• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.164-164
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• 2009

This paper had analyzed property of LED chip which has appropriate distribution and had designed modeling in order to experiment optical property of LED module through simulation. also throughout error value between street light and simulation data, precisive simulation could be inferred. as a consequent, transformation of optical property had henceforth verified the first value of module array.

• Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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• 2009.05a
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• pp.157-159
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• 2009

LED BLU(Back Light Unit), based on MCPCB(Metal Core Printed Circuit Board) with anodizing oxide dielectric layer and improved thermal dissipation property, are presented. Reflecting cups were also formed on the surface of the MCPCB such that optical coupling between neighboring chips were minimized for improving the photon extraction efficiency. LED chips were directly attached on the MCPCB by using the COB (Chip On Board) scheme.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.9
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• pp.723-726
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• 2012

A current intensity convertible CLD chip was fabricated using small and large FET cell configuration. Pinch-off current of 8.82 mA and 11.56 mA were obtained for small and large cell in the CLD chip, respectively. Constant current was fairly maintained until the breakdown voltage of 60 V. Measured knee voltage, $V_k$ were 3.8 V and 4.5 V for small and large cell, respectively. We configured current amplifying chip with parallel connection of each cells, by connecting 8 individual large cells in parallel network, 92.0 mA of current was obtained. The pinch-off constant current of CLD chip was varied very linearly with respect to the number of parallel connected cell.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.18 no.2
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• pp.401-407
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• 2014

There are increasing interests in COB (Chip On Board) that densely arranged many LED chips on one board in order to solve the heat issue. There are many problems being on the rise: the lifespan decreases as the temperature of LED devices increases; Red Shift phenomenon, in which wave length of spectral line moves from original wave length to long wave length, occurs; and optical power decreases as $T_j$ increases. In order to resolve such problems, this study selected the optimum thickness and length of Fin, planned the second Heat sink that is optimum for COB LED with 15W, and analyzed thermal mode by Solid Works Flow Simulation through 15W COB packaging with the planned Heat sink. 15W COB down-light Heat sink that is produced based on this analysis was utilized to analyze thermal mode through contact thermometer and electrical properties through Kelthley 2430.

• Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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• 2007.05a
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• pp.70-73
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• 2007

생활수준의 향상으로 인하여 조명 및 디스플레이 제품을 이용하여 건물 및 건축물에 대하여 장식을 하는 것이 일반화 되어가고 있다. 본 연구에서는 옥외 및 옥내에 사인물로 사용되어지고 있으며 설치가 간편한 디스플레이 조명기기인 LED Tile을 개발하여 옥내 및 옥외용 디스플레이 조명 시장의 시장성 확보하기 위하여, 광학설계를 통한 고휘도 LED의 선정 및 배치, 케이스 설계를 실시하고 LED모듈에 AC 220V 전원을 직접 인가할 수 있으며 효율이 높고 최적화된 구동회로를 설계하였다. 또한 One Chip 마이크로컨트롤러를 사용하여 RGB LED의 광색가변 및 점멸 제어회로를 설계하고, LED 모듈간에 2개의 제어선만을 연결하여 다양하고 다이나믹한 패턴 동작(점멸, 광색가변)이 가능하도록 펌웨어를 설계하였다. 그 결과 설계된 LED Tile은 전체 크기가 $D130{\times}W130{\times}H50mm$로 매우 컴팩트하고 LED 배치 및 광학설계를 통하여 최대광도 60cd를 실현하였으며, LED Tile의 동작개수에 관계없이 설치가 간단하며 10개 이상의 디스플레이 패턴 제어가 가능하였다.

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1671-1672
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• 2006

사인물의 대명사인 네온사인 및 옥외용 광고 조명기기를 대체할 수 있는 LED Lighting Bar를 개발하여 옥외용 광고 시장의 시장성 확보하기 위하여, 광학설계를 통한 고휘도 LED의 선정 및 배치, 케이스 설계를 실시하고 LED모듈에 AC 220V 전원을 직접 인가할 수 있으며 효율이 높고 컴팩트한 구동회로를 설계하였다. 또한 One Chip 마이크로컨트롤러를 사용하여 RGB LED의 광색가변 및 점멸 제어회로를 설계하고, LED 모듈간에 2개의 제어선만을 연결하여 다양하고 다이나믹한 네온사인 동작(점멸, 광색가변)이 일어나도록 소프트웨어를 설계하였다. 그 결과, 설계된 LED Lighting Bar는 전체 크기가 $D150{\times}W50{\times}H50mm$로 매우 컴팩트하고 LED 배치 및 광학설계를 통하여 최대광도 70cd를 실현하였으며, LED Lighting Bar의 동작개수에 관계없고 설치가 간단하며 10개 이상의 사인 패턴 제어가 가능하였다.

• Journal of Information Display
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• v.10 no.2
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• pp.49-53
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• 2009

In this study, a very small LED packaging lead frame with a low thermal resistance was developed. The cost of the package process was reduced by the use of many small LED lamps, which increased the light emission efficiency. Compared to the large lead frame lamp, however, the optical property of the small LED packaging lead frame lamp was not sufficiently improved because its reflection structure was changed and its reflection area was reduced. The luminous efficiency of the LED lamp reaches 58 lm/W at the current density of 0.16 A/$cm^2$. Using the LED lamps, 46-inch LCD BLU was manufactured. The BLU-made LED lamps have a low power consumption of 146 W and have a slim (10-mm-thick) BLU, keeping good uniformity in terms of brightness, and maintaining good thermal properties.

• Korean Journal of Optics and Photonics
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• v.19 no.5
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• pp.381-385
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• 2008

We have analyzed the effect of the substrate removal and packaging schemes on light output characteristics in InGaN/Sapphire LEDs. The removal of the sapphire substrate helps to dissipate the heat generated in the junction, but the advantage comes only with the detrimental effect of degrading the photon extraction efficiency. If the substrate-removed chip is attached to a metallic mount with good thermal conductivity, the maximum driving current is increased drastically, producing significantly increased light output and therefore compensating the photon extraction efficiency degradation. On a dielectric mount with a relatively poor thermal conductivity, however, it produces smaller light output, over most input current range, than the regular type of chips with the sapphire substrate remaining. Thus, for low power applications, the regular chips may be preferred over the substrate-removed chips, regardless of the chip mounts employed.

• Journal of Power Electronics
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• v.18 no.2
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• pp.640-650
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• 2018

A TRIAC dimmable LED driver with a wide tuning range and a two-stage uniform dimming scheme is proposed in this paper. To solve the restricted dimming range problem caused by the limited conduction ratio of TRIAC dimmers, a conduction ratio compensation technique is introduced, which can increase the output current up to the rated output current when the TRIAC dimmer turns to the maximum conduction ratio. For further optimization, a two-stage uniform dimming diagram with a rapid dimming curve and a slow dimming curve is designed to make the LED driver regulated visually uniform in the whole adjustable range of the TRIAC dimmer. The proposed control chip is fabricated in a TSMC $0.35{\mu}m$ 5V/650V CMOS/LDMOS process, and verified on a 21V/500mA circuit prototype. The test results show that, in the 90V/60Hz~132V/60Hz ac input range, the voltage linear regulation is 2.6%, the power factor is 99.5% and the efficiency is 83%. Moreover, in the dimming mode, the dimming rate is less than 1% when the maximum dimming current is 516mA and the minimum dimming current is only about 5mA.

• Proceedings of the Optical Society of Korea Conference
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• 1998.08a
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• pp.206-207
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• 1998