• Title/Summary/Keyword: Lamination process

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Accuracy Improvement in Transfer-Type Variable Lamination Manufacturing Process using Expandable Polystyrene Foam and Experimental Verification (단속형 가변 적층 쾌속 초형 공정(VLM-ST)을 위한 정밀도 향상에 관한 연구 및 실험적 검증)

  • Choe, Hong-Seok;An, Dong-Gyu;Lee, Sang-Ho;Yang, Dong-Yeol
    • Journal of the Korean Society for Precision Engineering
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    • v.19 no.7
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    • pp.97-105
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    • 2002
  • The use of rapid prototyping (RP) has reduced time to market, cut total costs and improved product quality by giving design and manufacturing teams the opportunity to verify and fine tune designs before committing them to expensive tooling and fabrication. In order to improve their unique characteristics according to the working principles, Variable Lamination Manufacturing process (VLM-ST) and corresponding CAD/CAM software (VLM-Slicer) is developed. The objective of this study is to improve the accuracy of VLM-ST process, and it can be done by offset fur cutting error correction, cutting path overrun fur sharp edge and reference shape generation for off-line stacking. It has been shown that, through the verification experiments for given practical shapes, the proposed algorithms are effective for diverse categories of three-dimensional shapes.

Enhancement of Transmittance and Adhesion of Flexible Display Adhesion Surface by Bubble Removing Process (기포 제거 공정을 통한 유연한 디스플레이 합착 면의 투과율 및 접착력 향상)

  • Kim, Jungsoo;Jang, Kyungsoo;Phu, Cam;Park, Heejun;Shin, Donggi;Lee, Younjung;Yi, Junsin
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.31 no.5
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    • pp.330-334
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    • 2018
  • With the development of the Internet of Things, the use of flexible displays has become widespread. In particular, the use of curved, bendable, and rollable displays is increasing. Flexible display production processes include various important components such as lamination material, flexible substrates, and adhesives. Among them, improvement of the lamination process comprises a large proportion of efforts for further development. In this paper, we attempt to improve the transmittance of the display substrate by performing a bubble removal process after adhesion. The transmittance of the glass substrate with the bubble removal process was 5~12% higher than that of the substrate without the bubble removal process. The fill-strength after the bubble removal process was improved by 21.4%, and the shear-strength was improved by 43.9%.

Static Chaos Microfluid Mixers Using Alternating Whirls and Laminations (미소블록에 의한 교차 회전유동과 미소유로에 의한 박층유동을 이용한 정적 혼돈 미소유체 혼합기에 관한 연구)

  • Chang, Sung-Hwan;Cho, Young-Ho
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.28 no.12
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    • pp.1549-1556
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    • 2004
  • We have deigned, fabricated and compared four different types of static chaos microfluid mixers, including the mixers using straight channel flow, microblock-induced alternating whirl flow, microchannel-induced lamination flow, and combined alternating whirl-lamination flow. Among them, the alternating whirl-lamination (AWL-type) mixer, composed of 3-D rotationally arranged microblocks and dividing microchannels fabricated by conventional planar lithography process, is effective to reduce the mixing length over wide flow rate ranges. We characterize the performance of the fabricated mixers, through the flow visualization technique using phenolphthalein solution. We verify that the AWL-type microfluid mixer shows the shortest fluid mixing length of 2.8mm∼5.8mm for the flow rate range of Re=0.26∼26 with the pressure drop lower than 5kPa. Compared to the previous mixers, requiring the mixing lengths of 7∼17mm, the AWL-type microfluid mixer results in the 60% reduction of the mixing lengths. Due to the reduced mixing lengths within reasonable pressure drop ranges, the present micromixers have potentials for use in the miniaturized Micro-Total-Analysis-Systems($\mu$TAS).

Study on soldering process of SmBCO coated conductor for lamination (SmBCO 박막형 초전도 테이프의 lamination 공정을 위한 soldering 연구)

  • Ha, Dong-Woo;Kim, Tae-Hyung;Oh, Jae-Gn;Kim, Ho-Sup;Ha, Hong-Soo;Goh, Rak-Kil;Song, Gyung-Jung;Lee, Nam-Jin;Yang, Joo-Saeng;Oh, Sang-Soo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.06a
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    • pp.236-237
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    • 2007
  • Lamination of coated conductor is important to commercialize for electrical stabilizer and mechanical support. It should be known the properties of soldering interface and the variation of superconductivity on coated conductor with various kinds of solders. $SmBa_2Cu_O_x$ thin films were deposited by co-evaporation method (EDDC, Evaporation using Drum in Dual Chambers). 4 kinds of solders were used to investigate interface properties of SmBCO conductors. In-Bi solder could maintain good connection.

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Investigation into Development of Transfer Type for Variable Lamination Manufacturing Process and Apparatus (단속형 재료공급식 가변적층 쾌속조형공정 및 장치 개발에 관한 연구)

  • Ahn, Dong-Gyu;Lee, Sang-Ho;Choi, Hong-Seok;Yang, Dong-Yol;Park, Seung-Kyo
    • Journal of the Korean Society for Precision Engineering
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    • v.19 no.2
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    • pp.95-105
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    • 2002
  • In order to reduce the lead-time and cost, the technology of rapid prototyping (RP) has been widely used. However, RP technologies have disadvantageous characteristics according to their working principle: low building speed, high cost for introduction and maintenance of RP apparatus, stair-stepped surface and additional post processing. A new rapid prototyping process, as a transfer type of Variable Lamination Manufacturing by using expandable polystyrene room (VLM-ST), has been developed to reduce building lime. apparatus cost including the introduction and the maintenance and additional post-processing. The objective of this study is to propose a VLM-ST process and to develop an apparatus for implementation of the process. Design criteria of the apparatus are defined and the techniques arc proposed to satisfy the design criterion. In order to examine the efficiency and applicability of the developed process, various three-dimensional shapes, such as a world-cup logo. a knob shape, an extruded cross, a twisted shape, a character, Son-o-kong. a helical gear shaped and a scissor shape are fabricated on the apparatus in which unit shape layer (USL) was generated to build up each layer.

Development of Variable Lamination Manufacturing(VLM) Process and Apparatus by Using Expandable Polystyrene Foam (발포 폴리스티렌 폼을 이용한 가변 적층 쾌속 조형 공정 밀 장치 개발)

  • Ahn, Dong-Gyu;Lee, Sang-Ho;Yang, Dong-Yol;Shin, Bo-Sung;Park, Seung-Kyo;Lee, Yong-Il
    • Journal of the Korean Society for Precision Engineering
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    • v.18 no.8
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    • pp.54-63
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    • 2001
  • Rapid Prototyping(RP) techniques have their unique characteristics according to the working principles: stair-stepped surface of a part due to layer-by-layer stacking, low build speed caused by point-by-point or line-by-line solidification to build one layer, and additional posts processing to improve surface roughness, so high cost is required to introduce and to maintain the RP apparatus. The objective of this study is to develop a new RP process, Variable Lamination Manufacturing by using expandable polystyrene foam sheet as part material(VLM-S), and to design an apparatus for implementation of the process. So, the process parameters and design criterions of the apparatus were defined and the techniques were proposed to satisfy the design criterion. Based on the results, a knob-shape, pyramid shape. and a solid block were fabricated on the apparatus in which unit shape part(USP) was generated for building each layer.

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Top Electrode Engineering in Organic Light-Emitting Devices Formed by Soft Contact Lamination

  • Lee, Tae-Woo;Zaumseil, Jana;Bao, Zhenan;Hsu, Julia W.P.;Rogers, John A.
    • 한국정보디스플레이학회:학술대회논문집
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    • 2004.08a
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    • pp.348-351
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    • 2004
  • We describe a new approach for building organic light-emitting diodes (OLEDs), which is based on physical lamination (i.e. soft contact lamination (ScL)) of thin metal electrodes supported by an elastomeric layer (polydimethylsiloxane) against an electroluminescent organic. We find that the devices fabricated have much better performance than those constructed with conventional vacuum deposition process. In addition, the ScL is intrinsically compatible with the technique of soft lithograph so that it is easy to build patterned OLEDs with feature sizes into the nanometer regime.

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Prediction of Curl Distortion using Classical Lamination Theory in Stereolithography (SL 광조형 공정에서 고전적층이론을 적용한 곡률 변형 예측)

  • Kim, Gi-Dae;Lee, Jae-Kon
    • Journal of the Korean Society for Precision Engineering
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    • v.22 no.11 s.176
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    • pp.210-217
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    • 2005
  • A curl distortion induced by shrinkage during stereolithography polymerization process is analyzed with the classical lamination theory. Test parts of different layer thickness and part thickness are manufactured and their deformations are measured with CMM. Curl distortion is generated by the differential shrinkage of the layers, where the total shrinkage includes the shrinkages due to solidification and the change of temperature. It is shown that the curl distortion increases exponentially with decreasing the total thickness of the part, whose smaller layer thickness induces larger curl distortion. It is verified that only a part of the total shrinkage plays a role in generating the curl distortion.

Study on the Adhesive Strength by the Manufacturing Process Parameter of the Aluminum Pouch for Secondary Battery (이차전지용 알루미늄 파우치 필름의 제조 공정 변수에 따른 접착력에 대한 연구)

  • Yu, Min Sook;Kim, Do Hyun;Cho, Jung Min;Bae, Sung Woo;Kim, Dong Soo
    • Journal of the Korean Society for Precision Engineering
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    • v.33 no.2
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    • pp.149-155
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    • 2016
  • In this study, we investigated the adhesive strength by molecular weight, mixture ratio, coating thickness, lamination temperature and aging condition of adhesive in manufacture process of Nylon-Aluminum for secondary aluminum pouch. It found that as the molecular weight of adhesive gets lower, the adhesive strength increases. In the mixture ratio, as the content of hardener get higher and as the content of solvent get lower, the adhesive strength increases. Also, as the coating thickness of adhesive get thicker, the adhesive strength increase. In addition, the adhesive strength is higher at 90 degrees of lamination temperature. So, it found that 90 degrees of lamination temperature is appropriate. In the aging condition when aged for 5 days, it found that the reaction and curing of adhesive is sufficient by measuring the adhesive strength.

Software Development for Automatic Generation of Unit Shape Part for Variable Lamination Manufacturing Process (가변 적층 쾌속 조형 공정 개발을 위한 단위형상조각 자동 생성 소프트웨어 개발 및 적용 예)

  • Lee, Sang-Ho;Kim, Tae-Hwa;An, Dong-Gyu;Yang, Dong-Yeol;Chae, Hui-Chang
    • Journal of the Korean Society for Precision Engineering
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    • v.18 no.8
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    • pp.64-70
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    • 2001
  • In all the Rapid Prototyping (RP) techniques, the computer-aided design (CAD) model of a three-dimensional part is sliced into horizontal layers of uniform, but not necessarily constant, thickness in the building direction. Each cross- sectional layer is successively deposited and, at the same time, bonded onto the previous layer. The stacked layers form a physical part of the model. The objective of this study is to develop a software for automatic generation of unit shape part(USP) for a new RP process, Variable Lamination Manufacturing using the linear hotwire cutting technique and expandable polystyrene foam sheet as part material(VLM-S). In order to examine the applicability of the developed software to VLM-S, USPs of general three-dimensional shapes, such as an auto-shift lever knob and a pyramid shape were generated.

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