• The Transactions of the Korean Institute of Power Electronics
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• v.19 no.1
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• pp.8-14
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• 2014

This paper presents the intra capacitance modeling according to the winding method and section bobbin for CM choke capable of the EMI attenuation of broad bands from lower frequency bands to higher frequency bands and high frequency type common-mode choke capable of the EMI attenuation of high frequency band used in the EMI Block of LED-TV SMPS. In case of high frequency type CM choke, it can be explained the parasitic capacitance of A type and section bobbin type winding methods among them is much smaller than the other. The first resonant frequency of the proposed CM choke tends to increase as the parasitic capacitance becomes small and its impedance characteristics also show improved performance as the first resonant frequency increases. In the future, the CM chokes of high frequency type show it can be practically used in not only LED/LCD-TV SMPS but also several applications such as LED Lighting, Adapter and so on.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.1
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• pp.329-332
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• 2012

LEDs are using widely in a field of illumination, LCD LED backlight, mobile signals because they have several merits, such as low power consumption, long lifetime, high brightness, fast response, environment friendly. To achieve high performance LEDs, one needs to enhance output power, reduce operation voltage, and improve device reliability. In this paper, we have proposed that the optimum design and specialized process could improve the performance of LED chip. It was showed an output power of 7cd and input supplied voltage of 3.2V by the insertion technique of current blocking layer. In this paper, GaN-based LED chip which is built on the sapphire epi-wafer by selective MOCVD were designed and developed. After that, their performances were measured. It showed the output power of 7cd more than conventional GaN-based chip. It will be used the lighting source of a medical equipment and LCD LED TV with GaN-based LED chip.

• Proceedings of the Optical Society of Korea Conference
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• 2006.02a
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• pp.115-116
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• 2006

• Proceedings of the Optical Society of Korea Conference
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• 2008.02a
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• pp.137-138
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• 2008

• The Transactions of the Korean Institute of Electrical Engineers P
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• v.58 no.3
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• pp.357-361
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• 2009

This study performed analysis on the thermal pattern and current characteristics of an LED ((Light Emitting Diode) street lamp. It did this using a TVS (Thermal Video System) to analyze the LED street lamp's thermal pattern, and measured its characteristics using an oscilloscope. The ambient temperature and humidity during the experiment were maintained at $24{\pm}2[^{\circ}C]$ and 50~60[%]. The capacity of the LED street lamp was 120[W] and nine sets of modules were arranged at uniform intervals. On one module, 24 LED lamps were arranged in a radial pattern. The analysis of the thermal diffusion pattern at the front of the LED lamp showed that the maximum surface temperature was approximately $34[^{\circ}C]$. In addition, there was almost no change in the temperature of the upper cover, and the temperature at the side showed a uniform thermal diffusion pattern. The surface temperature of the converter converting AC to DC increased to approximately $46[^{\circ}C]$. The analysis results of the thermal characteristics of one LED indicated uniform thermal characteristics for an initial eight minutes. However, the temperature at the center of the LED increased to approximately $82[^{\circ}C]$ after 12 minutes had elapsed. It can be seen from this that the temperature at the center of the LED was higher than the allowable temperature, $70[^{\circ}C]$ of the insulating material for general electrical devices. Therefore, it is necessary to design a lamp in such a way that the plastic insulating material does not come into contact with or get close to the LED lamp. The voltage of the LED lamp converted by the AC/DC converter was measured at DC 27[V] and the current was DC 13[A]. Consequently, it can be seen that in order to secure an adequate light source, it is important to supply a stable current that was greater than the current of other light sources. Therefore, appropriate radiation of heat is required to secure the stability and reliability of the system.

• Electronics and Telecommunications Trends
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• v.24 no.6
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• pp.61-76
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• 2009

LED는 2000년대에 들어서면서 생활 전반에 사용되기 시작하여 최근에는 자동차용 부품과 TV의 back light unit에 이르기까지 모든 분야에서 다양한 용도로 사용되고 있다. 본 기고에서는 이러한 LED의 기판을 포함한 에피, 칩, 그리고 패키지 기술의 중요한 이슈와 기술의 동향에 대하여 간략히 정리하였다. 상용화되어 사용되는 사파이어나 SiC 기판 이외에 연구개발이 진행중인 GaN 기판 기술 등을 소개하고, 에피 기술에서는 활성층과 클래딩층 성장 기술의 이슈들을 제시하며, 칩의 종류와 특성을 중심으로 droop 현상과 광추출 기술 등을 살펴보고, 다양한 패키지의 종류 및 특징 등을 포함하는 LED 분야의 기술 동향에 대하여 설명한다.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.10 no.5
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• pp.359-363
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• 2017

The LED (Liquid Emitting Diode) frame device is a big part of the representative display industry in Korea. LED is an essential part for TV, monitor, notebook, and mobile phone. In Japan, Taiwan, China and other countries, investment in LEDs has been strengthened, and productivity has become an important issue. However, as the size of the parts becomes smaller, the inconsistent inspection by the human eye becomes a problem of reliability, so that the automatic inspection process becomes an essential issue in the field of LED module inspection. In this paper, we investigate defects in visual inspection process using computer vision technology. The inspection of the LED frame is made quickly and accurately, thereby improving the efficiency of the process and shortening the inspection time. As a result of applying the inspection system to the field, we confirmed that it is possible to inspect quickly and accurately.

• Asian Journal of Innovation and Policy
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• v.1 no.2
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• pp.200-218
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• 2012

Estimating the economic life of a technology is the first important prerequisite step in the feasibility analysis of technology-based business. Many empirical studies have concentrated on patents data to estimate the time period for a technology. However, it is recommended to estimate it along with qualitative considerations of future technological and market conditions. In this regard, little is known about how approaches are applied. This paper aims to establish a structural framework of estimating the lifetime of a technology by integrating the outputs of an analysis of the determinants in each transition of a product life cycle. We describe an illustrative case about a light emitting diode (LED) backlight unit (BLU) technology for the liquid crystal display (LCD) TV. The framework allows valuators and experts to estimate a technology lifetime by using multidimensional factors.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.14 no.2
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• pp.462-468
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• 2010

In this paper, the new efficient drive control technology based on the conventional full-color electric display board image processing method is proposed. This technology can be applied to high-fidelity large size panel TV and LCD Display, and makes high-fidelity-display-drive control possible in those. The proposed drive control technology can strengthen the image processing function of the conventional technology. Also, the automatic or manual adjustment of contrast, bright, tint, color, gamma revision, etc. can help to achieve high-fidelity vision. This technology can be adopted with lower price.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.214-217
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• 2008

We present an ultra-slim LCD module for 40-inch FHD TV. By employing edge-lit backlight system, module thickness of 10mm is achieved. To satisfy the luminance spec of 450 nits in FHD resolution, it is critical to adopt high efficient LED and optical components.