• Laser Solutions
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• v.13 no.2
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• pp.1-5
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• 2010

A high speed laser texturing method that relies on laser scanner conditions, to form pattern shapes with micro-narrow surface detail such as dotted line features is demonstrated and analyzed. For example, this method may be used to piston ring and gear part for automotive. Data on friction characteristics of two laser patterns employed for STD61 steel will be shown. Comparison of pattern depths obtained by repetition overlapping process with laser scanner to the results on friction coefficient will be provide. It will be shown that friction characteristic in dotted line patterns can significantly depend upon interaction with the lubrication and laser pattern conditions. Laser pattern processing into a shallow depth provides only slight improvement in friction, while work into a deep shape indicates a significant improvement.

• Laser Solutions
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• v.12 no.4
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• pp.6-11
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• 2009

The LDS(Laser Direct Structuring) process uses thermoplastic polymers with a additive compound that serves as plating seed after the activation by laser. It can realize industry requirement such as miniaturization of electrical component, design flexibility and reduction of production steps. The purpose of this study is to introduce LDS, and to investigate the fundamental mechanism. Also the characteristics of conductive patterns were investigated with respect to laser fluence and intensity. We have used a pulsed fiber laser (wavelength : 1064nm) and copper electroless plating to fabricate conductive patterns. The result showed that laser induced metal-organic complex was caused metalization by electroless copper plating, the critical laser fluence was $1.41\;J/cm^2$ at a scan speed of 1 m/s.

• Laser Solutions
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• v.13 no.2
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• pp.10-16
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• 2010

Laser-assisted machining is dependent on absorbed energy density into workpiece. Generally, the absorptivity of laser beam is dependent on wave length of laser, materials, surface roughness, etc. Various shapes and energy densities for beam irradiation can be used to laser-assisted machining. In this thesis, efficient method of heat source modeling was developed and designed by using one fundamental experimental trials. And then, laser-assisted machining of rod-shaped cast iron was simulated by using commercial FEM code MARC. Simulations and experiments with various conditions were carried out to determine suitable condition of pre-heating for laser-assisted turning process. Temperature distribution of cutting zone could be predicted by simulation.

• Transactions of the Korean Society of Automotive Engineers
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• v.2 no.4
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• pp.91-99
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• 1994

Tunable KrF Excimer Laser is used here for measuring OH and $O_2$ density distribustion in an open $H_2$/air premixed flame and in a combustion bomb. Laser Rayleigh Scattering(LRS) and Planar Laser Induced Predissociative Fluorescence(PLIPF) methods are used to obtain two-dimensional images of total and specific densities. Laser Excitation wavelengths are calibrated via flame images and combustion bomb images show good qualitative a greement with theoretical calculation. Furthermore images in a combustion bomb can be developed to study real Spark-Ignition engine combustions. Our experimental images show that there are no more collisional quenching problem at high pressure environment(including atmospheric pressure) using predissociative fluorescence technique. Further development to obtain two-dimensional temperature dustribution is ready to use eventhough it is not reported in this paper.

• Laser Solutions
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• v.18 no.4
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• pp.1-5
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• 2015

For continuous laser micro patterning on three-dimensional free form surface, innovative laser system is developed. The two axis galvanometer is combined with the dynamic focusing unit to increase optical distance. Also, it is synchronized with the 3 axis mechanical system. To determine laser machining sequence, laser CAM system is developed. It can make possible of 3D surface micro patterning under $25{\mu}m$ pattern width. The uniformity of pattern width is about 2.8% and it is validated that focal plane is well conserved by the dynamic focusing unit. Velocity and positional information of 1 axis is stage is fed to the scanner control board by the encoder signal and it makes possible real time synchronization. With this system, possible patterning volume is enlarged from $40{\times}40mm^2$ to $40{\times}120{\times}30mm^3$.

• Laser Solutions
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• v.15 no.4
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• pp.12-15
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• 2012

On behalf of the existing semiconductor process, the electronic devices to low-cost mass production to mass print the way, the research for development of roll-to-roll printing process is actively underway. This study was performed in about the research on the manufacturing technology of the printing roll used in the printing process of electronic devices. The indirect laser imprinting technology was used to create printable roll, and after coating copper on the surface of steel and thereon after coating polymer, after removing the polymer on the surface of roll, the printable roll was made. The laser system and roll feeder system were constructed and control program was developed. We has found the optimal conditions to perform laser patterning experiments using a system developed and We can make the minimum line width of 18 ${\mu}m$.

• Laser Solutions
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• v.12 no.1
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• pp.7-13
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• 2009

Engineering ceramics as sapphire are widely used in industry owing to their superior mechanical and corrosion properties. However, micromachining of sapphire is a considerable challenge due to its transparency. Recently, direct ablation of sapphire has been demonstrated with a visible laser pulse at sufficiently high laser intensity. In this work, the theoretical model for pulsed laser ablation of sapphire is suggested and numerical analysis is carried out using the model. Sapphire ablation begins with plasma generation by the laser interaction with surface defects, impurities and contaminations in the initial stage of machining. Subsequent absorption of the visible laser beam can be explained by three mechanisms: metalization of sapphire surface due to the EUV radiation from the hot plasma, increments of surface roughness and temperature-dependent absorption coefficient. Comparison of the computation results with experimental observation indicates that the proposed model of sapphire is reasonable.

• Journal of the Korean Society for Heat Treatment
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• v.22 no.6
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• pp.339-344
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• 2009

Recently, Laser surface treatment technologies have been used to improve wear charactenitics and fatigue resistance of metal molding. When the laser beam is irradiated on the surface and laser speed is appropriate, the laser focal position is rapidly heated and the thermal energy of surface penetrates the material after irradiation, finally imbuing it with a new mechanical characteristic by the process of self-quenching. This research estimates the material characteristic after efficient and functional surface treatment using HPDL, which is more efficient than the existing CW Nd:YAG laser heat source. To estimate this, microstructural changes and hardness characteristics of three parts (the surface treatment part, heat affect zone, and parental material) are observed with the change of laser beam speed and surface temperature. Moreover, the depth of the hardened area is observed with the change of the laser beam speed and temperature. From the results of the experiments, it has been shown that the maximum hardness is approximately 788Hv when the heat treatment temperature and the travel speed are $1150^{\circ}$ and 2 mm/sec, respectively.

• Proceedings of the Korean Society of Laser Processing Conference
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• 2006.06a
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• pp.89-96
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• 2006

In this study, PID control method was applied to decrease the power fluctuation of the pulse laser which is one of the major processing variables in laser machining process. To stabilize the power fluctuation of the pulse laser, we averaged 10 pulse outputs of Nd:YAG laser operating in 10Hz using boxcar averager, and with taking this averaged output as an input signal, we conducted PID control using optical attenuator which is consisted of half wave plate attached on the stepping motor and polarizer. When PID control was not enabled, the power fluctuation was 4.71% and with PID control, the power fluctuation was 1.86% for 2 hours and 1 hour respectively. As a result, we stabilized the power fluctuation of the pulse laser by 60.5%

• Journal of the Semiconductor & Display Technology
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• v.6 no.1 s.18
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• pp.11-15
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• 2007

Low-k wafer engraving process has been investigated by using UV pico-second laser with high repetition rate. Wavelength and repetition rate of laser used in this study are 355 nm and 80 MHz, respectively. Main parameters of low-k wafer engraving processes are laser power, work speed, assist gas flow, and protective coating to eliminate debris. Results show that engraving qualities of low-k layer by using a laser with UV pico-second pulse width and high repetition rate had better kerf edge and higher work speed, compared to one by conventional laser with nano-second pulse width and low repletion rate in the range of kHz. Assist gas and protective coating to eliminate debris gave effects on the quality of engraving edge. Total engraving width and depth are obtained less than $20\;{\mu}m$ and $10\;{\mu}m$ at more than 500 mm/sec work speed, respectively. We believe that engraving method by using UV pico-second laser with high repetition rate is useful one to give high work speed in laser material process.