• 제목/요약/키워드: Large grinding machine

검색결과 25건 처리시간 0.024초

로타리 연삭에 의한 대직경 Si-wafer의 ELID 경면 연삭특성 (Characteristic of Mirror Surface ELID Grinding of Large Scale Diametrical Silicon Wafer with Rotary Type Grinding Machine)

  • 박창수;김원일;왕덕현
    • 한국공작기계학회논문집
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    • 제11권5호
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    • pp.58-64
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    • 2002
  • Mirror surface finish of Si-wafers has been achieved by rotary in-feed machining with cup-type wheels in ELID grinding. But the diameter of the workpiece is limited with the diameter of the grinding wheel in the in-feed machining method. In this study, some finding experiments by the rotary surface grinding machine with straight type wheels were conducted, by which the possible grinding area of the workpiece is independent of the diameter of the wheels. For the purpose of investigating the grinding characteristics of large scale diametrical silicon wafer, grinding conditions such as rotation speed of grinding wheels and revolution of workpieces are varied, and grinding machine used in this experiment is rotary type surface grinding m/c equipment with an ELID unit. The surface ground using the SD8000 wheels showed that mirror like surface roughness can be attained near 2~6 nm in Ra.

로타리 연삭에 의한 대직경 Si-wafer의 ELID 경면 연삭특성 (Characteristic of Mirror Surface ELID Grinding of Large Scale Diametrical Silicon Wafer with Rotary Type Grinding Machine)

  • 박창수;김원일;이윤경;왕덕현;김경년
    • 한국공작기계학회:학술대회논문집
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    • 한국공작기계학회 2002년도 춘계학술대회 논문집
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    • pp.660-665
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    • 2002
  • Mirror surface finish of Si-wafers has been achieved by rotary in-feed machining with cup-type wheels in ELID grinding. But the diameter of the workpiece is limited with the diameter of grinding wheel in the in-feed machining method. In this study, grinding experiments by the rotary surface grinding machine with straight type wheels ware conducted, by which the possible grinding area of the workpiece is independent of the diameter of the wheels. For the purpose of investigating the grinding characteristics of large scale diametrical silicon wafer, grinding conditions such as rotation speed of grinding wheels and revolution of workpieces are varied, and grinding machine used in this experiment is rotary type surface grinding n/c equipment with an ELID wit. The surface ground using the SD8000 wheels showed that mirror like surface roughness can be attained near 2 - 6 nm in Ra.

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스트레이트 숫돌에 의한 대직경 Si-wafer의 ELID 경면연삭 (Mirror Surface ELID Grinding of Large Scale Diametral Silicon Wafer with Straight Type Wheel)

  • 박창수;김경년;김원일
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2001년도 춘계학술대회 논문집
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    • pp.946-949
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    • 2001
  • Mirror surface finish of Si-wafers has been achieved by rotary in-feed machining with cup-type wheels in ELID grinding. But the diameter of the workpiece is limited with the diameter of the grinding wheel in the in-feed machining method. In this study, some grinding experiments by the rotary surface grinding machine with straight type wheels were conducted, by which the possible grinding area of the workpiece is independent of the diameter of the wheels. For the purpose of investigating the grinding characteristics of large scale diametral silicon wafer, grinding conditions such as rotation speed of grinding wheels and revolution of workpiece are varied, and grinding machine used in this experiment is rotary type surface grinding m/c equipped with an ELID unit. The surface ground using the SD8000 wheels showed that mirror like surface roughness can be attained near 2~6nm in Ra.

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가변 공기압력 초경면 연마기의 성능 특성에 관한 연구 (A Study on Performance Characteristics of Super-mirror Face Grinding Machine Using Variable Air Pressure)

  • 배명환;정화
    • 한국자동차공학회논문집
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    • 제21권2호
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    • pp.9-16
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    • 2013
  • The comparisons of performance characteristics between the super-mirror face grinding machine using variable air pressure developed in this laboratory to grind precisely the sliding face of a surface hardened workpiece with thermal spray and the conventional one are investigated by measuring the surface roughness and hardness for a SCM440. To process variously workpiece according to shape, size and materials, the rotating and contacting forces of the developed grinding machine can be changed by air pressure. The surface roughness of processed workpiece can be also attained to state of mirror face by grinding precisely the sliding face with changing the rotating speed of diamond wheel. It is possible to be attached to the various machine tools because the super-mirror face grinding machine using variable air pressure is a small size. The grinding efficiency is elevated because it can be worked by two or more grinding machines attached to concurrently a machine tool for the large workpiece. In this study, results show that the cusp height of the super-mirror face grinding machine for the particle size of 100 and $1500No./mm^2$ is lower than that of the conventional one because the vibration is reduced by rotating very fast the diamond wheel with a pressed air and it can be processed by rotating the diamond wheel with a constantly varied air pressure perpendicular to workpiece surface, and that the workpiece in the super-mirror face grinding machine for the particle size of $3000No./mm^2$ can be processed to state of mirror face that is rarely seen by the cusp height. It is also found that the surface hardness of both the conventional and the super-mirror face grinding machines are increased as the particle size of diamond wheel is reduced, and the surface hardness of the super-mirror face grinding machine is HRC 1.1 ~ 1.8 higher than that of the conventional one.

연삭가공 트러블슈팅을 위한 룰베이스 구성의 기초 (Basic Construction of Rule-Base for Grinding Trouble-shooting)

  • 이재경
    • 한국공작기계학회:학술대회논문집
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    • 한국공작기계학회 1999년도 추계학술대회 논문집 - 한국공작기계학회
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    • pp.492-497
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    • 1999
  • Cognition and control of grinding trouble occurring during the grinding process are classified into a quantitative knowledge which depends on experimental data and qualitative knowledge which relies on skillful engineers. Grinding operations include a large number of functional parameters, since there are several ways of coping with grinding trouble. One is the qualitative method which depends on empirical knowledge utilizing the skilful experts from the workshop, the other is the quantitative method which utilizes the experimental data obtained by sensor. But, they are all difficult to accomplish from the grinding trouble-shooting system. The reason is that grinding troubles are not easily controlled in the quantitative method, and therefore, trouble-shooting has mainly relied on the knowledge of skilful engineers. Thus, there is an important issue of how a grinding trouble-shooting system can be designed and what knowledge is utilized among the large amount of grinding trouble information. In this paper, basic strategy to develop the grinding database of rule-based rule, which is strongly depended upon experience and intuition, is described.

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Model-based process control for precision CNC machining for space optical materials

  • Han, Jeong-yeol;Kim, Sug-whan;Kim, Keun-hee;Kim, Hyun-bae;Kim, Dae-wook;Kim, Ju-whan
    • 한국우주과학회:학술대회논문집(한국우주과학회보)
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    • 한국우주과학회 2003년도 한국우주과학회보 제12권2호
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    • pp.26-26
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    • 2003
  • During fabrication process for the large space optical surfaces, the traditional bound abrasive grinding with bronze bond cupped diamond wheel tools leaves the machine marks and the subsurface damage to be removed by subsequent loose abrasive lapping. We explored a new grinding technique for efficient quantitative control of precision CNC grinding for space optics materials such as Zerodur. The facility used is a NANOFORM-600 diamond turning machine with a custom grinding module and a range of resin bond diamond tools. The machining parameters such as grit number, tool rotation speed, work-piece rotation speed, depth of cut and feed rate were altered while grinding the work-piece surfaces of 20-100 mm in diameter. The input grinding variables and the resulting surface quality data were used to build grinding prediction models using empirical and multi-variable regression analysis methods. The effectiveness of the grinding prediction model was then examined by running a series of precision CNC grinding operation with a set of controlled input variables and predicted output surface quality indicators. The experiment details, the results and implications are presented.

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Effects of the Grinding Conditions on the Machining Elasticity Parameter

  • Kim, Kang
    • International Journal of Precision Engineering and Manufacturing
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    • 제4권3호
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    • pp.62-67
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    • 2003
  • The grinding force generated during the grinding process causes an elastic deformation of the workpiece, grinding wheel, and machine system. Thus, the true depth of cut is always smaller than the apparent depth of cut. This is known as machining elasticity phenomenon. The machining elasticity parameter is defined as a ratio between the true depth of cut and the apparent depth of cut. It is an important factor to understand the material removal mechanism of the grinding process. To increase productivity, the value of this machining elasticity parameter must be large. Therefore, it is essential to know the characteristics of this parameter. The objective of this research is to study the effect of the major grinding conditions, such as table speed, depth of cut, on this parameter experimentally, Through this research, it is found that this parameter value is increasing when the table speed is decreasing or the depth of cut is increasing. Also, this parameter value depends on the grinding mode (up grinding, down grinding).

다이아몬드 휠에 의한 세라믹 연삭의 연삭력 평가 (Evaluation on Grinding Force of Ceramic Grinding by the Diamond Wheel)

  • 문홍현;김성청;공재향;박병규;소의열
    • 한국공작기계학회:학술대회논문집
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    • 한국공작기계학회 2002년도 춘계학술대회 논문집
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    • pp.43-47
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    • 2002
  • In this study, through the experimental results of grinding ratio, grinding force and surface roughness with the obtained wear amount of diamond wheel and ceramic material during the grinding process, the following conclusions could be found. In the case of $Si_3N_4$, the wear of diamond wheel is large while the grinding force is stable and the range of change in surface roughness is small. for the case of $AL_2O_3$ and $ZrO_3$, while the wear of diamond wheel is getting smaller, the grinding force is increasing but the value of surface roughness is decreasing. For grinding with the vitrified bond wheel, it seems that the self-sharpening can be found for $Si_3N_4$ and the glazing effect of the cutting edge for $AL_2O_3$ and $ZrO_3$.

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