• 제목/요약/키워드: LCD glass panel display

검색결과 69건 처리시간 0.034초

Anisotropic Conductive Film (ACF) Prepared from Epoxy/Rubber Resins and Its Fabrication and Reliability for LCD

  • Kim, Jin-Yeol;Kim, Eung-Ryul;Ihm, Dae-Woo
    • Journal of Information Display
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    • 제4권1호
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    • pp.17-23
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    • 2003
  • A thermoset type anisotropic conductive adhesive film (ACAF) comprising epoxy resin and natural butyl rubber (NBR) as the binder, micro-encapsulated imidazole as the curing agent, and Ni/Au coated polymer bead as a conductive particle has been studied. These films have been prepared to respond to requirements such as improved contact resistance, current status less of than 60 ${\mu}m$ and reliability. These films can also be used for connection between the ITO glass for LCD panel and the flexible circuit board. The curing conditions for the connection were 40, 20 and 15 seconds at 150, 170 and 190 $^{\circ}C$, respectively. The initial contact resistance and adhesion strength were 0.5 ${\Omega}/square$ and 0.4 kg/cm under the condition of 30 kgf/$^{cm}^2}$, respectively. After completing one thousand thermal shock cycling tests between -15 $^{\circ}C$ and 100 $^{\circ}C$, the contact resistance was maintained below 0.7 ${\Omega}/square$. Durability against high temperature (80$^{\circ}C$) and high humidity (85 % RH) was also tested to confirm long-term stability (1000 hrs) of the conduction.

폐 LCD 유리를 이용한 흡음특성을 갖는 붕규산유리발포체 제조 (Preparation of Borosilicate Foamed Glass Body with Sound Absorption Characteristics by the Recycling Waste Liquid Crystal Display Glass)

  • 이철태
    • 공업화학
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    • 제27권6호
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    • pp.612-619
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    • 2016
  • 폐 LCD 판넬로부터 회수된 폐 붕규산유리를 이용하여 흡음특성을 갖는 알루미늄 함유 붕규산유리발포체의 제조 가능성을 조사하였다. 입도 325 mesh 이하의 크기로 분쇄 조절된 폐 붕규산유리분말 100 g에 대해 발포제로서 탄소분을 0.3중량 분율, $Na_2CO_3$, $Na_2SO_4$, $CaCO_3$를 각각 1.5중량 분율, 기공조절제로서 $H_3BO_3$$Al_2O_3$를 각각 6.0 및 3.0 중량분율이 되도록 첨가한 원료 유리분말을 발포소성온도 $950^{\circ}C$에서 20 min간 발포를 진행함으로서 개기공률 45%를 갖는 발포체를 제조하였으며 이 경우 흡음률 0.5~0.7의 흡음 특성을 갖고 있음을 보여 주었다. 아울러 이 흡음성능을 지닌 알루미늄 함유 붕규산유리발포체는 밀도 $0.21g/cm^3$, 굽힘강도 $55N/cm^2$ 이상, 압축강도 $298N/cm^2$ 이상의 우수한 물성을 가지고 있어 다양한 용도에 내화학성 및 내열성의 흡음체로 사용될 수 있다.

Technology Trend and Requirement of Mobile Displays Using Low-Temperature Poly-Si (LTPS) Technologies

  • Kwon, Oh-Kyong
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권1호
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    • pp.409-412
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    • 2007
  • A lot of research for system-on-panel(SOP) have been done to integrate display systems including data driver, gate driver, timing controller, DC-DC converter, and smart functions such as embedded touch screen, ambient brightness sensing and luminance control, finger printing on the glass. Recently, the cost of an one-chip driver IC with various functions has decreased rapidly, and new mobile display interface technologies have been introduced. So it is necessary to examine the feasibility of SOP for practical mobile applications. In this paper, we will re-examine LTPS technologies for mobile displays in terms of various aspects and discuss the practical limitations on SOP technology and future technology trend of mobile displays.

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고에너지 밀링으로 제조된 폐디스플레이 패널 분말의 밀링시간에 따른 인듐 용출특성 (Characteristics of Indium Dissolution of Waste LCD Panel Powders Fabricated by High Energy Ball Milling (HEBM) Process with Milling Time)

  • 김효섭;성준제;이철희;홍현선;홍순직
    • 한국분말재료학회지
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    • 제18권4호
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    • pp.378-384
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    • 2011
  • In this research, the indium dissolution properties of the waste LCD panel powders were investigated as a function of milling time fabricated by high-energy ball milling (HEBM) process. The particle morphology of waste LCD panel powders changed from sharp and irregular shape of initial cullet to spherical shape with an increase in milling time. The particle size quickly decreased to 15 ${\mu}m$ until the first minute, then decreased gradually about 6 ${\mu}m$ with presence of agglomerated particles after 5 minutes, which increased gradually reaching a uniform size of 13 ${\mu}m$ consist of agglomerated particles after 30 minutes. The glass recovery, after dissolution, was over 99% at initial cullet, which decreased to 90.1 and 78.6% with increasing milling time of 1 and 30 minute respectively, due to a loss in remaining powder of the surface ball and jar, as well as the filter paper. The dissolution amount of indium out of the initial cullet was 208 ppm before milling, turning into 223 ppm for the mechanically milled powder after 1 minute, and nearly 146~125 ppm with further increase in milling time because of the reaction surface decrease of powders due to agglomeration. With this process, maximum dissolving indium amount (223 ppm) could be achieved at a particle size of 15 ${\mu}m$ with 1 minute of milling.

대면적 TFT-LCD를 위한 다결정 실리콘 박막 트랜지스터 (The Poly-Si Thin Film Transistor for Large-area TFT-LCD)

  • 이정석;이용재
    • 한국통신학회논문지
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    • 제24권12A호
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    • pp.2002-2007
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    • 1999
  • 본 논문에서는 유리기판 위에 고상결정화(SPC)로 제작된 n-채널 다결정 박막 트랜지스터(poly-Si TFT's)에 대해 전류-전압 특성, 이동도, 누설전류, 문턱전압, 그리고 부임계 기울기 등과 같은 전기적 특성을 측정함으로서 대면적, 고밀도 TFT-LCD에의 적용 가능성을 조사하였다. 채널 길이가 각각 2, 10, 25$\mu\textrm{m}$로 제작된 n-채널 poly-Si TFT에서, 전계 효과 이동도는 각각 11, 125, 116 $\textrm{cm}^2$/V-s이었으며, 누설전류는 각각 0.6, 0.1, 0.02 pA/$\mu\textrm{m}$로 나타났다. 또한 낮은 문턱전압과 q임계 기울기 그리고 양호한 ON-OFF ratio이 나타났다. 따라서, SPC로 제작된 poly-Si TFT는 대형유리기판에 디스플레이 패널과 구동시스템을 동시에 집적하는 대면적, 고밀도 TFT-LCD에 적용 가능한 것으로 판단된다.

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실험계획법을 이용한 진공유리 Pillar의 배치공정 최적화 (The Arrangement Process Optimization of Vacuum Glazing Pillar using the Design of Experiments)

  • 김재경;전의식
    • 반도체디스플레이기술학회지
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    • 제11권1호
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    • pp.73-78
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    • 2012
  • In this study, the optimal process condition was induced about the pillar arrangement process of applying the screen printing method in the manufacture process of vacuum glazing panel. The high precision screen printing is technology which pushes out the paste and spreads it by using the squeegee on the stainless steel plate in which the pattern is formed. The screen printing method is much used in the flat panel display field including the LCD, PDP, FED, organic EL, and etc for forming the high precision micro-pattern. Also a number of studies of screen printing method have been conducted as the method for the cost down through the improvement of productivity. The screen printing method has many parameters. So we used Taguchi method in order to decrease test frequencies and optimize this parameters efficiently. In this study, experiments of pillar arrangement were performed by using Taguchi experimental design. We analyzed experimental results and obtained optimal conditions which are 4 m/s of squeegee speed, $40^{\circ}$ of squeegee angle and distance between metal mask and glass.

고상 결정화로 제작한 다결성 실리콘 박막 트랜지스터에서의 열화특성 분석 (The Analysis of Degradation Characteristics in Poly-Silicon Thin film Transistor Formed by Solid Phase Crystallization)

  • 정은식;이용재
    • 한국전기전자재료학회논문지
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    • 제16권1호
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    • pp.26-32
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    • 2003
  • Then-channel poly-Si thin-film transistors (poly-Si TFT's) formed by solid phase crystallization (SPC) method on glass were measured to obtain the electrical parameters such as of I-V characteristics, mobility, leakage current, threshold voltage, and subthreshold slope. Then, devices were analyzed to obtain the reliability and appliability on TFT-LCD with large-size and high density. In n-channel poly-Si TFT with 5$\mu\textrm{m}$/2$\mu\textrm{m}$, 8$\mu\textrm{m}$, 30$\mu\textrm{m}$ devices of channel width/length, the field effect mobilities are 111, 116, 125 $\textrm{cm}^2$/V-s and leakage currents are 0.6, 0.1, and 0.02 pA/$\mu\textrm{m}$, respectively. Low threshold voltage and subthreshold slope, and good ON-OFF ratio are shown, as well. Thus. the poly-Si TFT's used by SPC are expected to be applied on TFT-LCD with large-size and high density, which can integrate the display panel and peripheral circuit on a targe glass substrate.

비접촉 레이저 광센서의 성능 향상을 위한 센서보정에 관한 연구 (Development of a Sensor Calibration to Enhance the Performance of a Non-contact Laser Optical Sensor Unit)

  • 서평원;유영기;오춘석;변종환
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2006년 학술대회 논문집 정보 및 제어부문
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    • pp.579-581
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    • 2006
  • Flat panel image display devices such as TFT LCD and PDP have required more large area and high quality control components. To control the qualities of the components, measurements of the flatness of a plate glass has been required. In order to measure the shape of the specular objects, Non-Contact Optical Sensor using Hologram laser unit was proposed. The sensor has a optical system that is composed of a Hologram laser and objective lens. The temperature of the sensor body is controlled by TEC(Thermoelectric Cooler) to maintain the same wavelength of the diode laser. In this research, we proposed the calibration scheme to make sensor real time measuring sensor. From the experimental results we see that the proposed sensor unit can measure the position of the glass surface in rial time.

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평판 투명 물체의 형상측정을 위한 비접촉식 광센서 개발 (Development of a noncontact optical sensor for measuring the shape of transparent plates)

  • 윤상필;유영기
    • 제어로봇시스템학회:학술대회논문집
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    • 제어로봇시스템학회 2000년도 제15차 학술회의논문집
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    • pp.214-214
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    • 2000
  • This paper deals with the non contact optical sensor to measure the shape of transparent plates such as glass panel of LCD(Liquid Crystal Display). The conventional methods to obtain the shape or thickness of a transparent plates are contact type sensor such as LVOT(Linear Variable Differential Transformer). Due to the contact between the tip of the sensor and the surface of objects, the tip is abraded. In addition, the high temperature glass casting makes the size of sensor body changed. These reasons makes the sensor degraded. In this paper, to overcome these problem, we proposed a low cost noncontact optical sensor this is composed of the Hologram laser unit of a CD-Pickup and a plastic lens. To evaluate the performance of the proposed optical sensor, a series of experiments were performed for various measurement condition. Based upon observation of the experimental result, the developed sensor shows good result for measuring the shape of transparent plates.

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ACF를 이용한 COG 접합 공정에서 도전볼의 음영비와 접촉 저항과의 관계 (Relationship between Contrast Ratio of Conductive Particle and Contact Resistance on COG Bonding using ACF)

  • 진송완;정영훈;최은수;김보선;윤원수
    • 한국정밀공학회지
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    • 제31권9호
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    • pp.831-838
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    • 2014
  • Chip on glass (COG) bonding using anisotropic conductive film (ACF) is a key technology to assemble a driver IC onto a LCD glass panel. In this paper, an experimental investigation was conducted to investigate the correlation between contact resistance and characteristics of image taken by machine vision based inspection system. The results show that the contact resistance was strongly influenced by the contrast ratio of conductive particle rather than the number of conductive particles. Also, number of conductive particles whose contrast ratio is below 0.75 is crucial for determining the quality of the assembled samples. On the other hand, in the result of high temperature high humidity storage test, the contrast ratio of samples was increased. However, in the case of open-circuit samples after temperature humidity storage test, the number of conductive particles whose contrast ratio is above 0.75 was more than that of the closed-circuit samples.