• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.25 no.2
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• pp.149-155
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• 2014

In this paper, we study the complex mobile antenna for WPT(Wireless Power Transfer) with NFC(Near Field Communication) of inductive coupling using FPCB which has half thickness compared with the existing coil type antennas. Considering the pattern thickness of loop antenna, the analysis of electromagnetic wave absorber and battery's influence, absorber thickness, the ranges of design parameters are obtained. The proposed antenna has 0.45 mm thickness using single layer 3 oz FPCB and absorber. From measurement, the characteristics of NFC antenna can be satisfied with the specifications of EMVCo. and domestic mobile telecommunication and the transmission efficiency of the proposed WPT antenna is 68.1 % which is competitive with the existing coil type antenna. From the results of this paper, it has been confirmed that the proposed antenna can be used as the WPT and NFC antenna for mobile phone. Key words: Wireless Power Transfer, Near Field Communication, Mobile Phone Antenna, Absorber, FPCB.

• Membrane Journal
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• v.26 no.3
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• pp.197-204
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• 2016

The objective of this work was to investigate the performance of pervaporation process for recovery of ester compounds from model aqueous solutions and how the fluxes of esters and water were affected by changes in feed concentration and temperature. The flux of ethyl acetate (EA), propyl acetate (PA), ethyl propionate (EP), butyl acetate (BA), and ethyl butyrate (EB) increased with an increase in feed concentration from 0.15 wt% to 0.60 wt%, and increased with temperature change from $30^{\circ}C$ to $50^{\circ}C$. The flux of esters (EA, PA, EP, BA, and EB) was in order of (EA) < (PA, EP) < (BA, EB). This result meant that the flux strongly depended on affinity between esters and membrane surface; EA is the least hydrophobic because it has one hydrophobic function group ($-CH_2-$), (PA, EP) have two ($-CH_2-$), and (BA, EB) are the most hydrophobic because these have three ($-CH_2-$). As well as such an influence of hydrophobicity of ester molecules on ester flux, the influence of hydrophobicity of membrane surface on ester flux needs further investigation. With increase in temperature, water flux of aqueous EA, PA, EP, BA, and EB solution increased. However, water flux of aqueous ester solutions did not change appreciably with increase in concentration. This experimental results may be used as fundamental data for pervaporation (PV) to improve the aroma recovery process as an alternative to thermal evaporation and distillation processes.

• Journal of Powder Materials
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• v.23 no.5
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• pp.397-401
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• 2016

A lean alloy is defined as a low alloy steel with a minimum amount of the alloying element that maintains the characteristics of the sintered alloy. It is well known that the addition of elements such as Cr, P, Si, or Mn improves the mechanical characteristics of the alloy, but decreases the sinterability. The mother alloy is used to avoid an oxidation reaction with the alloying elements of Cr, P, Si or Mn. The purpose of this study is to determine the change in the mechanical properties of Fe-P-Mo and Fe-P-Mn alloys as a result of the addition of Si. In this article, the Fe-P-Mo and Fe-P-Mn alloys to which Si is added are compacted at $7.0g/cm^3$ and then sintered in $H_2-N_2$ at $1120^{\circ}C$. The P around the macropores and large grains reduces due to the formation of $SiO_2$ as the Si content increases. This is caused by the increase in strength owing to reducing intergranular fracture by suppressing the reaction with oxygen.

• Journal of Powder Materials
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• v.22 no.4
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• pp.240-246
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• 2015

Anodic aluminum oxide (AAO) has been widely used for the development and fabrication of nano-powder with various morphologies such as particle, wire, rod, and tube. So far, many researchers have reported about shape control and fabrication of AAO films. However, they have reported on the shape control with different diameter and length of anodic aluminum oxide mainly. We present a combined mild-hard (or hard-mild) anodization to prepare shape-controlled AAO films. Two main parameters which are combination mild-hard (or hard-mild) anodization and run-time of voltage control are applied in this work. The voltages of mild and hard anodization are respectively 40 and 80 V. Anodization was conducted on the aluminum sheet in 0.3 mole oxalic acid at $4^{\circ}C$. AAO films with morphologies of varying interpore distance, branch-shaped pore, diameter-modulated pore and long funnel-shaped pore were fabricated. Those shapes will be able to apply to fabricate novel nano-materials with potential application which is especially a support to prevent volume expansion of inserted active materials, such as metal silicon or tin powder, in lithium ion battery. The silicon powder electrode using an AAO as a support shows outstanding cycle performance as 1003 mAh/g up to 200 cycles.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.3
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• pp.19-23
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• 2015

In this study, two types of Au/TiW bump samples were fabricated by the electroplating process onto Al/Si and SiN/Si wafers for the COG (Chip On Glass) packaging. TiW was used as the UBM (Under Bump Metallurgy) material of the Au bump and it was deposited by a sputtering method under the sputtering powers ranges from 500 to 5000 Watt. We investigated the delamination phenomenas for the prepared samples as a function of the input sputtering powers. The stable interfacial adhesion condition was found to be 1500 Watt in sputtering power. In addition, the SAICAS (Surface And Interfacial Cutting Analysis System) measurement was used to find the adhesion strength of Au bumps for the prepared samples. TiW UBM films were deposited at the 1500 Watt sputtering power. As a results, there was a similar adhesion strengths between TiW/Au interfacial films on Al/Si and SiN/Si wafers. However, the adhesion strength of TiW UBM sputtering films on Al and SiN under films were 2.2 times differences, indicating 0.475 kN/m for Al/Si wafer and 0.093 kN/m for SiN/Si wafer, respectively.