• 반도체디스플레이기술학회지
• /
• 제6권1호
• /
• pp.59-64
• /
• 2007

Non-contact transportation of a large-sized glass plate using air cushion for the vertical sputtering system of liquid crystal display (LCD) panel was considered. The objective of the study was to design an air pad unit which was composed of multiple injection and exhaust holes and mass flow supplying pipe. The gas was injected through multiple small holes to maintain the force for levitating glass plate. After hitting the plate, the air was vented through exhaust holes. Complex flow field and resulting pressure distribution on the glass surface were numerically studied to design the air injection pad. The exhaust hole size was varied to obtain evenly distributed pressure distribution at fixed diameter of the injection hole. Considering the force for levitating glass plate, the diameter of the exhaust hole of 30 to 40 times of the gas injection hole was recommended.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2005년도 추계학술대회 논문집
• /
• pp.423-426
• /
• 2005

A new chip on glass(COG) technique by making use of a high power diode laser for LCD driver IC packaging of LCD has been developed. A laser joining technology of the connection of IC chip to glass panel has several advantages over conventional method such as hot plate joining: shorter process time, high reliability of joining, and better fur fine pitch joining. The reach time to cure temperature of ACF in laser joining is within 1 second. In this study, results show that the total process time of joining is reduced by halves than that of conventional method. The adhesion strength is mainly 100-250 N/cm. It is confirmed that the COG technology using high power diode laser joining can be applied to advanced LCDs with a fine pitch.

• 한국정보디스플레이학회:학술대회논문집
• /
• 한국정보디스플레이학회 2001년도 International Meeting on Information Display
• /
• pp.9-12
• /
• 2001

With the explosive growth of Note-PC and Desktop monitor market, TFT LCD market confronted a entire supply shortage during 1999. Forecasting a more booming stage for the next several years, many TFT-LCD panel manufacturers continue to expand the capacity of their existing plants and also make an additional investment in building new plants. The new investment is concentrated on the $4^{th}$ generation TFT LCD line in order to improve investment efficiency. The set up of the Samsung's Gen 3.5 line progressed with satisfactorily performance using $600{\times}720mm$ glass size. We have continuously reviewed several issues regarding the glass size for our next Gen. 4 line, which leads to adopt $730{\times}920mm$. Due to the continuous enlargement of a substrate size and following difficulty in transferring cassettes, the next line is expected to be the last line that employs "cassette transfer". The layout of the next line will shift from conventional "concentration-type" to "separation-type" configuration for the purpose of reducing transfer distance as well as transfer time. The details will be discussed in this paper.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2009년도 추계학술대회 논문집
• /
• pp.717-718
• /
• 2009

• 대한전자공학회:학술대회논문집
• /
• 대한전자공학회 2008년도 하계종합학술대회
• /
• pp.515-516
• /
• 2008

We studied about new module technology to solve warpage problems that produce bending of cell in the LCD (Liquid crystal display). Characteristics of cell gap and glass bending of applying heat Panel's PAD part and cell at various temperature was investigated. When applies heat and compresses PAD party only in case of compressing COG(Chip on Glass), uniformity of cell gap that happen by glass bending by temperature of these compressing COG in the PAD party is decreased.

• 한국생산제조학회지
• /
• 제25권6호
• /
• pp.440-444
• /
• 2016

Owing to the introduction of various IT devices with emphasis on portability and design, the TFT (thin film transistor liquid crystal display) panel applied to IT devices has the same shape as the product, and the portability requirement of IT devices has resulted in a need for panels with higher rigidity. In this study, the effect of grinding conditions such as the feed rate and edge speed of edge grinding on the surface roughness and chipping of the machined surface is investigated using a metal bond wheel. During edge grinding of alkari-free glass, weak mechanical property of glass results in big chipping owing to generation of tensile stress at the end of grining operation. The results of this study show that the grinding characteristics of alkali-free glass are obtained and meet industry requirements.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2002년도 하계학술대회 논문집
• /
• pp.185-189
• /
• 2002

Flexible displays such as plastic based LCDs and organic light-emitting diodes for mobile communication devices have been researched and developed at KETI in KOREA since 1997. The Plastic film substrate has so poor thermal tolerance and non-rigidness that the fabrication of active devices and panel assembly have to perform at low temperature and pressure. In addition, high thermal expansion of the substrate is also a serious problem for reliable metallic film deposition. In this paper, we investigated particularly on the fundamental characteristics of various plastic substrates and then, suggested novel methods that improve the fabrication processes of plastic LCD panel. In order to maintain stable substrate surface and uniform cell gap during panel assembly, we utilized newly-invented iii and vacuum chuck. Electro-optical characteristics of fabricated plastic LCD are better than or equivalent to those of typical glass based LCDs though it is thinner, lighter-weight and more robust.

• Journal of Information Display
• /
• 제10권2호
• /
• pp.54-61
• /
• 2009

The results of the optimization of the organic passivation process for fabricating thin-film transistors (TFTs) with a high aperture ratio on a seventh-generation glass (2200${\times}$1870 mm) substrate for LCD-TV panels are reported herein. The optimization of the organic passivation process has been verified by checking various factors, including the material properties (e.g., thickness, stain, etching, thermal reflow) and the effects on the TFT operation (e.g., gate/data line delay and display-driving properties). The two main factors influencing the organic passivation process are the optimization of the final thickness of the organic passivation layer, and the gate electrode. In conclusion, the minimum possible final thickness was found to be $2.42{\um}m$ via simulation and pilot testing, using the full-factorial design. The optimization of the organic passivation layer was accomplished by improving its brightness by over 10 cd/$m^2$ (ca. 2% luminance) compared to that of the conventional organic passivation process. The results of this research also help reduce the reddish stain on display panels.

• 한국정보디스플레이학회:학술대회논문집
• /
• 한국정보디스플레이학회 2008년도 International Meeting on Information Display
• /
• pp.1263-1266
• /
• 2008

TFT-LCD panel makers have been enlarging size of TV screens, and 50-inch TFT-LCD is one of the main stream products already. To have more improved resolution, productivity and lower manufacturing cost, new TFT-LCD factories adopt large mother glass, new TFT structure and new process/materials. Along with these technology evolution, laser repair system should equip with upgraded performance and additional functions on user's demand. Laser repair technology is reviewed and newly developed repair technology is being introduced.

• Journal of Information Display
• /
• 제5권2호
• /
• pp.23-26
• /
• 2004

For high end, large area displays, all current LC modes require some degree of optical compensation to improve the front of screen viewing experience. Currently most optical films are laminated to the outside of the LCD cell, between the glass and polariser. In this paper we wish to show how it is possible to integrate the compensating optical film within a VA mode LCD cell. The paper will describe the process of making the biaxial film through the process of in-situ photopolymerisation of an aligned film of reactive mesogens in the cholesteric phase using polarised UV light. The film can be made on the colour filter array side of the LCD panel. In addition the process of fabricating a VA mode LCD containing this film will be described and the performance of this module will be presented.