• Journal of the Korean Society of Fisheries and Ocean Technology
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• v.48 no.3
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• pp.277-283
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• 2012

The characteristics of abrasive wear on sliding speed of glass fiber reinforcement (GF/PUR) composites were investigated at ambient temperature by pin-on-disc friction test. The cumulative wear volume, friction coefficient and surface roughness of these materials on sliding speed were determined experimentally. The major failure mechanisms were lapping layers, deformation of resin, ploughing, delamination, and cracking by scanning electric microscopy (SEM) photograph of the tested surface. As increasing the sliding speed the GF/PUR composites indicated higher friction coefficient. The surface roughness of the GF/PUR composites was increased as the sliding speed was higher in wear test.

• Journal of the Korean Society of Fisheries and Ocean Technology
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• v.49 no.4
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• pp.492-499
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• 2013

The characteristics of abrasive wear of the rubber matrix composites filled with nano sized silica particles were investigated at ambient temperature by pin-on-disc friction test. The range of volume fraction of silica particles tested are between 11% to 25%. The cumulative wear volume and friction coefficient of these materials on particle volume fraction were determined experimentally. The major failure mechanisms were lapping layers, deformation of matrix, ploughing, deboding of particles and microcracking by scanning electric microscopy photograph of the tested surface. The cumulative wear volume showed a tendency to increase nonlinear with increase of sliding distance. As increasing the silica particles of these composites indicated higher friction coefficient.

• Transactions of the Korean Society of Mechanical Engineers
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• v.5 no.4
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• pp.338-346
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• 1981

Honing, lapping, polishing and superfinishing are applied for a precision machining to finish the metal surface, but these precision machining are micro-cutting by hard and micro-abrasive grains. Frictional machining is the new method to finish mirrorlike surface without using those abrasive grains. The frictional machining produces high pressure and high temperature instantly by compressing a tool material against the metal surface in sliding motion. The metal surface is given plastic deformation and plastic flow by the above mentioned frictional motion, but the surface roughness of the metal surface is influenced by physical and chemical reaction in surrounding atmosphere. Therefore, the atmosphere around the metal optimum atmosphere in the frictional machining. The part 1 of the study was performed in liquid atmospheres. Diesel oil, lubricant, grease, lard oil, bean oil and cutting fluid were used as such atmospheres. Medium carbon steel SM 50 C was used as a workpiece and ceramic tip was applied as a frictional tool. The result of the experiment showed characteristic machining conditions to generate the best surface roughness in each atmospheres.

• Journal of the Korean Society of Fisheries and Ocean Technology
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• v.46 no.4
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• pp.495-502
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• 2010

The effect of load and sliding speed on abrasive wear characteristics of glass fiber/polyurethane (GF/PUR) composites were investigated at ambient temperature by pin-on-disc friction test. The friction coefficient, cumulative wear volume and surface roughness of these materials against SiC abrasive paper were determined experimentally. Experimental results showed that the surface roughness of the GF/PUR composites was increased as applied load was higher in wear test. The cumulative wear volume tended to increase nonlinearly with increase of sliding distance and depended on applied load and sliding speed for these composites. It could be verified by scanning electric microscopy (SEM) photograph of surface tested that major failure mechanisms were lapping layers, ploughing, delamination, deformation of resin and cracking.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2019.11a
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• pp.139-140
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• 2019

In this study, we conducted a comparative analysis of the effects of resuscitation after the re-application of mortar with much FA replacement on the degree of resuscitation. Results When NaOH was applied to the top of the mortar where 90% of FA was replaced, and maintained for 24 hours, the degree of resuscitation at $40^{\circ}C$ was completely improved. However, when medium curing was carried out, it showed a higher degree of compression than water or lapping curing at 10 MPa in 28 days. The degree of resuscitation on the 28th day was revived from around 10% of the normal level to about 20~30%, and it was analyzed that it was difficult to achieve the OPC reduction by any method.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.10
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• pp.26-33
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• 2004

Ultra precision grinding technology has been developed from the refinement of the abrasive, the development of high stiffness equipment and grinding skill. The conventional wafering process which consists of lapping, etching, 1 st, 2nd and 3rd polishing has been changed to the new process which consists of precision surface grinding, final polishing and post cleaning. Especially, the ultra precision grinding of wafer improves the flatness of wafer and the efficiency of production. Furthermore, it has been not only used in bare wafer grinding, but also applied to wafer back grinding and SOI wafer grinding. This paper focuses on the flatness of the ground wafer. Generally, the ground wafer has concave pronto because of the difference of wheel path density, grinding temperature and elastic deformation of the equipment. Wafer tilting is applied to avoid non-uniform material removal. Through the geometric analysis of wafer grinding process, the profile of the ground wafer is predicted by the development of profile simulator.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.98-101
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• 2003

As the ultra precision grinding can be applied to wafering process by the refinement of the abrasive. the development of high stiffness equipment and grinding skill, the conventional wafering process which consists of lapping, etching, 1st, 2nd and 3rd polishing could be exchanged to the new process which consists of precision surface grinding, final polishing and post cleaning. Especially, the ultra precision grinding of wafer improves the flatness of wafer and the efficiency of production. Futhermore, it has been not only used in bare wafer grinding, but also applied to wafer back grinding and SOI wafer grinding. This paper focused on the flatness of the ground wafer. Generally, the ground wafer has concave profile because of the difference of wheel path density, grinding temperature and elastic deformation of the equiptment. Tilting mathod is applied to avoid such non-uniform material removes. So, in this paper, the geometric analysis on grinding process is carried out, and then, we can predict the profile of th ground wafer by using profile simulation.

• Journal of the Korean Society of Fisheries and Ocean Technology
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• v.50 no.2
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• pp.162-168
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• 2014

The friction and wear characteristics of the rubber matrix composites filled with nano sized silica particles were investigated at ambient temperature by pin-on-disc friction test. The volume fraction of silica particles was 19%. The cumulative wear volume and wear rate of these materials on counterpart roughness were determined experimentally. The major failure mechanisms were lapping layers, deformation of matrix, ploughing, debonding of particles, fracture of particles and microcracking by scanning electric microscopy photograph of the tested surface. The cumulative wear volume showed a tendency to increase with increase of sliding distance. The wear rate of these composites tested indicated low value as increasing the sliding distance.

• Journal of Sensor Science and Technology
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• v.11 no.1
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• pp.54-59
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• 2002

This paper describes a new process technique for batch process of SOI(Si-on-Insulator) structures with buried cavities for MEMS(Micro Electro Mechanical System) applications by SDB(Si-wafer Direct Bonding) technology and electrochemical etch-stop. A low-cost electrochemical etch-stop method is used to control accurately the thickness of SOI. The cavities were made on the upper handling wafer by Si anisotropic etching. Two wafers are bonded with an intermediate insulating oxide layer. After high-temperature annealing($1000^{\circ}C$, 60 min), the SDB SOI structure with buried cavities was thinned by electrochemical etch-stop. The surface of the fabricated SDB SOI structure have more roughness that of lapping and polishing by mechanical method. This SDB SOI structure with buried cavities will provide a powerful and versatile substrate for novel microsensors arid microactuators.

• Journal of the Korean Institute of Telematics and Electronics
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• v.27 no.2
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• pp.81-92
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• 1990

We developed the technologies of wuperlattice and HEMT structures grown by MOCVD, and their characterization. In the case of GaAs/AlGaAs superlattice, the periodicity, interface abruptness and Al compositional uniformity were confirmed through the shallow angle lapping technique and double crystal x-ray measurement. Photoluminesence spectra due to quantum size effect of isolated quantum wells were also observed. The heterojunction abruptness was estimated to be within 1 monolayer fluctuation by the analysis of the relation between PL FWHM(Full Width at Half Maximum) and well width. HEMT structure was successfully grown by MOCVD. The 2 dimensional electron gas formation at heterointerface in HEMT structure were evidenced through the C-V profile, SdH (Shubnikov-de Haas)oscillation and low temperature Hall measurement. Low field mobility were as high as $69,000cm^2/v.sec$ for a sheet carrier density of $5.5{\times}10^{11}cm^-2$ at 15K, and $41,200cm^2/v.sec$ for a sheet carrier density of $6.6{\times}10^{11}cm^-2$ at 77K. In addition, well defined SdH oscillation and quantized Hall plateaues were observed.