• The Journal of the Korea Contents Association
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• v.11 no.12
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• pp.619-628
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• 2011

Normally vision-based 3D human pose recognition technology is used to method for convey human gesture in HCI(Human-Computer Interaction). 2D pose model based recognition method recognizes simple 2D human pose in particular environment. On the other hand, 3D pose model which describes 3D human body skeletal structure can recognize more complex 3D pose than 2D pose model in because it can use joint angle and shape information of body part. In this paper, we describe a development of interactive game contents using pose recognition interface that using 3D human body joint information. Our system was proposed for the purpose that users can control the game contents with body motion without any additional equipment. Poses are recognized comparing current input pose and predefined pose template which is consist of 14 human body joint 3D information. We implement the game contents with the our pose recognition system and make sure about the efficiency of our proposed system. In the future, we will improve the system that can be recognized poses in various environments robustly.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.1 s.34
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• pp.9-16
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• 2005

This paper presents the development of new anisotropic conductive adhesives with enhanced thermal conductivity for the wide use of adhesive flip chip technology with improved reliability under high current density condition. The continuing downscaling of structural profiles and increase in inter-connection density in flip chip packaging using ACAs has given rise to reliability problem under high current density. In detail, as the bump size is reduced, the current density through bump is also increased. This increased current density also causes new failure mechanism such as interface degradation due to inter-metallic compound formation and adhesive swelling due to high current stressing, especially in high current density interconnection, in which high junction temperature enhances such failure mechanism. Therefore, it is necessary for the ACA to become thermal transfer medium to improve the lifetime of ACA flip chip joint under high current stressing condition. We developed thermally conductive ACA of 0.63 W/m$\cdot$K thermal conductivity using the formulation incorporating $5 {\mu}m$ Ni and $0.2{\mu}m$ SiC-filled epoxy-bated binder system to achieve acceptable viscosity, curing property, and other thermo-mechanical properties such as low CTE and high modulus. The current carrying capability of ACA flip chip joints was improved up to 6.7 A by use of thermally conductive ACA compared to conventional ACA. Electrical reliability of thermally conductive ACA flip chip joint under current stressing condition was also improved showing stable electrical conductivity of flip chip joints. The high current carrying capability and improved electrical reliability of thermally conductive ACA flip chip joint under current stressing test is mainly due to the effective heat dissipation by thermally conductive adhesive around Au stud bumps/ACA/PCB pads structure.

• KIEAE Journal
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• v.16 no.3
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• pp.103-112
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• 2016

Recently, many New Han-oks have been constructing in all over the country to popularize as a type of green house. But, achievement of thermal performance of external wall is still the very important issue to become popular. Purpose: The purpose of this study is to verify the thermal performance level of modern New Han-ok through Temperature Difference Ratio inside(TDRi) analysis at corners of the external wall in Han-ok. Method: To achieve this goal, measurements were carried out in 12 Han-oks(experimental mock-up(1), exhibition Han-ok(1), happy village Han-oks(10)) by taking a infra-red thermography using thermal video system. Following are analysis items about connection joint between wall and wood columns of external wall conditions; the part between external wall and external wall(2D), external wall and ceiling(or floor)(2D), 2 external walls and ceiling(or floor)(3D) and so on. Result: It was analyzed that the probability of condensation at most of connection joint appear high and TDRi of 3D corners is higher than that of 2D corners in general. It means that the development of construction techniques about connection joint between wood columns and external wall is still required. The results of this study may be used to improve the construction technology of new Han-ok and as a basis for the specifying the desired thermal comfort environment of dwelling.

• Journal of muscle and joint health
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• v.17 no.1
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• pp.68-78
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• 2010

Purpose: This study was conducted to determine the effects of Tai-Chi exercise and self-help management program applying laughter therapy in patients with osteoarthritis. Methods: This quasi-experimental study recruited a sample of 61 patients with osteoarthritis (experimental group: 30, control group: 31) through the community healthcare centers located in Seoul and Kyung Gi area. The primary outcome measures included symptoms of osteoarthritis, basic physical performance, fatigue, and depression assessed before and after the study. The data were analyzed using SPSSWIN V. 12.0. Results: At the end of the six-week intervention, left shoulder flexibility (t=2.011, p=.049), 6m walking speed (t=3.639, p=.001), and right balance (t=-2.30, p=.025) were significantly improved in the control group. Fatigue (t=3.012, p=.004), stiffness (t=2,093, p=.041), right shoulder flexibility (t=2.138, p=.037), right balance (t=-2.065, p=.043), and 6m walking speed (t=2.683, p=.009) were significantly improved in the experimental group. Conclusion: A twice a week, 6-week tai-chi exercise self-help management program applying laughter therapy is effective in decreasing fatigue and stiffness. Osteoarthritis is one of common chronic diseases that the patients should be required to continue self management for the rest of their life. Therefore, there is a need to develop the more effective self-help management program and nursing intervention to motivate them to maintain their own self-help management.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.3
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• pp.37-42
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• 2003

In soldering of electronic packaging, the research on substituting lead-free solder materials for Pb-Sn alloys has become active due to environmental and health concerns over the use of lead. The reliability of the solder joint is very important in the development of solder materials and it is known that it is related to wettability of the solder over the substrate and microstructural evolution during soldering. It is also highly affected by type and extent of the interfacial reaction between solder and substrate and therefore, it is necessary to understand the interfacial reaction between solder and substrate completely. In order to predict the intermetallic compound (IMC) phase which forms first at the substrate/solder interface during the soldering process, a thermodynamic methodology has been suggested. The activation energy for the nucleation of each IMC phases is represented by a function of the interfacial energy and the driving force for phase formation. From this, it is predicted that the IMC phase with the smallest activation energy forms first. The grain morphology of the IMC at the solder joint is also explained by the calculations which use the energy. The Jackson parameter of the IMC grain with a rough surface is smaller than 2 but it is larger than 2 in the case of faceted grains.

• Journal of the Korean Wood Science and Technology
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• v.42 no.5
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• pp.571-578
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• 2014

As a way of developing wooden joint development, a glass fiber reinforced wood plate was manufactured to replace a steel plate. Also, the fracture toughness was evaluated. Through application to a cantilever-type specimen made of a column and a beam, the moment resistance performance was evaluated. For the fracture toughness specimen of the wood plate, 12 types were manufactured by varying the combination of a main member (veneer and plywood) and reinforcement (glass fiber sheet and glass fiber cloth). The results of the fracture toughness test indicated that the 5% yield load of the specimen using plywood was 18% higher than that of the specimen using veneer, and that the specimen reinforced by inserting glass fiber sheets between testing materials (Type-3-PS) had the highest average 5% yield load 4841 N. Thus, a moment resistance strength test was performed by applying Type-3-PS to a column-beam joint. The results of the test indicated that compared to the specimen using a steel plate and a drift pin (Type-A), the maximum moment ratio of the specimen using a glass fiber reinforced wood plate (Type-3-PS) and a drift pin (Type-B) was 0.79; and that a rupture occurred in the wood plate due to high stiffness of the drift pin. The maximum moment ratio of the specimen using a glass fiber reinforced wood plate (Type-3-PS) and a glass fiber reinforced wooden laminated pin (Type-C) was 0.67, which showed low performance. However, unlike Type-A, a ductile fracture occurred on Type-C, and the load gradually decreased even after the maximum moment.

• Earthquakes and Structures
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• v.18 no.1
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• pp.113-127
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• 2020

In this study, the behavior of external beam-column joints reinforced by plain and deformed bars with non-seismic reinforcement details is investigated and compared. The beam-column joints represented in this study include a benchmark specimen by seismic details in accordance with ACI 318M-11 requirements and four other deficient specimens. The main defects of the non-seismic beam-column joints included use of plain bar, absence of transverse steel hoops, and the anchorage condition of longitudinal reinforcements. The experimental results indicate that using of plain bars in non-seismic beam-column joints has significantly affected the failure modes. The main failure mode of the non-seismic beam-column joints reinforced by deformed bars was the accumulation of shear cracks in the joint region, while the failure mode of the non-seismic beam-column joints reinforced by plain bars was deep cracks at the joint face and intersection of beam and column and there was only miner diagonal shear cracking at the joint region. In the other way, use of plain bars for reinforcing concrete can cause the behavior of the substructure to be controlled by slip of the beam longitudinal bars. The experimental results show that the ductility of non-seismic beam-column joints reinforced by plain bars has not decreased compared to the beam-column joints reinforced by deformed bars due to lack of mechanical interlock between plain bars and concrete. Also it can be seen a little increase in ductility of substructure due to existence of hooks at the end of the development length of the bars.

• Journal of Acupuncture Research
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• v.27 no.2
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• pp.43-49
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• 2010

Objectives : Among young generation, the prevalence of spinal disorders is known to be increasing. This study aimed to analyze the clinical data of spinal disorder in young ages in Korea. Methods : Number of patient, kinds of disorder, and medical cost were analyzed for patients(7~18 years) underwent spinal disorders using computerized database of Health Insurance Review and Assessment Service(HIRAS) from 2004 to 2008. We included dorsopathies as spinal disorder according to Korean Classification of Diseases(KCD) and excluded spinal disorder caused by trauma. We compared the data of traditional Korean medicine treatment with that of western medical care. Results : 4.8% of the children and adolescents had medical treatment with spinal disorder in 2008. The claim number and medical cost for both traditional Korean medicine and western medicine treatment are increasing 1.8 and 1.3 times respectively over 5 years. Total medical spent of western clinic was 2.1 times than those of traditional Korean clinic. The most common spinal disorder was dorsalgia(31.8%) and scoliosis(13.5%) in western clinics while back pain(29.0%) and neck pain(10.8%) in oriental clinic. Conclusions : We first reported the clinical tendency of spinal disorder in Korean children adolescents from 2004 to 2008. This study will support the development of a strategy for traditional Korean medicine-based prevention or treatment of spinal disorders in young generation.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.11 no.1
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• pp.314-319
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• 2010

This paper represents the results of study on Extra High Voltage Power Cable Connection System Development. The purpose is to evaluate structural safety by numerical analysis for the relaxation of electric field concentration and by structural analysis of Carrier Pipe for easy installation of High Insulating Rubber Sleeve in the field, which is core technique of connection system. According to the results, the thickness of Carrier Pipe needs at least 9mm by optimization analysis of deformation behavior and insulating design & relaxation of electric field concentration. The result of contraction behavior of the connection part can be demonstrated with the same result of electric field relaxation analysis at the boundary of the electrode inserted into the insulating rubber sleeve.

• Journal of the Korean Society of Physical Medicine
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• v.10 no.4
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• pp.15-23
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• 2015

PURPOSE: We aims to promote the development of proprioception measurement using smartphones, goniometers, and laser pointers as compared to the conventional use of electrogoniometer measurement. METHODS: Measurements using an electrogoniometer were previously proved to be reliabile and valid. Among E-university students, 20 who had no fracture, operation history, or inflammatory arthritis were examined. These subjects had not performed regular exercise in the past 3 months. Proprioception measurements were performed using four different measurement tools, three times per day, for test-retest analysis. RESULTS: No notable test-retest differences were noted for any of the measurement methods (P>0.05). With regard to the test-retest reliability for each measurement method, we observed that the readings from both the electrogoniometer and smartphone have high reliability (ICC>0.80), whereas the readings from the laser pointer have moderate reliability (ICC>0.60). When assessing the concurrent validity between electrogoniometers with individual measurements, we did not observe any notable difference between the smartphone and electrogoniometer (P>0.05) and these tools in fact showed high correlation (r>0.60, P<0.05) and a moderate reliability (ICC>0.60). Moreover, there was no notable difference in between electrogoniometers and laser pointers (P<0.05). CONCLUSION: CONCLUSION: The findings of this suggested that proprioception can be measured by using smart-phones, and proved that this method has sufficient credibility. Moreover, we noted that the concurrent validity with smartphones was high in comparison with the conventional electrogoniometer, which also indicates the validity and credibility. Based on these findings, we conclude that the measurement of proprioception by using a smartphone can be widely adopted.