• 한국자동차공학회논문집
• /
• 제16권5호
• /
• pp.8-14
• /
• 2008

For nondestructive inspection of electron beam (EB) welding part in automotive power transmission assembly, a pulse-echo ultrasonic testing apparatus in water immersion has been applied using the ultrasonic waves with a frequency of 10MHz. However various problems have appeared during the ultrasonic inspection, which led to some significant mistakes in automatic quality evaluation of the welding parts. Experimental study showed that the state of water couplant medium containing some amount of contaminants, rusts and anti-corrosion agents had considerable influences on the reduction of ultrasonic amplitudes during wave propagation. The amplitude reduction depending on the coupling medium state could bring about some mis-diagnoses for defects in the welding parts. The results proposed that for a reliable inspection of defects in welds the state of water medium should be kept in about 15 volume fractions (vol.%) of anti-corrosion agents and in minimized contaminants.

• 한국철도학회:학술대회논문집
• /
• 한국철도학회 2008년도 춘계학술대회 논문집
• /
• pp.188-193
• /
• 2008

According to introduce KTX in Korea, rail-road bridge section of KTX was increased approximately 50% of the total length. Bridge is required periodic inspection and check to prevent accident and hazard because various damage which have effects on traffic and replacement of damaged parts is difficult. Specifically, the train as large-scale transportation because accidents led to great damage, preventing these accidents are critical. Well-organized management and maintenance systems are required to prevent the accidents. In the case of roadway bridge, bridge inspection vehicle is used to deploy inspectors in roadway bridge. However, this method requires a lot of time and efforts, and inspectors are exposed to potential hazard. Also, surrounding environment like poor lighting system or electric wire could harm the inspector while repairing. Due to this reason, automatic repairing and inspecting system have been introduced to replace the old methods. Management system of the railroad bridge track for trains uses various advanced equipments, but whereas roadway bridge management system is lacking these efforts. As a result of that, this study looks over the existing management method. and review the method to apply the Bridge Inspection Robot in railroad bridge. Moreover, this study suggests future management technology using inspection robot.

• 센서학회지
• /
• 제32권2호
• /
• pp.124-130
• /
• 2023

Implementing flexible production systems in domestic and foreign automotive design parts assembly has increased demand for automation and power reduction. Consequently, transition to a hybrid production method is observed where multiple vehicles are assembled in a single assembly line. Multiple robots, 3D vision sensors, mounting positions, and correction software have complex configurations in the automotive glass mounting system. Hence, automation is required owing to significant difficulty in the assembly process of automobile parts. This study presents a primer lighting and inspection algorithm that is robust to the assembly environment of real automotive design parts using high power 'ㄷ'-shaped LED inclined lighting. Furthermore, a 2D camera was developed in the primer coating inspection system-the core technology of the glass mounting system. A primer application demo line applicable to the actual automobile production line was established using the proposed high power lighting and algorithm. Furthermore, application inspection performance was verified using this demo system. Experimental results verified that the performance of the proposed system exceeded the level required to satisfy the automobile requirements.

• 전자공학회논문지B
• /
• 제33B권11호
• /
• pp.53-61
• /
• 1996

In this paper, efficient techniques for solder joint inspection have been described. Using three layers of ring shaped LED's with different illumination angles, three frames of images are sequentially obtained. From these images the regions of interest (soldered regions) are segmented, and their characteristic features including the average gray level and the percentage of highlights - refereed to as 2D features - are extracted. Based on the backpropagation algorithm of neural networks, each solder joint is classified intor one of the pre-defined types. If the output value is not in the confidence interval, the distribution of tilt angles-referred to as 3D features - is claculated, and the solder joint is classified based on the bayes classfier. The second classifier requires more computation while providing more information and better performance. The proposed inspection system has been implemented and tested with various types of solder joints in SMDs. The experimental results have verified the validity of this scheme in terms of speed and recognition rate.

• International Journal of Fuzzy Logic and Intelligent Systems
• /
• 제6권2호
• /
• pp.95-99
• /
• 2006

A tape feeder of a SMD(Surface Mount Device) mounter is a device that sequentially feeds electronic components on a tape reel to the pick-up system of the mounter. As components are getting much smaller, feeding accuracy of a feeder becomes one of the most important factors for successful component pick-up. Therefore, it is critical to keep the feeding accuracy to a specified level in the assembly and production of tape feeders. This paper describes a tape feeder inspection system that was developed to automatically measure and to inspect feeding accuracy using machine vision. It consists of a feeder base, an image acquisition system, and a personal computer. The image acquisition system is composed of CCD cameras with lens, LED illumination systems, and a frame grabber inside the PC. This system loads up to six feeders at a time and inspects them automatically and sequentially. The inspection software was implemented using Visual C++ on Windows with easily usable GUI. Using this system, we can automatically measure and inspect the quality of ail feeders in production process by analyzing the measurement results statistically.

• Journal of Advanced Marine Engineering and Technology
• /
• 제33권5호
• /
• pp.662-671
• /
• 2009

In this paper, a robot was developed for in-pipe cleaning and inspecting a large number of circular in-pipes of sea plants, ships, and buildings. A pressure generation mechanism was devised to inspect circular in-pipes with different diameters and to move up and down slant or perpendicular slopes in-pipes. For inspection of the dark inner side of the pipe, a light system using LED which dissipats small electricity was developed. Also, a design method was analyzed to decide the capacity of driving motor for the robot when the mass and maximum velocity of the robot are identified. The robot developed based on the design specification, was tested to verify the performance of the pressure generation mechanism. In addition, a control system was developed for the test.

• 한국철도학회:학술대회논문집
• /
• 한국철도학회 2009년도 춘계학술대회 논문집
• /
• pp.673-679
• /
• 2009

Nondestructive inspection(NDI) is a testing procedure used to easily inspect an object for internal defects, abnormalities, shape, and structure, etc. without destroying it. Typical candidates for NDI include buildings, railways, aircraft, bridges, underground pipelines and various types of factory equipment. Recent advances in nondestructive evaluation(NDE) technologies have led to improved methods for quality control and in-service inspection, and the development of new options for material diagnostics. This paper introduces the methods of a survey and assessment on NDI applications in Electric Multiple Units(EMU). The main objective of this paper was to obtain information on various applications of NDI technology in EMU.

• 제어로봇시스템학회논문지
• /
• 제8권7호
• /
• pp.573-577
• /
• 2002

A tape feeder of a SMD(Surface Mount Device) mounter is a device that sequentially feeds electronic components on a tape reel to the pick-up system of the mounter. As components are getting much smaller, feeding accuracy of a feeder becomes one of the most important factors for successful component pick-up. Therefore, it is critical to keep the feeding accuracy to a specified level in the assembly and production of tape feeders. This paper describes a tape feeder inspection system that was developed to automatically measure and inspect feeding accuracy using machine vision. It consists of a feeder base, an image acquisition system, and a personal computer. The image acquisition system is composed of CCD cameras with lens, LED illumination systems, and a frame grabber inside the PC. This system loads up to six feeders at a time and inspects them automatically and sequentially. The inspection software was implemented using Visual C++on Windows NT with easily usable GUI. Using this system, we can automatically measure and inspect the quality of all feeders in production process by analyzing the measurement results statistically.

• 마이크로전자및패키징학회지
• /
• 제12권4호통권37호
• /
• pp.331-338
• /
• 2005

The rapid advances in high power light sources and arrays as encountered in incandescent lamps have induced dramatic increases in die heat flux and power consumption at all levels of high power LED packaging. The lifetime of such devices and device arrays is determined by their temperature and thermal transients controlled by the powering and cooling, because they are usually operated under rough environmental conditions. The reliability of packaged electronics strongly depends on the die attach quality, because any void or a small delamination may cause instant temperature increase in the die, leading sooner or later to failure in the operation. Die attach materials have a key role in the thermal management of high power LED packages by providing the low thermal resistance between the heat generating LED chips and the heat dissipating heat slug. In this paper, thermal transient characteristics of die attach in high power LED package have been studied based on the thermal transient analysis using the evaluation of the structure function of the heat flow path. With high power LED packages fabricated by die attach materials such as Ag paste, solder paste and Au/Sn eutectic bonding, we have demonstrated characteristics such as cross-section analysis, shear test and visual inspection after shear test of die attach and how to detect die attach failures and to measure thermal resistance values of die attach in high power LED package. From the structure function oi the thermal transient characteristics, we could know the result that die attach quality of Au/Sn eutectic bonding presented the thermal resistance of about 3.5K/W. It was much better than those of Ag paste and solder paste presented the thermal resistance of about 11.5${\~}$14.2K/W and 4.4${\~}$4.6K/W, respectively.

• 한국산학기술학회논문지
• /
• 제11권9호
• /
• pp.3517-3523
• /
• 2010

본 논문은 이중 에너지 DR(Digital Radiography) 방식 중, 단일 조사 X-선(single shot X-ray exposure) 장치와 이중 모드 검출기 모듈 (Low Energy Detector & High Energy Detector)을 이용한 이중 X-선 이미징이 가능한 검출기 모듈에 관한 연구이다. 상용 BIS(baggage inspection system)에서 사용되고 있는 X-선 발생장치의 스펙트럼과 이중 모드 검출기에 대한 특징 및 방사선적 특성을 분석하여 새롭게 제안 할 검출기 모듈의 최적 설계 방향을 기술하고 상용화된 용화된 LED 및 HED 검출기와 새롭게 제안 한 검출기 모듈에 대해 전기적, 광학적, 방사선적 특성 실험을 실시하여, 새롭게 제안된 검출기 모듈이 BIS 용도로 사용 가능함을 증명하였다. 새롭게 제안 된 검출기 모듈이 적용된 BIS에 대해, 기본 특성 실험에 대한 X-선 영상을 획득하여 실험 및 분석을 실시하였다.