• Journal of the Korean Arthroscopy Society
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• v.1 no.1
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• pp.36-40
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• 1997

Anterior Cruciate Ligament (ACL) plays an important biomechanical role for the stability of knee joint. ACL injury often leads to injuries of articular cartilage, menisci, or other supporting structures, and subsequent development of degenerative arthritis. Controversies still exist in the best treatment modalities of ACL injuries. hut the author considers it most important to make the appropriate patient selection for operative reconstruction or nonoperative treatment. and describes the treatment principles of ACL injury, including diagnosis, patient selection and the treatment modalities for successful treatment of ACL injury.

• Maxillofacial Plastic and Reconstructive Surgery
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• v.37
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• pp.17.1-17.5
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• 2015

Arthroscopy is useful to detect early changes in the temporomandibular joint (TMJ). Despite great advances in arthroscopy, many arthroscopic surgeries have now been replaced by arthrocentesis. We propose a simple diagnostic and therapeutic method having operative rigid ultra-thin arthroscopy with 16 gauge needle size combined with arthrocentesis.

• 한국기계연구소 소보
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• s.18
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• pp.87-97
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• 1988

The algorithm for relation of contact status, track shift, and contact force caused from wheel/rail contact geometry is presented. Grafting this algorithm into a algorithm of general program analyzing mechanical system, the program for time domain simulation of railway vehicle dynamics, called CASOTD, was developed. In addition, as applied example of CASOTD, the dynamic simulation of railway vehicle running on a rail joint and a irregularly alinemented rail is done in this paper.

• 한국정보디스플레이학회:학술대회논문집
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• 2002.08a
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• pp.270-274
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• 2002

We have developed a new COG technique using flip chip solder joining technology for excellent resolution and high quality LCD panels. Using the eutectic Bi-Sn and the eutectic In-Ag solder bumps of 50-80 ${\mu}m$ pitch sizes, a ultrafine interconnection between IC and glass substrate was successfully made at or below $160^{\circ}C$. The contact resistance and reliability of Bi-Sn solder joint showed the superiority over the conventional ACF bonding.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.69-70
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• 2006

Waste vinyl tretreatment system has been developed by the joint project between KIMM and Woosung Co. General process for removal of impurities from waste vinyl is consisted of feeding, separating, cutting, washing, drying and recovering impurities. However, there are problems such as wastewater when washing of waste vinyl. In order to solve these problems we have developed new dry type cleaning system.

• 한국초전도학회:학술대회논문집
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• v.12
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• pp.67-67
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• 2002

• Proceedings of the KWS Conference
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• 2007.11a
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• pp.190-192
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• 2007

High Mn steel has been developed for automotive applications since the steel has an excellent combination of strength and ductility. However, from the viewpoint of welding, high Mn steel has a few problems related to its chemical composition. In this study, development of dissimilar laser welding technology has been investigated for expanding application of high Mn steel. The results have shown that dissimilar weld joint between high Mn steel and carbon steel has poor erichsen property using STS309L filler wire or not.

• Journal of the korean Society of Automotive Engineers
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• v.14 no.1
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• pp.13-24
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• 1992

1) 1/2 Scale Model 실험과 실제품 성형실험을 통하여 정밀 냉간단조에 의한 Tripod Slide Housing의 제조공정 설계기술을 확립하고, 4단계 성형공정으로 시제품 제작에 성공하였다. 2) Triod Slide Housing을 성형할 수 있는 4단계(전방압출, Heading, 후방압출, Ironing)의 금형을 설계 및 제작하여 시제품 생산에 적용하고, 관련 필요기술을 축적하였다. 3)XC 48 등 중,고탄소강의 소둔 실험을 통하여 소둔 조건에 따른 구상화율 및 경도의 변화에 대한 연구를 수행함으로써, 고탄소강의 냉간단조시에 필요한 최적 소둔 조건에 응용할 수 있는 자료를 축적하였다.

• Journal of the Speleological Society of Korea
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• no.69
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• pp.9-20
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• 2005

Geologic Structures are reflected on the landform development. So lots of studies are emphasized on the individual processes and mechanism of the relationship between geologic structures and landforms. In this study, many cases are represented, such as : weathering, stream directions and structures expecially joints, gnamas, meander bending etc. New D-D Diagrams and photos are available to explain the relations of two factors. Landform developments are depend on geologic structures.

• Transactions of Materials Processing
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• v.11 no.7
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• pp.596-600
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• 2002

The ultrasonic bonding method and its feasibility are investigated in this work for joining the micro components and MEMS packaging. The ultrasonic bonding process is analyzed using a lumped mode, and preliminary experiments using the eutectic solder and copper pin were carried out to verify possibility to MEMS packaging. The ultrasonic bonding process appears to be adequate for MEMS packaging by providing localized heating at the selected area. Microscopic behavior of the bond joint through ultrasonic vibration needs further investigation.