• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.23 no.1
• /
• pp.38-41
• /
• 2010

Compared to conventional molding technology, the color uniformity of light direction emitted from LED is improved with PCB type lead frame technology in which metal thin film is used and transfer molding technology which makes the density of phosphor uniform by manufacturing high density LED lamp. The light efficiency and the color uniformity of the LED are improved by molding the phosphor layer outside of chip and controlling the thickness of the phosphor layer. CIE x,y difference of LED in major axis is also improved uniformly from 0 to 90 degrees.

• Journal of the Korean institute of surface engineering
• /
• v.48 no.2
• /
• pp.33-37
• /
• 2015

High efficiency LED device is being concerned due to its high heat loss, and such heat loss will cause a shorter lifespan and lower efficiency. Since there is a demand for the materials that can release heat quickly into the external air, the organic insulating layer was required to be replaced with high thermal conductive materials such as metal or ceramics. Through anodizing the upper layer of Al, the Breakdown Voltage of 3kV was obtained by using an uniform thickness of $60{\mu}M$ aluminum oxide($Al_2O_3$) and was carried out to determine the optimum process conditions when thermal cracking does not occur. Two Ni layers were formed above the layer of $Al_2O_3$ by sputtering deposition and electroplating process, and saccharin was added for the purpose of minimizing the remain stress in electroplating process. The results presented that the 3-layer film including the Ni layer has an adhesive force of 10N and the thermal conductivity for heat dissipation is achieved by 150W/mK level, and leads to improvement about 7 times or above in thermal conductivity, as opposed to the organic insulation layer.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2013.02a
• /
• pp.323-323
• /
• 2013

High power light-emitting diodes (LEDs) are widely used in many device applications due to its ability to operate at high power and produce high luminance. However, releasing the heat accumulated in the device during operating time is a serious problem that needs to be resolved to ensure high optical efficiency. Ceramic or Aluminium base metal printed circuit boards are generally used as integral parts of communication and power devices due to its outstanding thermal dissipation capabilities as heat sink or heat spreader. We investigated the characterisation of electroless plating of Ni-B film according to plating bath temperature, ranging from $50^{\circ}C$ to $75^{\circ}C$ on Ag paste/anodised Al ($Al_2O_3$)/Al substrate to be used in metal PCB for high power LED packing systems. X-ray diffraction (XRD), Field-Emission Scanning Electron Microscopy (FE-SEM) and X-ray Photoelectron Spectroscopy (XPS) were used in the film analysis. By XRD result, the structure of the as deposited Ni-B film was amorphous irrespective of bath temperature. The activation energy of electroless Ni-B plating was 59.78 kJ/mol at the temperature region of $50{\sim}75^{\circ}C$. In addition, the Ni-B film grew selectively on the patterned Ag paste surface.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
• /
• v.15 no.6
• /
• pp.485-491
• /
• 2022

Intravenous injection is the most frequent invasive treatment for inpatients and is widely used for parenteral nutrition administration and blood products, and more than 1 billion procedures are used for peripheral catheter insertion, blood collection, and other IV therapy per year. Intravenous injection is one of the difficult procedures to be performed only by trained nurses with intravenous injection training, and failure can lead to thrombosis and hematoma or nerve damage to the vein. Accordingly, studies on auxiliary equipment capable of visualizing the vein structure of the back of the hand or arm are being published to reduce errors during intravenous injection. This study is a study on the performance difference according to the number of LEDs irradiating the 850nm wavelength band on a vein detector that visualizes the vein during intravenous injection. Four LED PCBs were produced by attaching NIR filters to CCD and CMOS camera lenses irradiated on the skin to acquire images, sharpen the acquired images using image processing algorithms, and project the sharpened images onto the skin. After that, each PCB was attached to the front end of the vein detector to detect the vein image and create a performance comparison questionnaire based on the vein image obtained for performance evaluation. The survey was conducted on 20 nurses working at K Hospital.

• Korean Journal of Optics and Photonics
• /
• v.21 no.3
• /
• pp.118-122
• /
• 2010

We fabricated a high power LED lamp structure which utilizes the modified COB concept based on an MCPCB with insulation layer partially removed. In the proposed structure, no insulation layer exists between the LED chip and the metal base. As a result, the heat generated in the chip is easily dissipated through the metal base. In actual measurement as well as in thermal simulation, the fabricated LED lamp structure showed superb thermal properties, compared to the SMD LED lamp attached on an MCPCB or the LED lamp based on conventional COB concept.

• Proceedings of the KAIS Fall Conference
• /
• 2010.11b
• /
• pp.941-943
• /
• 2010

근래 LED 조명기기 연구는 출력이 낮은 조명기기에서 고출력 전원을 이용한 고휘도 제품 개발로 바뀌는 추세이다. 고출력을 이용할 경우 단순히 히트싱크 형상, PCB 배치 및 물성 변경을 통한 방열문제 해결 방법으로는 LED 조명기기의 수명감소 문제를 해결하는데 한계가 있다. 따라서 방열능력을 더욱 향상시킬 수 있는 히트파이프(heat pipe)의 필요성이 대두되었다. 본 연구에서는 히트파이프를 이용해 고출력 LED 조명기기 개발을 위한 연구를 수행하였다.

• Journal of the Semiconductor & Display Technology
• /
• v.8 no.4
• /
• pp.25-29
• /
• 2009

In this study, a thin plate-type heat pipe, instead of a solid aluminium heat sink, is used to eliminate heat released from LED components for lighting. Effects of the heat pipe size and installation angle are studied both in numerically and experimentally. According to the results, temperature on LED chip, when a heat pipe is used, is $1.2^{\circ}C$ lower than using the conventional metal PCB. The overall temperature drop is $32^{\circ}C$ if the heat pipe is properly used. The highest cooling performance is obtained in the case when the angle of a heat pipe installation is $90^{\circ}$.

• Journal of the Microelectronics and Packaging Society
• /
• v.25 no.4
• /
• pp.149-154
• /
• 2018

This paper describes the fabrication and heat transfer property of 50 watts rated LED array module where multiple chips are mounted on chip-on-board type ceramic-metal hybrid substrate with high heat dissipation property for high power street and anti-explosive lighting system. The high heat transfer ceramic-metal hybrid substrate was fabricated by conformal coating of thick film glass-ceramic and silver pastes to form insulation and conductor layers, using thick film screen printing method on top of the high thermal conductivity aluminum alloy heat-spreading panel, then co-fired at $515^{\circ}C$. A comparative LED array module with the same configuration using epoxy resin based FR-4 PCB with thermalvia type was also fabricated, then the thermal properties were measured with multichannel temperature sensors and thermal resistance measuring system. As a result, the thermal resistance of the ceramic-metal hybrid substrate in the $4{\times}9$ type LEDs array module exhibited about one third to the value as that of FR-4 substrate, implying that at least triple performance of heat transfer property as that of FR-4 substrate was realized.

• The Transactions of The Korean Institute of Electrical Engineers
• /
• v.57 no.12
• /
• pp.2276-2280
• /
• 2008

In this paper, we present thermal dependancy of LED package element by changing temperature of MCPCB for design high efficiency LED lamp, and confirmed influence of LED chip against temperature with analysis of thermal resistance and thermal capacitance. As increasing temperature, WPOs were decreased from 25 to 22.5 [%] and optical power were also decreased. that is decreased reason of optical power that forward voltage was declined by decrease of energy bandgap. Therefore optical power by temperature of MCPCB should consider to design lamp for street light and security light. Moreover, compensation from declined optical efficiency is demanded when LED package is composed. Also, thermal resistances from chip to metal PCB were decreased from 12.18 to 10.8[$^{\circ}C/W$] by changing temperature. Among the thermal resistances, the thermal resistance form chip to die attachment was decreased from 2.87 to 2.5[$^{\circ}C/W$] and was decreased 0.72[$^{\circ}C/W$] in Heat Slug by chaning temperature. Therefore, because of thermal resistance gap in chip and heat slug, reliability and endurance of high power LED affect by increasing non-radiative recombination in chip from heat.

• Bulletin of the Korean Chemical Society
• /
• v.28 no.4
• /
• pp.520-528
• /
• 2007

A practical and efficient disposal of PCBs (polychlorinated biphenyls) in waste transformer oil by a chemical dechlorination process has been reported. The transformer oil containing commercial PCB mixtures (Aroclor 1242, 1254 and 1260) was treated by the required amounts of PEG 600 (polyethylene glycol 600), potassium hydroxide (KOH) and aluminum (Al), along with different reaction temperatures and times. The reaction of PEG with PCBs under basic condition produces arylpolyglycols, the products of nucleophilic aromatic substitution. The relative efficiencies of PCB treatment process were assessed in terms of destruction and removal efficiency (DRE, %). Under the experimental conditions of PEG600/KOH/Al/100 oC/2hr, average DRE of PCBs was approximately 78%, showing completely removal of PCBs containing 7-9 chlorines on two rings of biphenyl which appear later than PCB no. 183 (2,2',3,4,4',5',6-heptaCB) in retention time of GC/ECD. However, when increasing the reaction temperature and time to 150 oC and 240 min, average DRE of PCBs including the most toxic PCBs (PCB no. 77, 105, 118, 123 and 169) in PCB family reached 99.99% or better, with the exception of PCB no. 5 and 8 (2,3-diCB and 2,4'-diCB). In studying the reaction of PEG with PCBs, it confirmed that the process led to less chlorinated PCBs through a stepwise process with the successive elimination of chlorines. The process also permits complete recovery of treated transformer oil through simple segregating procedures.