• The Transactions of the Korean Institute of Electrical Engineers C
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• v.53 no.9
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• pp.481-487
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• 2004

The Ku band that has been using for the satellite communication and broadcasting would be changed to K/Ka bands. The satellite system requires the antenna structure to fabricate low loss and small antenna that is able to be integrated with other Rf circuits for both Rx and Tx. So we should design it with dual feed antennas at K/Ka bands, high isolation between two different feeds and broadband circular polarization. This paper proposes the LTCC(Low Temperature Co-fired Ceramic) process for integration with other Rf circuits and the Axial mode of the helical antenna to satisfy those requirements.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.4
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• pp.344-348
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• 2002

As microelectronics technology continues to progress, there is also a continuous demand on highly integration and miniaturization of systems. For example, it is desirable to package several integrated circuits together in multilayer structure, such as multichip modules, to achieve higher levels of compactness and higher performance. Passive components (i.e., capacitors, resistors, and inductors) are very important fort many MCM applications. In addition, the low-temperature co-fired ceramic (LTCC) process has considerable potential for embedding passive components in a small area at a low cost. In this paper, we investigate a method of statistically modeling integrated passive devices from just a small number of test structures. A set of LTCC inductors is fabricated and their scattering parameters (s-parameters) are measured for a range of frequencies from 50MHz to 5GHz. An accurate model for each test structure is obtained by using a building block based modeling methodology and circuit parameter optimization using the HSPICE circuit simulator.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.14 no.7
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• pp.750-755
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• 2003

This paper proposes a new three-line balun. The equivalent circuit of the proposed three-line balun is presented, and impedance matrix［Z］of the equivalent circuit is derived from the relationship between the current and voltage at each port. The design equation for a given set of balun impedance at input and output ports is presented using［S］parameters, which is transferred fom impedance matrix,［Z］. To demonstrate the feasibility and validity of design equation, multi-layer ceramic(MLC) chip balun operated in the 2.4 GHz ISM band frequency is designed and fabricated by the use of the low temperature co-fired ceramic(LTCC) technology. By employing both the proposed new three-line balun equivalent circuit and multi-layer configuration provided by LTCC technology, the 2012 size MLC balun is realized. Measured results of the multi-layer LTCC three-line balun match well with the full-wave electromagnetic simulation results, and measured in band-phase and amplitude balances over a wide bandwidth are excellent. This proposed balun is very easily applicable to multi-layer structure using LTCC as shown in the paper, and also can be realized with microstrip lines on PCB. This distinctive performance is very favorable for wireless communication systems such as wireless LAN(Local Area Network) and Bluetooth applications.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.1232-1233
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• 2006

To co-fire with commercial LTCC (Low Temperature Co-fired Ceramic) materials at $850^{\circ}C{\sim}880^{\circ}C$, different contents of $B_2O_3$ were added to the $Bi_2O_3-ZnO-Nb_2O_5$ (BZN) ceramics. According to the test results, the cubic phase of BZN was transformed into orthorhombic in all the test materials. $BiNbO_4$ phase was formed in test materials with $2{\sim}5wt%$ of $B_2O_3$ addition. The phase transformation of cubic BZN was controlled during the synthesis process with excess ZnO content. The Cubic and orthorhombic phases of BZN could coexist and be sintered densely at $850^{\circ}C/2hr$.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.4
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• pp.63-70
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• 2011

Anorthite forming glass frits in amounts up to 25 vol% of the silver powder were added to improve the adhesion between the conductor pattern formed by thick film photoimageable process and the low temperature co-fired ceramics (LTCC) substrate. The sheet resistance of the conductor pattern was raised from 0.13 ${\Omega}/{\square}$ to 2.25 ${\Omega}/{\square}$ as the volume percentage of glass frit increased up to 25 vol%. The adhesion strength was improved with this glass frit increase, but it decreased when the glass content exceeded 20 vol% which are possibly attributed to the liquid pool effect and the reduced fracture toughness in the interface between conductor and LTCC layer. The shrinkage of the width of the conductor pattern decreased with the addition of glass contents.

• Journal of Industrial Technology
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• v.25 no.B
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• pp.175-182
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• 2005

This paper presents a LTCC Balun-BPF, which is a BPF(band pass filter) with a Balun in a single LTCC chip for the direct interface with a MMIC chip having balanced inputs. The physical dimension of the designed Balun-BPF is $2.4{\times}2.0{\times}0.88mm^3$ and the used dielectric constant ${\varepsilon}_r$ is 36. A Balun of three-lines structure with striplines and a BPF of comb-line structure was combined into the Balun-BPF. The simulated result shows 4.8㏈ of insertion loss, 178~179 degree of the phase imbalance, 14㏈ of the return.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.03b
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• pp.14-14
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• 2010

Recently, low temperature co-fired ceramic (LTCC) technology has gained a remarkable application potential in sensors, actuators and micro systems fields because of its very good electrical and mechanical properties, high reliability and stability as well as possibility of making 3D micro structures. In this study, we investigated the effects of annealing treatment on the electrical properties of $Pb(ZrTi)O_3$ (PZT) thin films deposited on LTCC substrate. PZT thin films were deposited on Au / LTCC substrates by RF magnetron sputtering method. Then, the change of the crystallization of the films were investigated under various annealing temperatures and times. The results showed that the crystallization of the films were enhanced as increasing annealing temperatures. The film, annealed at $700^{\circ}C$, 3min, was well crystallized in the perovskite structure.

• 한국정보통신설비학회:학술대회논문집
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• 2005.08a
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• pp.133-136
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• 2005

This paper presents a LTCC Balun-BPF, which is a BPF(bandpass filter) with a Balun in a single LTCC chip for the direct interface with a MIC chip having balanced inputs. The physical dimension of the designed Balun-BPE is $2.4{\times}2.0{\times}0.88m^3$ and the used dielectric constant ${\varepsilon}_r$ is 36. A Balun of three-lines structure with striplines and a BPF of comb-line structure was combined into the Balun-BPF. The simulated result shows 4.8dB of insertion loss, $178{\sim}179$ degree of the phase imbalance, 14dB of the return

• Journal of electromagnetic engineering and science
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• v.10 no.3
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• pp.92-98
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• 2010

A new wideband bandstop filter(BSF) with a sharp roll-off characteristic is introduced in a stripline structure in this paper. The BSF consists of two sections: the first is two capacitively coupled $\lambda/4$ short-circuited lines with opposite ground positions, while the second is a capacitively coupled $\lambda/4$ short-circuited line. The BSF provides three transmission zeros within the stopband and better than 22 dB rejection over the whole wireless local area network (WLAN) band from 5.15 to 5.825 GHz. The BSF, cascaded to an U.S. ultra-wideband(UWB: 3.1~10.6 GHz) band-pass filter(BPF), is simulated with HFSS and realized with low-temperature co-fired ceramic(LTCC) green tape with a dielectric constant of 7.8. The measurement results agree well with the HFSS simulation results. The size of the UWB BPF including the BSF is $3{\times}6.3\times0.45\;mm^3$.

• Proceedings of the Korea Electromagnetic Engineering Society Conference
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• 2003.11a
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• pp.506-510
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• 2003

In this paper, a meander-line chip antenna with stacked layer is suggested, designed and fabricated employing the LTCC(Low Temperature Co-fired Ceramic) fabrication techniques. To reduce the antenna chip size, the meander-line antenna strip is distributed over three layer. Layers one interconnected using via holes. A 2.4 GHz chip antenna with size of $3.75{\times}7.9{\times}1.0 mm^3$ is designed and fabricated using the LTCC technique. Measurements of the fabricated antenna show 160 MHz bandwidth and 3.75 dBi maximum gain. The Measured reflection coefficient and radiation patterns agree well with the prediction by electromagnetic simulation.