• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2003년도 International Meeting on Information Display
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• pp.698-700
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• 2003

LGP (Light-Guide Panel) of TFT-LCD Backligh/Frontlight is one of the major components which affect on the product quality of LCD. Since the brightness distribution of LGP is sensitive to the process error in manufacturing, the optical characteristics such as reflection and absorption of LGP pattern should be modeled including the process error. LGP is developed by using the fast and reliable design technology, which uses the concept of the inverse-design, makes the model on the characteristics of uncertainty in the manufacturing process, and designs the dispersion pattern analytically without try-and-error by using an artificial intelligence. The PEA(Process-Error-Adaptive) design gives the best solution in handling the process error. The offset of target in feedback system makes such the best pattern design possible that the brightness distribution is nearly same (more than 90%) with target in regardless of the miscellaneous errors in mass production. The present design method has been also applied to frontlight and multi-side-lamp(eg., four-side-four-lamp) backlight.

• 대한기계학회논문집A
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• 제29권3호
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• pp.361-368
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• 2005

LGP(Light-Guide Panel) of LCD backlight is one of the major componets which affect on the product quality of LCD. The LGP with multi-side lamp has been analized for pattern design with the uniform distribution of brightness. When given the uniform distribution of brightness as target, the distribution of dot pattern has been designed for superposed distributions of brightness for each lamp. Multi-side lamp has been tested for various types such as ㄴ-, ㄷ-, and ㅁ -shapes. The present study enhances the possibility of LGP with multi-side lamp by showing the pricise control of brightness distribution.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2006년도 춘계학술대회 논문집
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• pp.533-534
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• 2006

Micro pyramid pattern and its array are designed to enhance the brightness and its uniformity of LGP which is one of key parts in LCD. The designed micro pyramid patterns are fabricated on a Si-wafer first through MEMS process and then a Ni-stamper is electro-plated from the Si pattern master. Adopting the fabricated Ni-stamper, LGPs are injection molded at different mold temperatures and the fidelity of the pattern replication is estimated for each molding conditions and pattern locations. The replicated patterns are found to have some defect such as local short shot or micro weld line which are believed to have negative effect on the performance of the LGP.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2008년도 추계학술대회 논문집
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• pp.617-618
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• 2008

• Design & Manufacturing
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• 제18권2호
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• pp.41-50
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• 2024

In this study, experimental design methods were used to derive optimal process conditions for improving the thickness uniformity of a 0.40 mm, 3.5 inch light guide panel. Process mapping and expert group analysis were used to identify factors that influence the thickness of injection molded products. The key factors identified were mold temperature, mold temperature, injection speed, packing pressure, packing time, clamp force, and flash time. Considering the resin manufacturer's recommended process conditions and the process conditions for similar light guide plates, a three-level range was selected for the identified influencing factors. L27 orthogonal array process conditions were generated using the Taguchi method. Injection molding was performed using these L27 orthogonal array to mold the 3.5 inch light guide plates. Thickness measurements were then taken, and the results were analyzed using the signal-to-noise ratio to maximize the CpK value, leading to the determination of the optimal process conditions. The thickness uniformity of the product was analyzed by applying the derived optimum process conditions. The results showed a 97.5% improvement in the Cpk value of 3.22 compared to the process conditions used for similar light guide plates.

• 한국산학기술학회논문지
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• 제10권1호
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• pp.186-193
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• 2009

본 논문에서는 전열(마이크로 히터, 센서)을 이용해 금형의 표면을 가열하는 E-MOLD 특허기술을 적용하여 휴대전화용 복합기능 도광판(Prismless LGP)을 제작하고, 전사성을 평가하였다. 이를 위하여 MEMS 공정을 이용하여 복합기능 도광판용 니켈 스탬퍼를 제작하였고, E-MOLD 기술의 핵심인 이동가열코어(movable heated core)가 설치된 금형을 설계, 제작하였다 이를 이용하여 성형조건 중 금형온도를 변화시키면서 복합기능 도광판을 사출성형으로 제조 하였고, 금형온도가 성형품의 전사성에 미치는 영향에 대하여 알아보았다. 또한, 전산모사 프로그램(CAE)을 이용하여 금형온도와 사출시간에 따른 수지의 유동성을 해석하였다. 금형온도에 따른 도광판의 전사성은 $100^{\circ}C$(25.0nm), $140^{\circ}C$(48.4nm), $180^{\circ}C$(52.1nm)로 나타났고, 스탬퍼(52.1nm)와 비교했을 때 $180^{\circ}C$에서 전사성이 가장 우수했다. 전산모사 해석결과에 따르면, 수지의 유동성은 금형온도($50{\sim}180^{\circ}C$)가 증가할수록 향상되었다. 사출시($1{\sim}2sec$)이 길수록 유동성이 감소하는 경향을 $160^{\circ}C$에서 확인하였다. 따라서 수지의 전사성과 유동성은 금형온도에 따라 증가하고, 특히 유리전이 온도($140^{\circ}C$) 이상에서 크게 상승하였다.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2009년도 추계학술대회 논문집
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• pp.99-102
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• 2009

The recent LCD TV market has made efforts to produce thinner, brighter, and clearer products, and experienced the rapid light source replacement from a line source of light CCFL to a point source of light LED. In particular, LGP(Light Guiding Panel) among key parts composing BLU(Back Light Unit) has limits of the injection molding technology as well as the mold design, its processing and manufacturing technology so that it is hard to produce large LGP over 40 inch. To produce large light-guide panels over 40 inch under the injection molding process, a mold 3D model was developed in the design process before manufacturing a mold and structure unification was processed through CAE analysis. As a result, it was possible to construct the mold design process, and it is expected to manufacture the optimized mold by applying the mold design and manufacturing process of large-scale rapid injection-compression molding that will be produced in the future.

• 소성∙가공
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• 제15권1호
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• pp.27-33
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• 2006

It is necessary to improve the pattern replication and birefringence in LGP(Light guide panel) for better optical performance. In the present paper, the effects of injection-compression and injection-press mode with normal injection mold on the distribution of transcription of pattern and birefringence were studied. It was found that the values of pattern replication was improved and the birefringence was reduced for the cases of low initial clamping force in injection-compression mode and for the cases of longer mold opening length in injection-press mode, repectively.

• 한국산학기술학회:학술대회논문집
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• 한국산학기술학회 2008년도 추계학술발표논문집
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• pp.358-361
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• 2008

본 논문에서는 열화상촬영기 및 온도분포 해석 프로그램을 이용하여 금형가열온도와 실제 금형온도의 온도편차를 비교하여 금형가열 시 Stamper 표면의 온도분포를 해석하였다. 또한 전열가열방식(E-MOLD)을 이용하여 복합기능 도광판(Prismless LGP)을 제조하였고, 금형온도에 따른 복합기능 도광판(Prismless LGP)의 광특성 평가를 하였다. 그 결과 금형온도가 증가할수록 패턴 전사성 향상으로 인해 휘도 또한 증가하였고, 특히 유리전이온도($140^{\circ}C$) 이상에서 크게 상승하였다.

• 한국광학회지
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• 제23권3호
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• pp.119-123
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• 2012

LCD backlight unit (BLU)에서 도광판 상부에 micro reverse-pyramid array (MRPA) 또는 micro reverse-cone array (MRCA)을 설치함으로써 기존의 확산 시트와 프리즘 시트를 없애고 구조를 단순화하였으며, 광학적 시뮬레이션을 통하여 새로운 도광판의 최적 조건을 얻었다. MRPA와 MRCA의 측면각과 높이, 윗변의 반지름이나 윗변의 길이에 따라 휘도와 시야각의 변화를 구하였다. MRPA와 MRCA 구조물의 최적의 형상은 측면각이 각각 59도와 57도이었으며, 시야각은 68도와 64도이었다. 구조물의 높이는 큰 영향을 주지 않았다.