• 한국진공학회:학술대회논문집
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• 한국진공학회 2000년도 제18회 학술발표회 논문개요집
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• pp.186-186
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• 2000

After LeComber et al. reported the first amorphous hydrogenated silicon (a-Si: H) TFT, many laboratories started the development of an active matrix LCDs using a-Si:H TFTs formed on glass substrate. With increasing the display area and pixel density of TFT-LCD, however, high mobility TFTs are required for pixel driver of TF-LCD in order to shorten the charging time of the pixel electrodes. The most important of these drawbacks is a-Si's electron mobiliy, which is the speed at which electrons can move through each transistor. The problem of low carier mobility for the a-Si:H TFTs can be overcome by introducing polycrystalline silicon (poly-Si) thin film instead of a-Si:H as a semiconductor layer of TFTs. Therefore, poly-Si has gained increasing interest and has been investigated by many researchers. Recnetly, fabrication of such poly-Si TFT-LCD panels with VGA pixel size and monolithic drivers has been reported, . Especially, fabricating poly-Si TFTs at a temperature mach lower than the strain point of glass is needed in order to have high mobility TFTs on large-size glass substrate, and the monolithic drivers will reduce the cost of TFT-LCDs. The conventional methods to fabricate poly-Si films are low pressure chemical vapor deposition (LPCVD0 as well as solid phase crystallization (SPC), pulsed rapid thermal annealing(PRTA), and eximer laser annealing (ELA). However, these methods have some disadvantages such as high deposition temperature over $600^{\circ}C$, small grain size (<50nm), poor crystallinity, and high grain boundary states. Therefore the low temperature and large area processes using a cheap glass substrate are impossible because of high temperature process. In this study, therefore, we have deposited poly-Si thin films on si(100) and glass substrates at growth temperature of below 40$0^{\circ}C$ using newly developed high rate magnetron sputtering method. To improve the sputtering yield and the growth rate, a high power (10~30 W/cm2) sputtering source with unbalanced magnetron and Si ion extraction grid was designed and constructed based on the results of computer simulation. The maximum deposition rate could be reached to be 0.35$\mu$m/min due to a high ion bombardment. This is 5 times higher than that of conventional sputtering method, and the sputtering yield was also increased up to 80%. The best film was obtained on Si(100) using Si ion extraction grid under 9.0$\times$10-3Torr of working pressure and 11 W/cm2 of the target power density. The electron mobility of the poly-si film grown on Si(100) at 40$0^{\circ}C$ with ion extraction grid shows 96 cm2/V sec. During sputtering, moreover, the characteristics of si source were also analyzed with in situ Langmuir probe method and optical emission spectroscopy.

• 청정기술
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• 제21권4호
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• pp.209-216
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• 2015

인듐주석산화물(ITO)은 TFT-LCD, OLED 등의 투명전극에 널리 사용되는 소재이다. ITO의 주요 원소인 인듐(In)은 높은 비용과 제한된 매장량 등으로 인해 머지 않아 고갈될 것으로 예측되고 있다. 이에 대처하는 방법은 공정 후 잔류 ITO 타겟을 재활용하여 ITO 소재의 원료를 확보하는 것이다. 본 원고에서는 공정 후 잔류 ITO 타겟의 재자원화 기술 및 시장 동향 고찰 및 효율적인 재활용을 위한 방향을 제시하였다. 그 결과, 현재 국내 및 일본에서 대부분 잔류 ITO 타겟에서 In만을 재자원화하고 있는 것으로 파악되었다. 이외에도 ITO 나노분말 입자를 제조 및 분산한 용액을 이용하여 투명전극을 제작하는 연구개발이 진행되고 있다. 그러나, ITO 타겟을 이용한 투명전극이 다른 대체 기술을 적용한 것보다 우수하기 때문에, 보다 효율적인 ITO 재자원화 및 타겟 제작을 위해 ITO를 동시에 재생하는 기술 확립이 필요한 것으로 보인다.

• 경영과학
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• 제32권4호
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• pp.69-80
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• 2015

The semiconductor industry is one of those in which the most intricate processes are involved and there are many critical factors that are controlled with precision in those processes. Naturally production scheduling in the semiconductor industry is also very complex and studied by the industry and academia for many years; however, still there are many issues left unclear in the problem. This paper proposes an multi-objective optimization-based scheduling method for semiconductor fabrication(fab). Two main objectives are throughput maximization and meeting target production quantities. The first objective aims to reduce production cost, especially the fixed cost incurred by a large investment constructing a new fab facility. The other is meeting customer orders on time and also helps a fab maintain stable throughput through controlled WIP balancing in the long run. The paper shows a trade-off structure between the two objectives through experimental studies, which provides industrial practitioners with useful references.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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• pp.340-343
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• 2008

This work reports the simple fabrication of the single cell gap transflective liquid crystal display (LCD) using wire grid polarizer. The nano sized wire grid polarizer was patterned on common electrode itself, on the reflective part of FFS (Fringe field switching) mode whereas the common electrode was unpatterned at transmissive part. However, this structure didn't show single gamma curve, so we further improved the device by patterning the common electrode at transmissive part. As a result, V-T curve of proposed structure shows single gamma curve. Such a device structure is free from in-cell retarder, compensation film and reflector and furthermore it is very thin and easy to fabricate.

• 한국기계가공학회지
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• 제6권1호
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• pp.34-42
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• 2007

Powder blasting technique has been considered one of the most appropriate micro machining methods for hard and brittle materials, since the productivity is high and the heat layers caused by material removal are very thin. Recent development of special purposed parts, such as the parts for semiconductor processing, the parts for LCD, sensors for micro machine fabrication and so on, has been expanded. Thus, it is essential to develop powder blasting technologies for micromachining of hard and brittle materials such as glass, ceramics and so on. In this paper, the characteristics of powder blasted glass surface were tested under various blasting parameters. Finally, we proposed a predictive model for powder blasting process using the neural network and the response surface method. Detail analysis of the simulation results is carried out and the performance of two predictive models is compared.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2010년도 춘계학술발표대회
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• pp.20.2-20.2
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• 2010

Recently inkjet printing technology has been developed in the areas of low cost fabrication in environmentally friendly manufacturing processes. Although inkjet printing requires the interdisciplinary researches including development of materials, manufacturing processes and printing equipment and peripherals, manufacturing a printhead is still core of inkjet technology. In this study, a piezoelectric driven DOD (drop on demand) inkjet printhead has been fabricated on three layers of the silicon wafer in MEMS Technology because of its chemical resistance to industrial inks, strong mechanical properties and dimensional accuracy to meet the drop volume uniformity in printed electronics and display industries. The flow passage, filter and nozzles are precisely etched on the layers of the silicon wafers and assembled through silicon fusion bonding without additional adhesives. The piezoelectric is screen-printed on the top the pressure chamber and the nozzle plate surface is treated with non-wetting coating for jetting fluids. Printheads with nozzle number of 16 to 256 have been developed to get the drop volume range from 5 pL to 80 pL in various industrial applications. Currently our printheads are successfully utilized to fabricating color-filters and PI alignment layers in LCD Flat Panel Display and legend marking for PCB in Samsung Electronics.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2000년도 제1회 학술대회 논문집
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• pp.19-20
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• 2000

We have developed the 12.1" SVGA reflective type color TFT-LCD(Thin Film Transistor - Liquid Crystal Display) with the high aperture ratio and well designed reflector for the applications such as mini note PC, Note PC and electronic book. The panel shows the high reflectance(30%) and contrast ratio(20:1) resulted from optimizing the optical films and designing the embossing shaped reflector. By improving the chromacity, the color reproducibility was increased up to 20%. As removing the backlight unit, we reduced the power consumption, thickness and weight of the panel to 0.8W, 2.2mm, and 250gram, respectively. According to the above performances, we have obtained fabrication process for mass production, and furthermore, could have access to fast market launching.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.413-413
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• 2007

In recent years, flexible display devices such as liquid crystal display (LCD), organic light emitting diode (OLED), etc. have attracted considerable interest in a wide variety of applications. Polymer substrate is absolutely necessary to realize this kind of flexible display devices. Using the polymer as a substrate, there are lots of advantages including not only mechanical flexibility such as rolling and bending characteristics but also light weights, low cost and so on. In detail, thickness and weights is only one forth and one second of glass substrate, respectively. However, it needs low temperature below $150^{\circ}C$ in the fabrication process comparing to conventional deposition process. The polymer substrate is not thermally stable as much as the glass substrate so that some deformation can be occurred according to variation of temperature. In particular, performance of devices can be easily deteriorated by shrinkage of substrate when heating it. In this paper, pre-annealing and deposition of buffer layer was introduced and studied to solve previously mentioned problems of the shrinkage and followed shear stress.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.431-432
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• 2007

In this study, we used screen printing on the rear glass with silver electrodes, phosphor and a dielectric which is on the silver electrodes, and carried out firing in the temperature of $550^{\circ}C$, $570^{\circ}C$, $450^{\circ}C$ each. To seal the rear and top glass together, we used crystalline frit paste as a sealing material with dispenser and carried out firing up to $450^{\circ}C$. As using this panel, we focused on optimizing the condition which influences characteristics of discharging by the distance between electrodes, electrode structure, type and pressure of gases for FFL.

• Macromolecular Research
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• 제9권6호
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• pp.303-312
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• 2001

The fabrication of liquid crystal display (LCD) panels involves several thermal processes such as imidization of the alignment layer (AL) and annealing of the rubbed polyimide AL. The nature of these processes on the LC alignment, especially on the pretilt angle (Θ$\_$p/) has been systematically studied, employing various types of polyimide structures. The imidization effect depends on the nature of polyimid precursors; Θ$\^$p/ increases with the degree of the imidization for the main-chain type of ALs, due to the decrease in the surface polarity, but this relation is not applicable to the alkylated ones in which the steric effect at the AL surface by the aliphatic side chains is dominant. Annealing of the rubbed polyimide AL deteriorates its rubbing-induced molecular orientation and subsequently the overlying LC alignment, resulting in the decrease in Θ$\_$p/. Especially, annealing of the LC cell affects the LC-AL interaction as well as the AL orientation and thus its effect on LC alignment depends sensitively on the nature of LC-polyimide interface; aromatic moiety in the polyimide structure gives better thermal stability of LC alignment while fluorinated polyimide ALs induce the less stable alignment.