• 제목/요약/키워드: LCD Glass

검색결과 294건 처리시간 0.102초

장거리 이송용 고출력 영구자석 여자 횡자속 선형전동기 제어에 관한 연구 (A Study on Control of High Power PM Excited TFLM for Long Distance)

  • 전진용;황계호;김지원;김규식
    • 전력전자학회논문지
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    • 제11권5호
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    • pp.471-479
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    • 2006
  • LCD 원판이 세대별로 대형, 중량화됨에 따라 제조, 공정라인의 자동 반송장비도 대형화 되어 가고 있는 추세다. 기존 스토커는 크레인의 주행축에 회전형 전동기와 기계적 동력변환 장치를 사용하고 있어, 복잡한 구조와 기계적 마찰에 의한 잦은 유지, 보수가 필요하게 되고 파티클 발생을 최소화 시켜야 하는 문제점을 안고 있다. 이런 문제점들을 해결하기 위해, 본 논문에서는 단위면적당 추력이 큰 영구자석 여자 횡자속 선형전동기를 적용하고 제안된 제어 알고리즘 및 제어기, 전력변환장치를 제작해서 대형, 고출력, 장거리화 되고 있는 7세대 스토커의 주행축에 실험, 검증하였다.

LCD용 컬러필터 보호막 (Thin layer(Overcoat) for TFT-LCD color filter)

  • 김명구;박주현;임영택
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2006년도 추계학술대회 논문집 Vol.19
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    • pp.273-273
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    • 2006
  • Over the past years, a large number of acrylate polymers have been developed and the overcoat thin layer containing acrylate polymers have been used for TFT-LCD color filter. As forming thin layer using acrylate polymers, the existing acrylate polymers have some problems such as low hardness by low Tg temperature, coating uniformity and solubility in organic solvent. To solve these problems, we synthesized new polymer(Scheme.), containing olefin monomer, which has high Tg temperature, good coating uniformity and good solubility in organic solvent. The overcoat thin layer containing new polymer resulted in good coating uniformity, stain, spot, scratch, heat resistance, DOP(Degree Of Planarization) on RGB glass, transparency, hardness, adhesion, anti-chemicals(anti-acid, anti-base, anti-organic solvent), insulation and anti-humidity. Scheme. The structure of new polymer X = Olefin monomer contains ketone, ester, hydroxy, ether, halogen, nitrile, alkoxy, phenyl functional group $R_1$ and $R_2$= H or $CH_3$. Ratio=0<[1/(1+m+n)]<0.7,0.1[$\leq$[n/(1+m+n)]<0.5.

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Development of 2-inch Plastic Film STN LCD

  • Park, Sung-Kyu;Han, Jeong-In;Kim, Won-Keun;Kwak, Min-Gi
    • Journal of Information Display
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    • 제1권1호
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    • pp.14-19
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    • 2000
  • Due to distinct properties of plastic substrates such as poor thermal resistance, non-rigidness and high thermal expansion, it is difficult to fabricate plastic film LCDs by conventional LCD processes. Poor thermal resistance and high thermal expansion of substrates induced deformation of substrates surface, mismatch of thermal expansion between ITO electrodes and substrates resulted in defects in the ITO electrodes during the high temperature process. Defects of ITO electrodes and non-uniform cell gap caused by non-rigid and flexible properties were also observed in the pressuring process. Based on in these observations, we used a newly developed material and fabrication process to prevent deformation of substrates, defects of electrodes and to maintain uniform cell gap. The maximum temperature of the process is limited up to $110^{\circ}C$ and pressure loaded during the process is five times less than conventional one. With these invented processes and materials, we obtained highly reliable Plastic Film STN LCDs whose electro-optical characteristics are better than or equivalent to those of typical glass LCDs.

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비접촉 평판 디스플레이 이송장치에서 양력을 고려한 평판 디스플레이의 처짐 해석 (Flat Panel Display Deflection Analysis Considering Lift Force in Non-Contact Flat Panel Display Conveyer System)

  • 황성현;최현창;노태정;손태영;박범석
    • 대한기계학회논문집A
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    • 제32권5호
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    • pp.451-457
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    • 2008
  • Flat Panel Display(FPD) is widely used a video display terminals to consumer products of LCD and PDP. The contamination and damage were affected by using the previous contact conveyor's method. In this paper, it analyzes the FPD deflection to develop the non-contact FPD transfer process using lift force. Each conveyor's equipment is called a horizontal conveyor, vertical conveyor and robot pick-up equipment. As result of an analysis of FPD panel's deflection, a robot pick-up equipment has performed according to under the present conditions like panel's weight and loaded glass to move FPD panel from one place to other places properly. Results of the analysis showed 0.474 mm, 0.424 mm and 1.237 mm. Those values are lower than a predicted optimum values : 2 mm for both horizontal and vertical conveyers; 5 mm for robot pick-up equipment. Therefore, those results verify each equipment have safety and reliability.

LCD 백라이트용 Xe계 플라즈마 평판 램프의 구동 전압 Pulse의 조건에 따른 방전 특성 연구 (Discharge Characteristics of Xe Plasma Flat Lamp for LCD Backlight According to Operating Voltage Pulse)

  • 권은미;김혁환;이원종
    • 한국재료학회지
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    • 제13권4호
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    • pp.271-278
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    • 2003
  • Conventional backlight for liquid crystal display (LCD) uses mercury which leads to environmental pollution. In this study, characteristics of AC coplanar type mercury-free plasma flat lamp have been studied. Pollution-free Xe-He is adopted as a discharge gas system. Since the Xe gas has a lower efficiency in generating vacuum ultraviolet (VUV) than mercury, the improvement of luminance and luminous efficiency in the Xe gas system is very important. The electrode, dielectric, and phosphor layers constituting lamp are formed on the bottom glass by the screen printing method. The effects of pulse shape, on-time, and pulse frequency on the luminance and luminous efficiency have been examined. For Xe(5%)-He gas, the lamp exhibits higher efficiency with sharper pulse shape, higher peak voltage, and shorter pulse on-time (up to 2 $\mu\textrm{s}$). Higher efficiency and lower consumption of power were obtained at 30 kHz than at 60 kHz. The collision of ion to bottom electrodes is a dominant factor to raise the lamp temperature. Therefore the high voltage and low current discharge system is necessary for reduction of the lamp temperature as well as for enhancement of the luminous efficiency.

대면적 상온 Indium Zinc Oxide 투명 도전막의 물성 특성 비교 (The Comparison to Physical Properties of Large Size Indium Zinc Oxide Transparent Conductive Layer)

  • 정대영;이영준;박준용;이준신
    • 한국표면공학회지
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    • 제41권1호
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    • pp.6-11
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    • 2008
  • An Indium Zinc Oxide(IZO) transparent conductive layer was deposited on a large size glass substrate by using magnetron dc sputtering method with varying a deposition temperature. As the deposition temperature decreased to a room temperature, the sheet resistance of IZO film increased. But this deposition temperature range is included in an applicable to a device. From a standpoint of the sheet resistance, the differences of the sheet resistance were not great and the uniformity of the layer was uniformed around 10%. Crystallization particles were shown on the surface of the layer as deposition temperature increased, but these particles were not shown on the surface of the layer as deposition temperature decreased to the room temperature. It didn't make a scrap of difference in a transmittance of varying deposition temperature. Therefore, it is concluded that IZO thin film manufactured by the room temperature deposition condition can be used as a large size transparent conductive layer of a liquid crystal display device.

Anisotropic Conductive Film (ACF) Prepared from Epoxy/Rubber Resins and Its Fabrication and Reliability for LCD

  • Kim, Jin-Yeol;Kim, Eung-Ryul;Ihm, Dae-Woo
    • Journal of Information Display
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    • 제4권1호
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    • pp.17-23
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    • 2003
  • A thermoset type anisotropic conductive adhesive film (ACAF) comprising epoxy resin and natural butyl rubber (NBR) as the binder, micro-encapsulated imidazole as the curing agent, and Ni/Au coated polymer bead as a conductive particle has been studied. These films have been prepared to respond to requirements such as improved contact resistance, current status less of than 60 ${\mu}m$ and reliability. These films can also be used for connection between the ITO glass for LCD panel and the flexible circuit board. The curing conditions for the connection were 40, 20 and 15 seconds at 150, 170 and 190 $^{\circ}C$, respectively. The initial contact resistance and adhesion strength were 0.5 ${\Omega}/square$ and 0.4 kg/cm under the condition of 30 kgf/$^{cm}^2}$, respectively. After completing one thousand thermal shock cycling tests between -15 $^{\circ}C$ and 100 $^{\circ}C$, the contact resistance was maintained below 0.7 ${\Omega}/square$. Durability against high temperature (80$^{\circ}C$) and high humidity (85 % RH) was also tested to confirm long-term stability (1000 hrs) of the conduction.

TFT LCD Panel에서의 Bonding Tester를 통한 Sealant 접착력 특성 연구

  • 김대희;백성식;강신우;최병덕;정한욱
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2009년도 추계학술대회 논문집
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    • pp.198-198
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    • 2009
  • The size of LCD Panel is gradually getting bigger. But the efficient uses of glass and the increasing output of narrow bezel type makes importantly the role of sealant which bonding two glasses. We devised a new tester with pre-inserted blade for interfacial fracture toughness measurement, and evaluated quantitatively bonding ability of sealant. The blade tester has been analyzed with two process parameter, moving speed and inserting depth of blade.

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다이오드레이저를 이용한 디스플레이 모듈 내 이방성 전도 필름(ACF) 접합 기술에 관한 연구 (Study on a New ACF Bonding Methods in LCD Module Using a High Power Diode Laser)

  • 류광현;서명희;남기중;곽노흥
    • 한국레이저가공학회지
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    • 제8권3호
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    • pp.21-26
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    • 2005
  • A bonding process between tape-carrier package and a glass panel with anisotropic conductive film (ACF) has been investigated by making use of high power diode laser as a heat source for cure. The results from modeling of process and from optical properties of layers showed that heat absorbed from polyimide film surface and ACF layer is dominant source of curing during laser illumination. Laser ACF bonding has better bonding quality than conventional bonding in view of peel strength, flatness, pressure unbalance and processing time. New ACF bonding processes by making use of high power diode laser are proposed.

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Inter-Bay 물류 흐름을 고려한 반도체 Fab의 Unload 및 Load Request Logic 개발 (An Unload and Load Request Logic for Semiconductor Fab Considering Inter-Bay Material Flow)

  • 서정대;구평회;장재진
    • 산업공학
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    • 제17권spc호
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    • pp.131-140
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    • 2004
  • The purpose of this paper is to develop and show the efficiency of the URL(Unload Request Logic) and LRL(Load Request Logic) of the dispatcher in the Fab(Fabrication) Manufacturing Execution System. These logics are the core procedures which control the material(wafer and glass substrate) flow efficiently in the semiconductor and LCD fab considering inter-bay as well as intra-bay material flow. We use the present and future status information of the system by look-ahead and the information about the future transportation schedule of Automated Guided Vehicles. The simulation results show that the URL and LRL presented in this paper reduce the average lead time, average and maximum WIP level, and the average available AGV waiting time.