• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 추계학술대회 논문집 Vol.19
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• pp.194-195
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• 2006

개인 휴대 통신 기기의 급속한 발달로 인해 부품의 소형화, 고집적화가 중요한 요소로 대두되고 있으며 이를 위해서는 모듈내부에 3차원적인 수동소자의 내장이 가능한 LTCC (Low Temperature Co-fired Ceramics) 공정이 각광받고 있다. Embedded Capacitor를 제조하기 위해 유전율이 7.6과 6.5인 LTCC 재료를 이종접합 하여 제조하였으며 이종재료의 수축거동 차이에 의한 camber가 발생하였다. 이를 해결하고 또한 고주파 부품용 정밀회로 패턴을 구 현하기 위해 PLAS 방식의 Constrained Sintering 공정을 적용하여 camber 문제를 해결하였으며 capacitance 값이 두 이종재료의 유전율과 1:1로 비례하지 않았는데 이는 유전율 65 tape에 잔존하는 기공 때문으로 판단되며 미세구조로써 확인하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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• pp.177-177
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• 2008

The effect of several $SiO_2-B_2O_3-Al_2O_3$-R(R;Ca, Sr, Ba) borosilicate glass system on sintering behavior, dielectric properties and mechanical properties of glass/ceramic composites were investigated. The amount of '+2 valency' metal elements(Ca, Sr, Ba) were examined in LTCC composite of low k glass with cordierite filler. It was sintered for 60minutes in temperature range from 850C to 950. Properties of frit and glass/ceramic composites were analyzed by DTA, XRD, SEM, Network Analyzer, UTM and so on. Dielectric constant ($\varepsilon_r$) and $Q{\times}f_0$ (Q) of the composite with 50% glass contents demonstrated $\varepsilon_r$ = 5.4 $Q{\times}f_0$ = 1600 GHz. Sintering was complete and maximum bending strength of 160MPa was obtained.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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• pp.208-208
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• 2008

Micro patterning of conductor line/space on LTCC green sheet in the LTCC module is an important process for miniaturization in 3D integrated circuits. This work presented the effect of inorganic binders on the microstructure, adhesion, electrical resistivity, shrinkage and line/space resolution, which is a part of study in photoimageable conductor paste. The photoimageable conductor paste contains silver powder, polymer binder, monomer, photo-initiator, UV absorber, and solvent. The inorganic binders were furnished with varied weight percentage of anorthite, diopside and MLS-62 glass frits from 0% to 7%. The Line/space sizes thus obtained was under 25 micron.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 추계학술대회 논문집 Vol.18
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• pp.220-223
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• 2005

We studied the effect of composition, processing, and sintering temperature on the microwave properties of $Mg_{3-x}Co_x(VO_4)_2$ system which is applicable to LTCC. When $Mg_{3-x}Co_x(VO_4)_2$ was fabricated by solid-state reaction process and sintered at the temperature range of $800\sim910^{\circ}C$, it was found that the optimum composition of x was 2 at which microwave properties of 910$^{\circ}C$-sintered one were as follows: $Q\times f_0\sim55,200GHz$ and $\varepsilon_r\sim10$. When $(MgCo_2)(VO_4)_2$ was fabricated by sol-gel process and sintered at 800$^{\circ}C$, $Q\timesf_0$was 34,400GHz which is much high compared to those fabricated by solid-state reaction process at the same sintering temperature.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 추계학술대회 논문집 Vol.15
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• pp.342-345
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• 2002

As the size of chip components and module decreases, new patteming method for fine line and geometry is needed. So far, in LTCC(Low Temperature Cofired Ceramic) process, screen printing method has been used generally. But screen printing method has some disadvantages as follows. First, the geometry including line, vias, etc. smaller than $100{\mu}m$ can't be evaluated easily. Second, the patterned dimension is different from designed value, which makes distortion in charactersitics of not only chip components but also modules. Thick film lithography has advantages of thick film screen printing process, low cost and thin film process, fine line feasibility. Using this method, the line with $30{\mu}m$ width and the geometry with expected dimension can be evaluated. In this study, the fine line with $35{\mu}m$ line/space is formed and the embedded capacitor with very small tolerance is developed using thick film lithography.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.271-271
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• 2007

LTCC 소재는 glass/ceramic composite로 구성된다. LTCC 소재에 embedding 되는 고유전율 소재 또한 이와 같은 소재설계를 통하여 무수축 접합이 가능할 것으로 판단된다. 그러나 이에 대한 연구결과가 보고된바 없고 몇몇 $Al_2O_3$의 infiltration에 대한 무수축 소성 관련 선행 연구를 바탕으로 고유전율 소재인 $BaTiO_3$의 무수축 소성이 연구되는 것이 필요한 시점이다. 따라서 본 연구는 저온에서의 glass infiltration에 의한 무수축 $BaTiO_3$ layer의 저온소성특성 및 유전특성을 평가하였다. 실험결과 $785^{\circ}C$에서 glass의 충분한 침투가 확인되며 결정구조에서는 glass/$BaTiO_3$ composite이 형성되었다. 무수축 접합 layer의 소성조건과 glass 두께 변화에 따른 유전특성 및 layer의 결정구조를 비교평가 하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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• pp.342-343
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• 2005

In this study,. the microwave dielectric properties of the $0.6TiTe_3O_8-0.4CaWO_4$ ceramics with sintering temperature were investigated for LTCC application. According to the X-ray diffraction patterns, the $0.6TiTe_3O_8-0.4CaWO_4$ ceramics had columbite structure of the $TiTe_3O_8$ phase and scheelite structure of the $CaWO_4$ phase. Increasing the sintering temperature, the bulk density, the dielectric constant and the quality factor of the $0.6TiTe_3O_8-0.4CaWO_4$ ceramics were increased. In the case of the $0.6TiTe_3O_8-0.4CaWO_4$ ceramics sintered at $810^{\circ}C$, the bulk density, the dielectric constant and the quality factor were 5.72$g/cm^2$, 33.6, 22,013GHz respectively.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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• pp.292-293
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• 2006

$ZnNb_2O_6$ ceramics were sintered under the presence of zinc-borosilicate(ZBS) glass and resultant microwave dielectric properties were investigated with a view to applying the composition to LTCC technology. The addition of 10~30 wt% ZBS glass ensured successful sintering below $900^{\circ}C$. In general, increased addition of ZBS glass increased sinterability but it decreased the dielectric properties significantly due to the formation of an excessive liquid and second phases. The sintered $ZnNb_2O_6$ ceramics at $900^{\circ}C$ with 25 wt% ZBS glass demonstrated 15.8 in dielectric constant(${\varepsilon}_r$), 5,400 in quality factor($Q{\times}f_0$), and $-98\;ppm/^{\circ}C$ in temperature coefficient of resonant frequency(${\tau}_f$).

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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• pp.313-314
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• 2006

$BiNbO_4$ ceramics were sintered under the presence of zinc-borosilicate(ZBS) glass and resultant microwave dielectric properties were investigated with a view to applying the composition to LTCC technology. The addition of 5~20 wt% ZBS glass ensured successful sintering below $900^{\circ}C$. In general, increased addition of ZBS glass increased sinterability and temperature coefficient of resonant frequency(${\tau}_f$), but it decreased the dielectric constant(${\varepsilon}_r$) and quality factor($Q{\times}f_0$) significantly due to the formation of an excessive liquid. The sintered $BiNbO_4$ ceramics at $900^{\circ}C$ with 15 wt% ZBS glass demonstrated 25 in dielectric constant(${\varepsilon}_r$), 3,700 in quality factor($Q{\times}f_0$), and -32 $ppm/{\circ}C$ in temperature coefficient of resonant frequency(${\tau}_f$).

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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• pp.288-289
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• 2006

We studied the effect of sol-gel processing and sintering temperature on the microwave properties of $MgCo_2(VO_4)_2$ system(MCV) which is applicable to LTCC(low-temperature cofired ceramics). The MCV was synthesized by sol-gel process using solution that contains precursor molecules for Mg, Co, and V. SEM analysis shows that the average particle size is ${\sim}1{\mu}m$ and size distribution is very uniform compared to the one prepared by conventional solid-state reaction process. Highly dense samples were obtained at the sintering temperature range of $750^{\circ}C{\sim}930^{\circ}C$. The maximum $Q{\times}f_0$ value of 55,700GHz, dielectric constant(${\varepsilon}_r$) of 10.41 and temperature coefficient(${\tau}_f$) of $-85ppm/^{\circ}C$ was obtained at the sintering temperature of $930^{\circ}C$. The superior microwave properties of sol-gel processed MCV relative to conventional solid-state reaction processed one is remarkable especially at lower sintering temperatures such as $750^{\circ}C$ and $800^{\circ}C$.