a pulsed TEA ${CO}_2$ laser at 10P(20) laser line. In view of monotonic increase of PA signal with the rise of laser fluence, it was suggested that the anharmonicity in pumped vibration mode did not restrict ir multiphoton absorption in ${CH}_3{CH}_2Br$ system as found in large molecular system.

• Bulletin of the Korean Chemical Society
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• 제12권6호
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• pp.652-658
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• 1991

The effect of intermolecular collisions in the infrared multiphoton dissociation (IRMPD) of difluorochloromethane was investigated using He, Ar, and $N_2$ as buffer gases. The reaction probability for IRMPD of difluorochloromethane was measured as a function of laser fluence and the buffer gas pressure under unfocused beam geometry. It was observed that the reaction probability was initially enhanced with the increase of buffer gas pressure up to about 20 torr, but showed a decline at higher pressures. The reaction probability increases monotonically with the laser fluence, but the rate of increase diminishes at higher fluences. An attempt was made to simulate the experimental results by the method of energy grained master equation (EGME). From the parameters that fit the experimental data, the average energy loss per collision, $<{\Delta}E>_d$, was estimated for the He, Ar, and $N_2$ buffer gases.

• 반도체디스플레이기술학회지
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• 제8권4호
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• pp.31-36
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• 2009

In this paper, the laser cutting characteristics of the flexible PCB using high power Nd:YAG UV laser were investigated. A specific FPCB model was selected for the experiment. Test sheets were made, which had equal materials and layer structure to those of the outline (OL) region and the contact pad (CP) region in the FPCB. The experiment is made up of two stages. In the first stage of the experiment, the laser cutting fluence was found, which is the threshold fluence to cut the test sheets completely. The laser cutting fluence of the OL sheet is $1781.26{\sim}1970.16\;J/cm^2$ and that of the CP sheet is $2109.34{\sim}2134.34\;J/cm^2$. In the second stage, cutting performance and its qualities were analyzed by the experiment. The laser cutting performance remained almost unchanged for all laser and process parameter sets. The average cutting width (top side/bottom side) of the OL sheet was $40.45\;{\mu}m/11.52\;{\mu}m$ and that of the CP sheet was $22.14\;{\mu}m/10.93\;{\mu}m$. However, the laser cutting qualities were different according to the parameters. The adjacent region of the cutting line on the OL sheet was carbonized as the beam speed was low and the overlap coefficient was high. The surface quality around the cutting line of the CP sheet was about the same. Carbonization and debris occurred on the surface of the cutting line. As a result of the experiment, the cutting qualities were better as the overlap coefficient was made low and beam speed high. Therefore, the overlap coefficient 2 or 3 is proper for the FPCB laser cutting.

• 한국전기전자재료학회논문지
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• 제13권6호
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• pp.526-532
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• 2000

The paste on the glass or fabrication of the PDP(Plasma Display Panel) barrier rib was selectively etched using focused A $r_{+}$ laser(λ=514 nm) and Nd:YAG(λ=532, 266 nm) laser irradiation. The depth of the etched grooves increase with increasing a laser fluence and decreasing a laser beam scan speed. Using second harmonic of Nd:YAG laser(532 nm) the etching threshold laser fluence was 6.5 mJ/c $m^2$ for the sample of PDP barrier rib. The thickness of 180 ${\mu}{\textrm}{m}$ of the sample on the glass was clearly removed without any damage on the glass substrate by fluence of 19.5J/c $m^2$beam scan speed of 20${\mu}{\textrm}{m}$ /s. In order to increase the etch rate of the barrier rib material barrier rib samples heated by a resistive heater during laser irradiation. The heated sample has many defects and becomes to be fragile. This imperfection of the structure compared to the sample without heat treatment allows the effective etching by the focused laser beam. The etch rates were 65${\mu}{\textrm}{m}$/s and 270 ${\mu}{\textrm}{m}$/s at room temperature and 20$0^{\circ}C$, respectively.y.