• Proceedings of the IEEK Conference
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• 1998.06a
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• pp.839-842
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• 1998

The wide spread of multimedia system demands a large viewin gdesply device which can inform a message to many peoples in open area. This paper is about the design, simulating and testing of a large viewing LED pannel control ASIC(application specific integrated circuit). This LED pannel control ASIC runs on 16 bit microprocessor MC68EC000 and has following functions:16 line interlaced LED pannel controller, memory controller, 16 channel priority inerrupt controller, 2 channel direct memory access controller, 2 channel 12 bit clock and timer, 2 channel infrared remocon receiver, 2 channel RS-232C with 16byte FIFO, IBM PC/AT compatible keyboard interface, battery backuped real time clock, ISA bus controller, battery backuped 256 byte SRAM and watech dog timer. The 0.6micron CMOS sea of gate is used to design the ASIC in amount of about 39,000 gates.

• Proceedings of the KIEE Conference
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• 2006.07b
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• pp.1275-1276
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• 2006

As developing the information society, Lighting Emitted diode(LED) which is light source for illumination of next generation is attracted public attention. LED have many problem as narrow light view angle, high price, drift phenomenon of color coordinate, high heating problem for lower power, lower weight and small size. So, many researches have continued in a illumination as LED module type. in this problem, heating problem is very important and difficult and that is caused in decreasing phenomenon of brightness and drift phenomenon of color coordinate. so the problem of heating is urgent question for illumination of LED. In this paper, structural design of PCB changed as two type for solving the heating problem. also the properties of heating is analysed and optical properties is measured with heating image camera and spectrometer according to change in this design.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.229-230
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• 2009

This paper proposes a new design of ultra-slim color mixing lens (CML) for backlight unit (BLU), and presents simulated performance of the design. The novel color mixing structure has a shorter mixing length (< 1cm) than the existing color mixing structure, and achieves high efficiency and uniformity.

• Proceedings of the Korean Society of Broadcast Engineers Conference
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• 2016.11a
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• pp.199-200
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• 2016

전 세계적으로 효율이 높은 LED 조명이 각광 받기 시작하면서 기존의 조명보다 에너지 효율이 높은 LED 조명을 보다 효율적으로 사용하기 위한 다양한 방법들에 대한 관심이 높아지고 있다. 이에 본 논문에서는 기존의 스위치 구조의 제품을 분석하여 한계점을 파악하고, 사용자가 스위치를 교체하는 단순한 방식으로도 스마트 조명을 경험 할 수 있도록 LED조명을 효율적으로 사용하기 위한 벽면형 스위치 구조를 디자인 하고자한다.

• Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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• 2008.05a
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• pp.196-198
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• 2008

본 논문에서는 LED의 고출력화가 이루어지면서 많이 사용되고 있는 LED MR 타입과 PAR 타입의 램프 배광을 설계하였다. 1W와 5W급의 High power LED를 적용하였고, 1개의 LED가 사용된 빔각 30도의 MR16 램프부터 9개의 LED가 사용된 빔각 60도의 PAR30 램프까지 총 6가지 배광을 구현하고 최대광도로 각각의 성능을 평가하였다. 빔 각을 구현하고 집광시키기 위하여 LED dome 측면부에 소형의 반사판을 설계하였다.

• International journal of advanced smart convergence
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• v.2 no.2
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• pp.19-22
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• 2013

As the demand of the LED for lighting that emits light by p-n junction is increasing, studies on heatproof plate technology is being conducted to minimize the temperature of the LED lighting. As for the temperature of the LED devices, their light emitting efficiency decreases and the maximum lifespan drops down to 1/5. Therefore there are heat dissipation studies going on to minimize the heat. For LED heat dissipation, aluminum heat sink plates are mostly used. For this paper, we designed heat sink that fits residential 20W COB LED Down Light; packaged the heat sink and 20W COB and analyzed and evaluated the thermal properties through a Solidworks flow simulation. We are planning to design the optimal heat sink plate to solve the thermal agglomeration considering TIM(Thermal Interface material).

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.25 no.12
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• pp.60-66
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• 2011

There are several technological problems have to be resolved for LEDs to be used as a general purpose light source. In addition, there are several differences between existing luminaires and the general planer LED luminaire for the intensity distribution. Therefore, the optical engineer then faces the challenging a problem of designing for a spatially extended and non-uniform light source. In the previous studies on the optical design of luminaires, a lot of studies on reflectors and light source have been conducted but the ones on prisms and lenses are insufficient at present. This study developed the numerical model of planar prism LED luminaire to control luminous intensity distribution of LED luminaires. And this study presents an optical calculation process for the prism optical design of a planar prism LED luminaire and a comparison of the simulation results between the developed numerical model and Photopia 2.0 to verify the accuracy of the numerical model. In addition, this study showed a method for the control of various luminous intensity distribution from the developed numerical model.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.25 no.11
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• pp.26-32
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• 2011

In this study, a standard illuminant A type LED that has similar emission spectrum as the standard illuminant A was developed using LED chip(emission peak: 405[nm]) and four types of phosphors(blue, green orangered and red). Using the design of experiment for spectrum control, the trend of the change of spectrum shape influenced by the change of interaction among phosphors and their density could be examined. Computer simulation through the optimization of the design of experiment revealed that, among four phosphors, the most influential one on the shape of the spectrum was green phosphor. Using the obtained optimal combination ratio of the four phosphors, an alternative LED illuminant to the actual standard illuminant A was developed and the spectrums of these two were confirmed identical. Using this standard illuminant A type LED, a portable transmittance meter with the range of measurement error of ${\pm}1.0$[%] was developed.

• The Research Journal of the Costume Culture
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• v.30 no.2
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• pp.319-329
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• 2022

This study started from the practical need for a career experience program in the fashion major that is creative and responds to current methodologies. The purpose of this study is to propose a fashion work experience program that combines digital technology and practical experience. The research methods and procedures were as follows: fashion items and wearable devices were selected, the LED smart bag program was developed, and it was executed. A total of 123 students participated in the program, and a satisfaction survey was conducted after observation and oral evaluation. All of the participants completed the LED smart bag processes of design ideation, material selection, production, and styling using an eco-bag (one of the fashion items and as an LED wearable device). As a result of the participants' satisfaction (on a 5-point scale), most items showed a high level of satisfaction of 4.39 points or more. The smart bag program was evaluated to increase interest based on the time allotted and the students' level and to bolster their understanding of, and interest in, the fashion major. Therefore, this study is expected to be baseline to explore diversification of the fashion major work experience program, in order to create interest in the fashion major based on creative convergence competency.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.35-41
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• 2016

Ceramic-metal based high power LED array package was developed via thick film LTCC technology using a glass-ceramic insulation layer and a silver conductor patterns directly printed on the aluminum heat sink substrate. The thermal resistance measurement using thermal transient tester revealed that ceramic-metal base LED package exhibited a superior heat dissipation property to compare with the previously known packaging method such as FR-4 based MCPCB. A prototype LED package sub-module with 50 watts power rating was fabricated using a ceramic-metal base chip-on-a board technology with minimized camber deformation during heat treatment by using partially covered glass-ceramic insulation layer design onto the aluminum heat spread substrate. This modified circuit design resulted in a camber-free packaging substrate and an enhanced heat transfer property compared with conventional MCPCB package. In addition, the partially covered design provided a material cost reduction compared with the fully covered one.