• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.09a
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• pp.21-30
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• 2002

According the difference of flex substrate, (reel tape), there are three kind assembly types of LCD driver IC is COG, TCP and COF, respectively. The TCP is the maturest in these types for stability of raw material supply and other specification. And TCP is the major assembly type of LCD driver IC and the huge demand from Taiwan's large TFT LCD panel house since this spring. But due to its package structure and the raw material applied in this package, there is some limitation in fine pitch application of this package type, (TCP). So, COF will be very potential in compact and portable application comparison with TCP in the future. There are three kinds assembly methods in COF, one is ACF by using the anisotropic conductive film to connect the copper lead of tape and gold bump of IC, another is eutectic bonding by using the thermo-pressure to joint the copper lead of tape and gold bump of IC, and last is NCP by using non-conductive paste to adhere the copper lead of tape and gold bump of IC. To have a global realization, this paper will briefly review the status of Taiwan's large TFT panel house, the internal driver IC design house, and the back-end assembly house in the beginning. The different material property of raw material, PI tape is also compared in the paper. The more detail of three kinds of COF assembly method will be described and compared in this paper.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.1
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• pp.11-17
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• 2007

The CCFLs, EEFLs and FFLs use mercury and the operating conditions are different at warm or cold temperature. At start of operation, there may exist a possibility of inhomogeneous operation of lamps or channels of FFL to the very low vapor pressure of mercury at low temperature. In this paper, an inverter with level control block (LCB) was developed to drive LCD backlight using FFL stably at low temperature range. The operation of FFL backlight at $-20^{\circ}C$ was successfully demonstrated by developing inverter with LCB under 130 Watt of power consumption.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.3
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• pp.41-46
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• 2008

Etching kinetics of $EAGLE^{2000TM}$ LCD glass was investigated using 2.5MHF-xMHCl$(x:0\sim8)$ acid mixtures. It was concluded that the reaction of HF-containing solutions with the glass was the rate-determining step for the dissolution process when considering following observations; the value of the activation energy $35\sim45$ kJ/mol and insensitivity of the dissolution rate to the etching time and the moving velocity of the glass into the solution. The etching rate linearly increased with increasing the HCl concentration in the etchant. It was also observed that the etched surface was as smooth as the original surface by addition of HCl and increase in etching temperature. This is due to the catalytic role of the $H_{3}O^{+]$ ions in the dissolution process.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.103-105
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• 2003

COG (Chip on Glass) technology using solder bump reflow has been investigated to attach IC chip directly on glass substrate of LCD panel. As It chip and LCD panel have to be heated to reflow temperature of the so]der bumps for COG bonding, it is necessary to use low-temperature solders to prevent the damage of liquid crystals of LCD panel. In this study, using the Sn-52In solder bumps of $40{\mu}m$ pitch size, solder joints between Si chip and glass substrate were made at temperature below $150^{\circ}C$. The contact resistance of the solder joint was $8.58m\Omega$, which was much lower than that of the joint made using the conventional ACF bonding technique. The Sn-52In solder joints with underfill showed excellent reliability at a hot humid environment.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.3
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• pp.57-64
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• 2007

New Chip-on-glass technology to attach an Si chip directly on the glass substrate of LCD panel was studied with local heating method of the Si chip by using thin film heater fabricated on the Si chip. Square-shaped Cu thin film heater with the width of $150\;{\mu}m$, thickness of $0.8\;{\mu}m$, and total length of 12.15 mm was sputter-deposited on the $5\;mm{\times}5\;mm$ Si chip. With applying current of 0.9A for 60 sec to the Cu thin film heater, COG bonding of a Si chip to a glass substrate was successfully accomplished with reflowing the Sn-3.5Ag solder bumps on the Si chip.

• Journal of the Microelectronics and Packaging Society
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• v.2 no.2
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• pp.9-18
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• 1995

LCD의 투명전극으로 사용되는 ITO박막의 반응성 스퍼터링 공정변수 및 열처리에 따른 저기적 특성과 광학적 특성의 변화에 대하여 연구하였다. 90wt% In-10wt% Sn 합금 타겉을 사용한 반응성 스퍼터링으로는 LCD의 투명전극으로 사용하기 위한 100~300$\Omega$/$\square$의 면저항과 가시광선 영역에서 85%이상의 투과도 특성을 모두 만족하는 ITO 박막의 제조가 이루어지지 않았으나 30$0^{\circ}C$의 온도로 Ar 분위기에서 1시간 열처리에 의해 18$\Omega$/$\square$의 낮은 면저항과 가시광선 영역에서의 투과도 95%의 우수한 전기적, 광학적 특성을 갖는 ITO 박막 의 제조가 가능하였다.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.253-257
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• 2003

The low temperature flip chip technique is applied to the package of the temperature-sensitive devices for LCD systems and image sensors since the high temperature process degrades the polymer materials in their devices. We will introduce the various low temperature flip chip bonding techniques; a conventional flip chip technique using eutectic Bi-Sn (mp: $138^{\circ}C$) or eutectic In-Ag (mp: $141^{\circ}C$) solders, a direct bump-to-bump bonding technique using solder bumps, and a low temperature bonding technique using low temperature solder pads.

• Proceedings of the Materials Research Society of Korea Conference
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• 1998.08a
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• pp.100.2-100
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• 1998

• The monthly packaging world
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• s.164
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• pp.110-131
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• 2006

(사)한국물류협회 (회장 서병륜)과 건설교통부, 매일경제신문이 공동으로 주최하는 2006년도 한국물류대상 시상식이 지난달 16일 서울 중구 대한상공회의소에서 개최됐다. 이번 행사에서는 건설교통부 장관과 서병륜 (사)한국물류협회장, 물류산업계 및 학계 인사 등 5백여명이 참석한 가운데 거행됐다. 한국물류대상을 한국물류협회, 건설교통부, 매일경제신문이 공동으로 주최하는 행사로 1993년부터 매년 시행하는 물류부문 정부 포상이다. 효율적이고 체계적인 물류혁신에 노력한 기업과 개인을 발굴하여 포상하고 있으며 매년 그 위상이 격상되어 오고있다. 올해는 원자재 조달과 관련한 Inbound 물류에 중점을 두고, 물류혁신 활동을 추진한 삼성전자(주) 탕정공장 LCD총괄 (상무이사 김명국)이 동탑산업훈장을, 유한킴벌리 (주) (전무이사 김순조)와 오뚜기물류서비스(주) (대표이사 강세영)이 산업포장을 수상하는 등 24개 단체 및 개인이 수상의 영예를 안았다. 본 고에서는 제14회 한국물류대상 수상자들의 활약상들을 살펴본다.

• Journal of Information Display
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• v.4 no.1
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• pp.17-23
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• 2003

A thermoset type anisotropic conductive adhesive film (ACAF) comprising epoxy resin and natural butyl rubber (NBR) as the binder, micro-encapsulated imidazole as the curing agent, and Ni/Au coated polymer bead as a conductive particle has been studied. These films have been prepared to respond to requirements such as improved contact resistance, current status less of than 60 ${\mu}m$ and reliability. These films can also be used for connection between the ITO glass for LCD panel and the flexible circuit board. The curing conditions for the connection were 40, 20 and 15 seconds at 150, 170 and 190 $^{\circ}C$, respectively. The initial contact resistance and adhesion strength were 0.5 ${\Omega}/square$ and 0.4 kg/cm under the condition of 30 kgf/$^{cm}^2}$, respectively. After completing one thousand thermal shock cycling tests between -15 $^{\circ}C$ and 100 $^{\circ}C$, the contact resistance was maintained below 0.7 ${\Omega}/square$. Durability against high temperature (80$^{\circ}C$) and high humidity (85 % RH) was also tested to confirm long-term stability (1000 hrs) of the conduction.