• Journal of Welding and Joining
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• 제20권2호
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• pp.77-81
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• 2002

Many kinds of Pb-free solder have been investigated because of the environmental concerns. Sn-Ag-Cu system is well blown as most competitive Pb-free solder. However, since Sn-Ag-Cu system has relatively high melting point compared to Sn-Pb eutectic, it may a limitation, the some application. In this study, Bi and In contained solder of $Sn_3Ag_8Bi_5In$ which has relatively lower melting point, $188~204^{\circ}C$, was investigated. $Sn_3Ag_8Bi_5In$ solder ball of $500\mu\textrm{m}$ diameter was set on the Ni/Cu/Cr-UBM and reflow soldered in the range of $220~240^{\circ}C$ for 5~15s. The maximum shear strength of the solder ball was around 170mN by reflowing at $240^{\circ}C$ for 10s. Intermetallic compound formed on the UBM of Si-wafer was analysed by SEM(scanning electron microscope) and XRD(X-ray diffractometer).

• Journal of Welding and Joining
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• 제16권5호
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• pp.48-55
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• 1998

This study was undertaken to investigate the friction welding of A2024-T6 aluminum alloy and SM45C carbon steel using insert metals. The relationships among the friction welding conditions, the tensile strength of joints, the hardness distribution of welds, the microstructure of welds and the tensile fracture surfaces were mainly investigated through this experiment. When the A6063-T5 aluminum alloy of insert metal was used, the maximum tensile strengh of joint was obtained. In this case, the maximum joint efficiency was 75.3 percent and in the case of unusing the insert metals, it was 37.7 percent. Optimal welding conditions were N=2000rpm, P$_1$=40MPa, P$_2$=140MPa, t$_1$=1.0sec and t$_2$=5sec.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2003년도 The 8th Asian Symposium on Precision Forging ASPF
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• pp.138-142
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• 2003

In this study, to show well favorable characteristics of warm forged material, we compared and analyzed microstructure and mechanical properties of general hot-forged material which finished heat treatment with warm-forged material which was produced by control cooling condition. Along with this, we suggested better direction of control cooling condition to be able to remove heat treatment process while satisfying mechanical properties.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 International Symposium
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• pp.203-215
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• 2002

Using eutectic In-Ag and Bi-Sn solder materials, we developed the COG technique having a minimum pitch of 50 ${\mu}{\textrm}{m}$. The maximum temperature in this process is $160^{\circ}C$. We fabricated spherical and uniform solder bumps by controlling the microstructure of Bi-Sn solder bumps. The contact resistances of Bi-Sn solder joints were 19 m$\Omega$ at $80{\mu}{\textrm}{m}$ pitch and 60 m$\Omega$ at $80{\mu}{\textrm}{m}$ pitch, respectively. These values are much lower than the contact resistance of the conventional ACF bonding. The contact resistances of the solder joint are almost the same before and after the underfill process. The contact resistance of the underfilled Bi-Sn solder joint did not change even after reliability test.

• 한국레이저가공학회지
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• 제2권1호
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• pp.38-42
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• 1999

As very large scale integration technology has been developed, much more accurate, reliable technology is needed for outer lead bonding. Laser soldering has been researched as an alternative for fine pitch device bonding. This study is focused on how to select optimal laser soldering variables with which solder wets parent material, the microstructural results of laser soldering and the reliability test One of popular packages, QFP100 was soldered successfully with two kinds of solder. The inspection of the joint for reliability was carried out by optical microscope, SEM, EDAX and pull test, which demonstrated the superiority of laser soldering.

• 한국세라믹학회지
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• 제43권4호
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• pp.247-252
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• 2006

Joining Yittria Stabilized Zirconia (YSZ) to NiCr metal was fabricated using YSZ/NiCr Functionally Graded Materials (FGM) Interlayer by hot pressing process. Microscopic observations demonstrate that the composition and microstructure of YSZ/NiCr FGM distribute gradually in stepwise way, eliminating the macroscopic ceramic/metal interface such as that in traditional ceramic/metal joint. The thermal characteristics of this YSZ/FGM/NiCr joint were studied by thermal shock testing and therml barrier testing. Thermal shock test was conducted by gas burner rig. Acoustic Emission (AE) monitoring was performed to analyze the microfracture behavior during the thermal shock test. It could be confirmed that FGM was the excellent performance of thermal shock/barrier resistance at above $1000^{\circ}C$.

• 한국초전도ㆍ저온공학회논문지
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• 제12권1호
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• pp.17-21
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• 2010

In the case of designing superconducting power apparatuses using the second generation high temperature superconducting wire, it is necessary to have a tape-splicing technique to achieve low splice resistance between coated conductor (CC) tapes. In this paper, an experimental splice method between YBCO CC tapes is proposed for a coil application. Splices were performed with a 37Pb-63Sn solder. YBCO samples were fabricated with various pressures and cooling rates. Joint resistances of the spliced samples of jointed YBCO CC tapes were measured and evaluated from V-I curves. In addition, optical micrographs were obtained to analyze the cross sectional microstructure of jointed samples.

• 한국초전도학회:학술대회논문집
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• 한국초전도학회 2002년도 High Temperature Superconductivity Vol.XII
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• pp.67-67
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• 2002

• 한국세라믹학회:학술대회논문집
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• 한국세라믹학회 2003년도 추계총회 및 연구발표회 초록집
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• pp.134.2-134
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• 2003

• Steel and Composite Structures
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• 제39권4호
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• pp.401-417
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• 2021

This study experimentally reveals the influence of welding on grade S690Q high strength steel (HSS) butt joints from both micro and macro levels. Total eight butt joints, taking plate thickness and welding heat input as principal factors, were welded by shielded metal arc welding. In micro level, the microstructure transformations of the coarse grain heat affected zone (CGHAZ), the fine grain heat affected zone (FGHAZ) and the tempering zone occurred during welding were observed under light optical microscopy, and the corresponding mechanical performance of those areas were explored by micro-hardness tests. In macro level, standard tensile tests were conducted to investigate the impacts of welding on tensile behaviour of S690Q HSS butt joints. The test results showed that the main microstructure of S690Q HSS before welding was tempered martensite. After welding, the original microstructure was transformed to granular bainite in the CGHAZ, and to ferrite and cementite in the FGHAZ. For the tempering zone, some temper martensite decomposed to ferrite. The performed micro-hardness tests revealed that an obvious "soft layer" occurred in HAZ, and the HAZ size increased as the heat input increased. However, under the same level of heat input, the HAZ size decreased as the plate thickness increased. Subsequent coupon tensile tests found that all joints eventually failed within the HAZ with reduced tensile strength when compared with the base material. Similar to the size of the HAZ, the reduction of tensile strength increased as the welding heat input increased but decreased as the thickness of the plate increased.