• 한국정보디스플레이학회:학술대회논문집
• /
• 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권2호
• /
• pp.1545-1546
• /
• 2007

Zinc gallate-based RGB phosphors and vertically aligned carbon nanotube emitters are prepared for flat field-emission lamp. The blend phosphors of blue $ZnGa_2O_4$, green $ZnGa_2O_4:Mn^{2+}$ and red $ZnGa_2O_4:Cr^{3+}$ are coated on the front glass, and the carbon nanotubes are chemically bonded on the rear ITO glass as a cathode.

• 대한전기학회:학술대회논문집
• /
• 대한전기학회 2006년 학술대회 논문집 정보 및 제어부문
• /
• pp.579-581
• /
• 2006

Flat panel image display devices such as TFT LCD and PDP have required more large area and high quality control components. To control the qualities of the components, measurements of the flatness of a plate glass has been required. In order to measure the shape of the specular objects, Non-Contact Optical Sensor using Hologram laser unit was proposed. The sensor has a optical system that is composed of a Hologram laser and objective lens. The temperature of the sensor body is controlled by TEC(Thermoelectric Cooler) to maintain the same wavelength of the diode laser. In this research, we proposed the calibration scheme to make sensor real time measuring sensor. From the experimental results we see that the proposed sensor unit can measure the position of the glass surface in rial time.

• 센서학회지
• /
• 제20권3호
• /
• pp.187-192
• /
• 2011

Abrasive blaster is similar to sand blaster, and effectively removes hard and brittle materials. Exiting abrasive blaster has applied to rough working such as deburring and rough finishing. As the need for machining of ceramics, semiconductor, electronic devices and LCD are increasing, micro abrasive blaster was developed, and became the inevitable technique to micromachining. This paper describes the performance of the micro blaster in MEMS process of glass and succeed in domestically producing complete micro blaster. Diameter of hole and width of line in this etching is 100 ${\mu}m$ ~ 1000 ${\mu}m$. Experimental results showed good performance in micro channel and hole in glass wafer. Therefore, this micro blaster could be effectively applied to the micro machining of semiconductor, micro PCR chip.

• 제어로봇시스템학회:학술대회논문집
• /
• 제어로봇시스템학회 2000년도 제15차 학술회의논문집
• /
• pp.214-214
• /
• 2000

This paper deals with the non contact optical sensor to measure the shape of transparent plates such as glass panel of LCD(Liquid Crystal Display). The conventional methods to obtain the shape or thickness of a transparent plates are contact type sensor such as LVOT(Linear Variable Differential Transformer). Due to the contact between the tip of the sensor and the surface of objects, the tip is abraded. In addition, the high temperature glass casting makes the size of sensor body changed. These reasons makes the sensor degraded. In this paper, to overcome these problem, we proposed a low cost noncontact optical sensor this is composed of the Hologram laser unit of a CD-Pickup and a plastic lens. To evaluate the performance of the proposed optical sensor, a series of experiments were performed for various measurement condition. Based upon observation of the experimental result, the developed sensor shows good result for measuring the shape of transparent plates.

• 한국정보디스플레이학회:학술대회논문집
• /
• 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.I
• /
• pp.665-667
• /
• 2005

VIATRON TECHNOLOGIES has developed FE-RTP system that enables LTPS LCD and AMOLED manufacturers to produce poly-Si films at low cost, high throughput, and high yield. The system employs sequential heat treatment methods using temperature control and rapid thermal processor modules. The temperature control modules provide exceptionally uniform heating and cooling of the glass substrates to within ${\pm}2^a\;C$. The rapid thermal process that combines heating with field induction accelerates the treatment rates. The new FE-RTP system can process $730{\times}920mm$ glass substrates as thin as 0.4 mm. The uniform nature of poly-Si films produced by FE-RTP resulted in AMOLED panels with no laser-Muras. Furthermore, FE-RTP system also showed superior performances in other heat treatment processes involved in poly-Si TFT fabrications, such as dopant activation, gate oxide densification, hydrogenation, and pre-compaction.

• 한국정밀공학회지
• /
• 제27권6호
• /
• pp.32-38
• /
• 2010

Laser material processing technology is adopted in several industry as alternative process which could overcome weakness and problems of present adopted process, especially semiconductor and display industry. In semiconductor industry, laser photo lithography is doing at front-end level, and cutting, drilling, and marking technology for both wafer and EMC mold package is adopted. Laser cleaning and de-flashing are new rising technology. There are 3 kinds of main display industry which use laser technology - TFT LCD, AMOLED, Touch screen. Laser glass cutting, laser marking, laser direct patterning, laser annealing, laser repairing, laser frit sealing are major application in display industry.

• 한국정보디스플레이학회:학술대회논문집
• /
• 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.II
• /
• pp.913-918
• /
• 2005

It is expected that the inkjet technology offers prospect for reliable and low cost manufacturing of FPD (Flat Panel Display). This inkjet technology also offers a more simplified manufacturing process for various part of the FPD than conventional process. For example, recently the novel manufacturing processes of color filter (C/F) in LCD, or RGB patterning in OLED by inkjet printing method have been developed. This elaborates will be considered as the precious point of manufacturing process for the mass production of enlarged-display panel with a low price. On this point of view, we would like to review the status of inkjet technology in FPD, with some results on forming micro line by inkjet patterning of suspension type silver nano ink as below. We have studied the inkjet patterning of synthesized aqueous silver nano-sol on interface-controlled ITO glass substrate. Furthermore, we designed the conductive ink for direct inkjet patterning on bare ITO glass substrate. The first, the highly concentrated polymeric dispersant-assisted silver nano sol was prepared. The high concentration of batch-synthesized silver nano sol was possible to 40 wt%. At the same time the particle size of silver nanoparticles was below $10{\sim}20nm$. The second, the synthesized silver nano sol was inkjet - patterned on ITO glass substrate. The connectivity and width of fine line depended largely on the wettability of silver nano sol on ITO glass substrate, which was controlled by surfactant. The relationship was understood by wetting angle. The line of silver electrode as fine as $50{\sim}100\;{\mu}m$ was successfully formed on ITO glass substrate. The last, the direct inkjet-patternable silver nano sol on bare ITO glass substrate was designed also.

• 마이크로전자및패키징학회지
• /
• 제12권4호통권37호
• /
• pp.315-321
• /
• 2005

교류자기장에 의한 유도가열체를 이용하여 LCD 평판 디스플레이 패널의 가열을 최소화하면서 IC 칩을 실장시킬 수 있는 COG 접속기술에 대해 연구하였다. 크기 5mm${\times}$5mm, 두께 $600{\mu}m$의 Cu 도금막으로 제조한 유도가열체에 14 kHz, 230 Oe의 교류자기장을 인가시 60초 이내에 유도가열체의 온도가 Sn-3.5Ag 무연솔더의 리플로우에 필요한 $250^{\circ}C$에 도달하였으며, 유도가열체로부터 2 mm 떨어진 부위에서부터 기판의 온도는 $100^{\circ}C$ 이하로 유지되었다. 이와 같은 Cu 도금막 유도가열체에 14 kHz, 230 Oe의 교류자기장을 120초 동안 인가하여 Sn-3.5Ag 솔더범프를 리플로우 시켜 COG 실장을 하는 것이 가능하였다.

• 한국정보디스플레이학회:학술대회논문집
• /
• 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
• /
• pp.1640-1644
• /
• 2006

The first issue that should be overcome in copper process is its poor adhesive strength between pure copper film and glass substrate. In this study, defining the adhesive strength of pure copper film on various substrates and clarifying the key deposition parameters are presented for the investigation of copper process. First, using different kinds of surface plasma treatments were studied and the results showed that the adhesive strength was not improved even though the roughness of glass substrate surface was increased. Second, adding an adhesive layer between glass substrate and pure copper film was used to enhance the adhesion. Based on the data in the present paper, adopting copper alloy film as an adhesive layer can have capability preventing peeling problem in copper process. Besides, Cu/Cu alloy structure could be etched with the same etchant with better taper angle than the one with single layer of Cu. Unlike Cu/Mo structure, there is no residual problem for Cu/Cu alloy structure during etching process. Finally, this structure was examined in electrical test without significant difference in comparison with the conventional metal process.

• 한국정밀공학회지
• /
• 제31권9호
• /
• pp.831-838
• /
• 2014

Chip on glass (COG) bonding using anisotropic conductive film (ACF) is a key technology to assemble a driver IC onto a LCD glass panel. In this paper, an experimental investigation was conducted to investigate the correlation between contact resistance and characteristics of image taken by machine vision based inspection system. The results show that the contact resistance was strongly influenced by the contrast ratio of conductive particle rather than the number of conductive particles. Also, number of conductive particles whose contrast ratio is below 0.75 is crucial for determining the quality of the assembled samples. On the other hand, in the result of high temperature high humidity storage test, the contrast ratio of samples was increased. However, in the case of open-circuit samples after temperature humidity storage test, the number of conductive particles whose contrast ratio is above 0.75 was more than that of the closed-circuit samples.