• Journal of the Korean Society for Precision Engineering
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• v.10 no.1
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• pp.147-152
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• 1993

The lapping characteristics of single crystal diamond are studied by considering the crystallographic anisotropy. It is introduced for lapping method to identify crystallographic orientantion by the X-ray diffraction and to measure lapping force ratio, lapping temperature and lapping wear. Diamound bonded wheels are used for lapping under dry condition. On the lapping {110} and {100} planes, it shows remarkable crystallographic anistropy. The lapping force ratio, temperature and wear become gerater with sliding direction along the <100> than along <110>. The results also show that the wear of diamond is influenced by mechanical work(tangential lapping force * lapping distance) as well by lapping speed.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.29 no.4 s.235
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• pp.632-638
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• 2005

The surface lapping process on sapphire wafer was carried out for the epitaxial process of thin film growth of GaN semiconducting material. The planarization of the wafers was investigated by the introduction of the dummy wafers. The diamond lapping process causes the surface deformation of dislocation and micro-cracks. The material deformation due to the mechanical stress was analyzed by the X-ray diffraction and the Vickers indentation. The fracture toughness was increased with the increased annealing temperature indicating the recrystallization at the surface of the sapphire wafer The sudden increase at the temperature of $1200^{\circ}C$ was correlated with the surface phase transition of sapphire from a $-A1_{2}O_{3}\;to\;{\beta}-A1_{2}O_{3}$.

• Journal of the Korean Society for Heat Treatment
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• v.2 no.2
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• pp.33-37
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• 1989

In order to improve hardness uniformity of standard-hardness blocks. experimental procedure was designed using Taguchi Method. For this purpose the following factors were studied: austenitizing temperature, tempering condition, grinding condition, subzero treatment, lapping time, $15{\mu}m$ polishing time, final polishing time. These factors were processed and then ten hardness values were measured on each specimen. SN (signal to noise) ratio for each condition was calculated with standard variations of these values. Finally, from the calculated value of ANOVA on SN ratios, the lapping time was found to be the main factor Better uniformity with longer lapping time implies that residual stress that was formed after quenching is a dominent parameter that affects on the uniformity of hardness. Therefore, step-quenching method was adapted to minimize the residual stress. By this modification of quenching procedure, the hardness uniformity was improved remarkably and the yield ratio was increased from 55% to 88%.

• Journal of the Korean Society for Precision Engineering
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• v.25 no.7
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• pp.47-54
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• 2008

Recently, application of ceramics has increased gradually due to excellent mechanical properties. Si3n4-BN ceramic which is one of ceramics is very hard and has superior resistance against volatile temperature and wear. However, extremely high hardness of the $Si_3N_4-BN$ ceramic makes conventional machining very difficult. Therefore, the use of machinable ceramic has been in a poor because of difficult industrial processes in spite of many advantages. And so new technology being called IED(In-process electrolytic dressing) was introduced to solve this problem. The aim of this study is to determine the machining characteristics in terms of pressurized weight to the workpiece and the influence with h-BN content using IED lapping system. Also, Acoustic Emission (AE) is used for the monitoring of surface characteristics.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.11 no.5
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• pp.218-223
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• 2001

The chemical-mechanical polishing process was carried out for 2"-dia. sapphire wafer grown by horizontalBridgman method on the urethane lapping pad with the silica sol. The polished wafer shows the full-width at halfmaximum of 200~400 arcsec in double-crystal X-ray diffraction, indicating that the slicing, grinding and lapping processes before the polishing process affected the crystalline structural property of the wafer surface by the mechanical residual stress. For the inclusion of surface treatments after chemical-mechanical polishing such as the thermal annealing at the temperature of $1,200^{\circ}C$for 4 hrs. and chemical etching, the crystalline quality was sigdicantly enhanced with the reduced full-width at half maximum up to 8.3 arcsec.arcsec.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.7 no.2
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• pp.59-65
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• 1982

In this paper, the CdS single crystal, which was grown as piper-polish method, was Ion-bombarded with Sb and In, and the thermally stimulated current of the spot that was Ionbombarded was measured. In the sample which was individually bombarded by Sb and In, the over-lapping peak was found, this over lapping peak was separated, by the method of thermal cleaning, showing the trap levels of 0.25(eV) and 0.31(eV) at the temperature of 147(K) and 181(K). While the spot is being cooled down and excited with photolight at the same time, the trap level 0.25(eV) disappeared and the new trap level of 0.85(eV) appeared. It can be said that the better photo-conductive crystals, the T.S.C is better measured.

• Proceedings of the IEEK Conference
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• 2000.06b
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• pp.68-71
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• 2000

In this paper, we have measured the oxygen contents by FTIR in silicon wafer various process technology(slicing, lapping, polishing). The measured data are also compared with the data of etching process(KOH, Bright etching). Also we have measured the surface morpology in backside silicon wafer after etching treatment and etch pit density due to OISF after 4 step high temperature annealing process with optical microscope.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2008.11a
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• pp.21-25
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• 2008

In this paper, the temperature history and the strength development of concrete corresponded to various bubble sheets layer and curing temperature. Based on the results, In case of the test temperature of -5℃, concrete subject in the exposure condition, result in a frost damage at initial stage by a fall of below zero temperature. In case of the combination of PE film and non woven fabric was after 36 hour, and combination of bubble sheet over double, a tremendous insulating effect of bubble sheet over double is confirmed due to the temperature of concrete fall of below zero temperature after 60 hours. Meanwhile, regarding the -15℃ of temperature, special measure for insulation curing is necessary to secure stability against early frost damage because frost damage was not affected by the lapping thickness of bubble sheet subjected to severe cold weather condition.

• Journal of the Korean institute of surface engineering
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• v.33 no.2
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• pp.101-106
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• 2000

SOI (Silicon-On-Insulator) substrates were fabricated with varying annealing temperature of $25-660^{\circ}C$ by a linear annealing method, which was modified RTA process using a linear shape heat source. The annealing method was applied to Si ∥ $SiO_2$/Si pair pre-contacted at room temperature after wet cleaning process. The bonding strength of SOI substrates was measured by two methods of Razor-blade crack opening and direct tensile test. The fractured surfaces after direct tensile test were also investigated by the optical microscope as well as $\alpha$-STEP gauge. The interface bonding energy was 1140mJ/m$^2$ at the annealing temperature of $430^{\circ}C$. The fracture strength was about 21MPa at the temperature of $430^{\circ}C$. These mechanical properties were not reported with the conventional furnace annealing or rapid thermal annealing method at the temperature below $500^{\circ}C$. Our results imply that the bonded wafer pair could endure CMP (Chemo-Mechanical Polishing) or Lapping process without debonding, fracture or dopant redistribution.

• Journal of the Korean Society of Fisheries and Ocean Technology
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• v.47 no.3
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• pp.267-272
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• 2011

The behavior of abrasive wear on counterpart roughness of glass fiber reinforcement polyurethane resin (GF/PUR) composites were investigated at ambient temperature by pin-on-disc friction test. The friction coefficient, cumulative wear volume and surface roughness of these materials against SiC abrasive paper were determined experimentally. The major failure mechanisms were lapping layers, ploughing, delamination, deformation of resin and cracking by scanning electric microscopy (SEM) photograph of the tested surface. As increasing the counterpart roughness the GF/PUR composites indicated higher friction coefficient. The surface roughness of the GF/PUR composites was increased as the sliding velocity was higher and the counterpart roughness was rougher in wear test.