Proceedings of the IEEK Conference (대한전자공학회:학술대회논문집)

The Institute of Electronics and Information Engineers (대한전자공학회)
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Investigation for warpage in the COG Module process

COG Module 공정에서의 Glass 휨 연구

  • Kim, Byoung-Yong (School of Electrical and Electronic Engineering Yonsei University) ;
  • Seo, Dae-Shik (School of Electrical and Electronic Engineering Yonsei University)
  • 김병용 (연세대학교 전기전자공학부) ;
  • 서대식 (연세대학교 전기전자공학부)
  • Published : 2008.06.18
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Abstract

We studied about new module technology to solve warpage problems that produce bending of cell in the LCD (Liquid crystal display). Characteristics of cell gap and glass bending of applying heat Panel's PAD part and cell at various temperature was investigated. When applies heat and compresses PAD party only in case of compressing COG(Chip on Glass), uniformity of cell gap that happen by glass bending by temperature of these compressing COG in the PAD party is decreased.

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