• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2007.06a
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• pp.149-156
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• 2007

Non-contact transportation of the large-sized glass plate using air-cushion is considered for sputtering system of LCD panel. The Argon gas from second gas injection holes is injected to levitate and transport the glass plate. Low maximum pressure and uniform pressure distribution on the bottom surface of the glass plate must be maintained for stable levitation and transportation of the glass plate. Therefore, the analysis of fluid flow between the glass plate and the air-pad is numerically performed for varying space between the injection holes in this study. The pressure uniformity on the bottom surface of the glass plate is evaluated for overall glass plate. The distance between the injection holes must be designed below 90 mm for obtaining the low maximum pressure and uniform pressure distribution.

• Proceedings of the IEEK Conference
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• 2008.06a
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• pp.515-516
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• 2008

We studied about new module technology to solve warpage problems that produce bending of cell in the LCD (Liquid crystal display). Characteristics of cell gap and glass bending of applying heat Panel's PAD part and cell at various temperature was investigated. When applies heat and compresses PAD party only in case of compressing COG(Chip on Glass), uniformity of cell gap that happen by glass bending by temperature of these compressing COG in the PAD party is decreased.

• Journal of the Semiconductor & Display Technology
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• v.7 no.3
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• pp.11-16
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• 2008

The authors investigated an overhead shuttle (OHS) system for automatic transferring the liquid crystal display (LCD) panels. The constructed tracks of OHS system include the linear and curve regions and have been installed on the ceiling to transfer the cassette of LCD glass along the closed-loop and open-loop tracks. In this study, the OHS system was implemented by a proposed linear motor to solve encoder installation and the system cost problems of the long distance transfer system. In addition, we utilized a new algorithm of the position detection and a new control algorithm for driving linear motor. The newly developed control algorithm was demonstrated from both a computer simulation and an experimentation, indicating that the highly reliable and speedy transfer system can enhance the LCD panel productivity of commercial OHS system.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.33 no.11
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• pp.886-893
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• 2009

To develop glass panel vacuum lift system for the post process in module line of FPD(Flat panel display) such as LCD and PDP, new vacuum adsorption parts of this system are proposed. These parts are composed of variable geometry configurations utilizing ceramic porous medium for variable size of glass panels. In order to design this device, detail understanding of flow phenomena in the flow path of vacuum adsorption system is essential. Thus, CFD analysis and designs are performed for several configurations in terms of pressure drop and balancing force at the adsorption side. From the result, new configuration is recommended for optimum design and manufacturing purpose.

• 한국정보디스플레이학회:학술대회논문집
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• 2001.08a
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• pp.9-12
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• 2001

With the explosive growth of Note-PC and Desktop monitor market, TFT LCD market confronted a entire supply shortage during 1999. Forecasting a more booming stage for the next several years, many TFT-LCD panel manufacturers continue to expand the capacity of their existing plants and also make an additional investment in building new plants. The new investment is concentrated on the $4^{th}$ generation TFT LCD line in order to improve investment efficiency. The set up of the Samsung's Gen 3.5 line progressed with satisfactorily performance using $600{\times}720mm$ glass size. We have continuously reviewed several issues regarding the glass size for our next Gen. 4 line, which leads to adopt $730{\times}920mm$. Due to the continuous enlargement of a substrate size and following difficulty in transferring cassettes, the next line is expected to be the last line that employs "cassette transfer". The layout of the next line will shift from conventional "concentration-type" to "separation-type" configuration for the purpose of reducing transfer distance as well as transfer time. The details will be discussed in this paper.

• Journal of Information Display
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• v.5 no.2
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• pp.23-26
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• 2004

For high end, large area displays, all current LC modes require some degree of optical compensation to improve the front of screen viewing experience. Currently most optical films are laminated to the outside of the LCD cell, between the glass and polariser. In this paper we wish to show how it is possible to integrate the compensating optical film within a VA mode LCD cell. The paper will describe the process of making the biaxial film through the process of in-situ photopolymerisation of an aligned film of reactive mesogens in the cholesteric phase using polarised UV light. The film can be made on the colour filter array side of the LCD panel. In addition the process of fabricating a VA mode LCD containing this film will be described and the performance of this module will be presented.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07b
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• pp.913-918
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• 2005

It is expected that the inkjet technology offers prospect for reliable and low cost manufacturing of FPD (Flat Panel Display). This inkjet technology also offers a more simplified manufacturing process for various part of the FPD than conventional process. For example, recently the novel manufacturing processes of color filter (C/F) in LCD, or RGB patterning in OLED by inkjet printing method have been developed. This elaborates will be considered as the precious point of manufacturing process for the mass production of enlarged-display panel with a low price. On this point of view, we would like to review the status of inkjet technology in FPD, with some results on forming micro line by inkjet patterning of suspension type silver nano ink as below. We have studied the inkjet patterning of synthesized aqueous silver nano-sol on interface-controlled ITO glass substrate. Furthermore, we designed the conductive ink for direct inkjet patterning on bare ITO glass substrate. The first, the highly concentrated polymeric dispersant-assisted silver nano sol was prepared. The high concentration of batch-synthesized silver nano sol was possible to 40 wt%. At the same time the particle size of silver nanoparticles was below $10{\sim}20nm$. The second, the synthesized silver nano sol was inkjet - patterned on ITO glass substrate. The connectivity and width of fine line depended largely on the wettability of silver nano sol on ITO glass substrate, which was controlled by surfactant. The relationship was understood by wetting angle. The line of silver electrode as fine as $50{\sim}100\;{\mu}m$ was successfully formed on ITO glass substrate. The last, the direct inkjet-patternable silver nano sol on bare ITO glass substrate was designed also.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.25 no.6
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• pp.440-444
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• 2016

Owing to the introduction of various IT devices with emphasis on portability and design, the TFT (thin film transistor liquid crystal display) panel applied to IT devices has the same shape as the product, and the portability requirement of IT devices has resulted in a need for panels with higher rigidity. In this study, the effect of grinding conditions such as the feed rate and edge speed of edge grinding on the surface roughness and chipping of the machined surface is investigated using a metal bond wheel. During edge grinding of alkari-free glass, weak mechanical property of glass results in big chipping owing to generation of tensile stress at the end of grining operation. The results of this study show that the grinding characteristics of alkali-free glass are obtained and meet industry requirements.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.3
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• pp.57-64
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• 2007

New Chip-on-glass technology to attach an Si chip directly on the glass substrate of LCD panel was studied with local heating method of the Si chip by using thin film heater fabricated on the Si chip. Square-shaped Cu thin film heater with the width of $150\;{\mu}m$, thickness of $0.8\;{\mu}m$, and total length of 12.15 mm was sputter-deposited on the $5\;mm{\times}5\;mm$ Si chip. With applying current of 0.9A for 60 sec to the Cu thin film heater, COG bonding of a Si chip to a glass substrate was successfully accomplished with reflowing the Sn-3.5Ag solder bumps on the Si chip.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.3 s.168
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• pp.115-122
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• 2005

As the digital TV markets rapidly growing, many manufacturers introduce large size flat screen TV units. There are two different display types available to large size models which are plasma and TFT-LCD. Since both are constructed with thin large panels that are mostly fragile to even moderate mechanical shock inputs. Some large size panels are severely resonated by the acoustic sound generated TV which deteriorates video quality. Recognizing the potential problems of large displays, accurate measurement of the panels is to be an essential task for the reliable design. Measurement of mechanical properties of a thin large crystallized panel such as TFT-LCD display with traditional material testing equipments is challenging. Since TFT-LCDs are constructed with combination of brittle glass panels, polymer sheets, and liquid crystal, their properties are not only anisotropic but also usually non-linear. Accurate measurement of the properties often requires very expensive facilities. Especially when the size of the test sample is as large as 40-inch or wider, direct measurement cost is prohibitive. Even worse, machining of the large TFT-LCD to make a smaller size specimen that could be fit into a material tester is not possible because of liquid crystal leakage. A new method fer the measurement of elastic modulus of large TFT-LCD panel is presented in this article. The suggested method provides a simple, economic, and user-friendly way fer measuring the elastic modulus of large panels with considerable level of accuracy.