• Elastomers and Composites
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• 제51권4호
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• pp.280-285
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• 2016

The purpose of this study is to get optimum design and operation conditions of the heating rubber roller for laminating process. The cause of performance degradation of heating rubber roller is delamination of rubber on metal tube, rubber aging due to high temperature. We measured the material properties of thermal expansion, thermal conductivity, specific heat and density and analyzed thermal distributions of rubber layer using finite element method. As a result of heat/flow analysis, the density distribution of heating coil must shorten the stabilization time by reducing the temperature deviation on the length direction at the temperature rising section after increasing the density of the area contacting with the laminate film at the center part which is an opposite of the current composition while enabling to maintain the temperature of heater to be consistent while maintaining the temperature deviation to be low when heat loss is created. Finally, we determined optimum heating method of heating rubber roller.

• 월간포장계
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• 통권197호
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• pp.79-83
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• 2009

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2005년도 춘계학술발표대회 논문집
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• pp.141-145
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• 2005

Since the electromagnetic properties of fiber reinforced polymeric laminate composite can be tailored effectively by adjusting its composition and regulating the stacking sequence, it is plausible material for fabricating the radar absorbing structures (RAS) of desired performance. In order to design the effective electromagnetic wave (EM) absorber with the fiber reinforced polymeric laminate composite, its electromagnetic characteristics should be available and could be regulated easily in the target frequency bands. In this study, dielectric characteristics of the E-glass/epoxy laminate composites were measured by the free space method in the X-band frequency range ($8.2\;{\sim}\;12.4\;GHz$). In order to describe the dielectric behavior of laminate composites of arbitrary stacking sequences, the equivalent circuit model and the laminating equations for estimating dielectric properties were proposed, and experimentally verified. From the comparison of the predicted and measured data, the proposed method predicted well the experimentally measured data.

• 한국공간구조학회논문집
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• 제11권4호
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• pp.101-108
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• 2011

유리강회플라스틱(GRP)은 재료의 자중에 비해 아주 높은 강도를 가지고 있다. 또한 부재의 두께에 따라서 투명 혹은 반투명의 효과를 거둘 수 있다. 하지만 Hand laminating의 특성상 일률적인 재료의 강도를 선뢰하기 어렵기 때문에 구조 계산 혹은 설계 시 반드시 재료 실험을 수행하여야한다. 본 논문은 두께 4mm, 높이 30m의 의장적 기둥을 구조적으로 설계하기 위한 재료 실험을 수행하였다. 또한 실험 결과에 대한 평가를 통해 DIN에서 규정하는 재료적인 강도와 비교 분석하였다. 이를 통해 규준에서 제시하는 값과의 차이를 확인했으며 실제 설계에 반영하기 위해 반드시 재료실험이 수행되어야함을 알 수 있다.

• 공기청정기술
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• 제26권4호
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• pp.21-25
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• 2013

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 1998년도 춘계학술발표회 초록집
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• pp.73-73
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• 1998

• 한국염색가공학회지
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• 제25권1호
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• pp.70-74
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• 2013

For amine gas detection, we incorporated two well-known isomers, 2-chloro-3,5-dinitro-benzotrifluoride and 4-chloro-3,5-dinitro-benzotrifluoride, in polyurethanes. Nanoweb and thin film were prepared by electrospinning and lamination, respectively, in order to compare their sensing behaviors. Moreover, we studied photophysical property using UV-Vis spectrometer and observed surface area through scanning electron microscope to compare between the Nanoweb and thin film. We found out that nanowebs exhibited high sensitivity specifically to primary amine gas.

• 한국가구학회지
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• 제18권1호
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• pp.20-30
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• 2007

This experiment was carried out to investigate the effects of number and location of finger joints on the bending strength of glue-laminated lumbers. Urea resin adhesives were used in this experiment and the resin content was 70% for cold pressing. The lamina were edge-jointed and end-jointed. The specimen were composed of one or three layers. The obtained results are summarized as follows; The effects of finger joints on the decrease of bending strength of glue laminated woods were different according to the number and location of finger joints. The decrease of MOR was highest on the middle position of laminated woods. The effects of several arrangements of finger joints on the bending strength of glue laminated woods showed on Figure 7 and 8. The variance of thickness-laminating on the bending strength of glue laminated woods were larger than those of width-laminating.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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• pp.169-173
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• 2003

We demonstrated the applicability of dry film photoresist (DFR) in photolithography process for fine pitch solder bumping on the polytetrafluoroethylene (PTFE/Teflon) printed circuit board (PCB). The copper lines were formed with $100\;{\mu}m$ width and $18\;{\mu}m$ thickness on the PTFE test board, and varying the gaps between two copper lines in a range of $100-200\;{\mu}m$. The DFRs of $15\;{\mu}m$ thickness were laminated by hot roll laminator, by varying laminating temperature from $100^{\circ}C\;to\;150^{\circ}C$ and laminating speed. We found the optimum process of DFR lamination on PTFE PCB and accomplished the formation of indium solder bumps. The optimum lamination condition was temperature of $150^{\circ}C$ and speed of about 0.63 cm/s. And the smallest size of indium solder bump was diameter of $50\;{\mu}m$ with pitch of $100\;{\mu}m$.

• Transactions on Electrical and Electronic Materials
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• 제9권1호
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• pp.33-37
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• 2008

This paper describes the development of a new $5.0{\times}3.2mm$ SAW filter bank which is consist of 12 L, C matching components and 4 SAW bare chips on PCB substrate with CSP technology. We improved the manufacturing cost by removing the ceramic package through direct flip bonding of $LiTaO_3$ SAW bare chip on PCB board after mounting L, C passive element on PCB board. After that we realized the hermitic sealing by laminating the epoxy film. To confirm the confidentiality and durability of the above method, we have obtained the optimum flip bonding & film laminating condition, and figured out material property and structure to secure the durability & moisture proof of PCB board. The newly developed super mini $5.0{\times}3.2mm$ filter bank shows the superior features than those of existing products in confidence, electrical, mechanical characters.