• Title/Summary/Keyword: Joint Microstructure

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Study on Joint of Micro Solder Bump for Application of Flexible Electronics (플렉시블 전자기기 응용을 위한 미세 솔더 범프 접합부에 관한 연구)

  • Ko, Yong-Ho;Kim, Min-Su;Kim, Taek-Soo;Bang, Jung-Hwan;Lee, Chang-Woo
    • Journal of Welding and Joining
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    • v.31 no.3
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    • pp.4-10
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    • 2013
  • In electronic industry, the trend of future electronics will be flexible, bendable, wearable electronics. Until now, there is few study on bonding technology and reliability of bonding joint between chip with micro solder bump and flexible substrate. In this study, we investigated joint properties of Si chip with eutectic Sn-58Bi solder bump on Cu pillar bump bonded on flexible substrate finished with ENIG by flip chip process. After flip chip bonding, we observed microstructure of bump joint by SEM and then evaluated properties of bump joint by die shear test, thermal shock test, and bending test. After thermal shock test, we observed that crack initiated between $Cu_6Sn_5IMC$ and Sn-Bi solder and then propagated within Sn-Bi solder and/or interface between IMC and solder. On the other hands, We observed that fracture propated at interface between Ni3Sn4 IMC and solder and/or in solder matrix after bending test.

Influences of boron and silicon in insert alloys on microstructure and isothermal solidification during TLP bonding of a duplex stainless steel using MBF-35 and MBF-30

  • Yuan, Xinjian;Kim, Myung-Bok;Kang, Chung-Yun
    • Proceedings of the KWS Conference
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    • 2009.11a
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    • pp.59-59
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    • 2009
  • The influences of B and Si in the filler metals on microstructure and isothermal solidification during transient liquid-phase (TLP) bonding of a nitrogen-containing duplex stainless steel with MBF-30 (Ni-4.5wt.%Si-3.2wt.%B) and MBF-35 (Ni-7.3wt.%Si-2.2wt.%B), were studied at the temperature range of $1030-1090^{\circ}C$ with various times from 60 s to 3600 s under a vacuum of approximately $10^{-5}$ Torr. In case of the former, BN, $Ni_3B$ and $Ni_3Si$ precipitates were formed in the bonding region. BN and $Ni_3Si$ secondary phases were present in the joint for the latter case. The formation of $Ni_3B$ within the joint centerline is dependent on B content. The morphology of $Ni_3Si$ is dominated by Si concentration. A difference between the times for complete isothermal solidification obtained by the experiments and the conventional TLP bonding diffusion model was observed when using MBF-35. According to the simulated results, the isothermal solidification completion time for MBF-35 case was smaller than that in MBF-30. However, this experimental value obtained using MBF-35 was notably larger than that obtained using MBF-30. Isothermal solidification of liquid MBF-30 is controlled by the first isothermal solidification regime dependent on B diffusion model, whereas that of liquid MBF-35 experiences two isothermal solidification regimes and is mainly controlled by the second isothermal solidification dependent on Si diffusion model. In addition, only if Si content exceeds a critical value, the slower 2nd solidification regime will commence.

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Microstructure and Mechanical Properties of Sn-3.5wt.%Ag Solder with Bi Addition (Bi를 첨가한 Su-3.5wt.%Ag 땜납의 미세조직 및 기계적 성질)

  • Lee, Kyung-Ku;Baek, Dae-Hwa;Seo, Youn-Jong;Lee, Doh-Jae
    • Journal of Korea Foundry Society
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    • v.21 no.4
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    • pp.239-245
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    • 2001
  • Microstructure and mechanical properties of Sn-3.1 wt.%Ag-6.9 wt.%Bi system solders on Cu-substrate were studied. The Sn3.1 wt.%Ag-6.9 wt.%Bi alloy was designed by phase diagram and chemical properties and was prepared by melting in argon atmosphere. The mechanical properties of solder/Cu joints were examined by shear strength test, and also creep test. The microstructure of Sn-3.1 wt.%Ag-6.9 wt.%Bi alloy consists of Bi-rich phase and $Ag_3Sn$ precipitate in {\beta}-Sn$ matrix phase. The shear strength of the joint was decreased with aging treatment. Crack path under shear test was through the solder. Similar crack path change mode was observed at the creep test of solder/Cu joint. The creep behavior of Sn-3.1 wt.%Ag-6.9 wt.%Bi alloy represented the inverse primary creep behavior at all test condition. It is suggested that the inverse primary creep behavior is induced from Bi solute atoms in Sn-matrix. The creep resistance of Sn-3.1Ag-6.9Bi alloy is better than that of Sn-3.5 wt.%Ag alloy at all test conditions.

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Evaluation of Fatigue Behavior for Laser Welded High Strength Steel Sheets (SPFC590) (고장력 강판(SPFC590)의 레이저 용접부 피로거동 평가)

  • Heo, Cheol;Kwon, Jong-Wan;Cho, Hyun-Deog;Choi, Sung-Jong;Chung, Woo-Young
    • Transactions of the Korean Society of Automotive Engineers
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    • v.20 no.5
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    • pp.53-64
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    • 2012
  • Deep and narrow welds can be produced by laser welding at high welding speeds with a narrow heat-affected zone (HAZ) and little distortion of the workpiece. This study aims to evaluate the usefulness of laser welding at automobile component manufacture. Microstructure observation, hardness test, tensile test and fatigue life test are performed by using the fiber laser welded SPFC590 steel sheets which is used widely in the manufacture of automotive seat frame. Three kinds of specimens are only a SPFC590 steel plate, quasi-butt joint plate and lap joint plate by laser welding. The following results that will be helpful to understand the static strength, fatigue crack initiation and growth mechanism were obtained. (1) The tensile strength of quasi butt joint specimens nearly equal to base metal specimens, but lap joint specimens fractured in shear area of weld metal. (2) The fatigue strength of quasi-butt joint specimen was approximately 8 percent lower than that of the base metal specimens. Furthermore, the lap joint specimens were less than 86 percent of the base metal specimens. (3) The lap joint fatigue specimens fractured at shear area in high level stress amplitude, while fractured at normal area in low level stress amplitude. From these results, the applicability of the laser welding to the automobile component is discussed.

Effect of the Heat Treatment Temperature on the Brazed Microstructure of Dissimilar Ti and Cu Metals Using a Zr-Base Amorphous Filler (Zr계 비정질 삽입재를 이용한 Ti-Cu 이종 접합부의 미세조직 형성에 미치는 확산 열처리 온도의 영향)

  • Lee, Jung Gu;Lee, Jong Keuk;Lee, Min Ku;Rhee, Chang Kyu
    • Journal of the Korean Society for Heat Treatment
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    • v.20 no.1
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    • pp.17-21
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    • 2007
  • In this study, brazing characteristics of the dissimilar Ti and Cu metals using a Zr-base amorphous filler ($Zr_{41.2}Ti_{13.8}Cu_{12.5}Ni_{10.0}Be_{22.5}$ in at.%) have been investigated for various bonding temperatures. In the sample brazed at $790^{\circ}C$ for 10 min., the Ti-rich phases in the joint were observed, while the Cu-rich phases were obtained in the sample brazed at $825^{\circ}C$ for 10 min.. Such a different microstructure and composition in the joints could be explained by the degree of the dissolution reaction. At $790^{\circ}C$, the reaction between the Zr-rich liquid phase and the Ti base metal was actively occurred to form Ti-rich liquid phase in the joint. As the temperature increased to $825^{\circ}C$, however, the reaction between the Ti-rich liquid phase and the Cu base metal was promoted to form the Cu-rich liquid phase in the joint finally. Such a different interface reaction is attributed to the reactivity or solubility between the Zr as a main element in the filler and the Ti and Cu as a base metal element.

Solder Alloy Types and Solder Joint Reliability Evaluation Techniques (솔더 합금 종류 및 솔더 조인트의 신뢰성 평가 기법)

  • You-Gwon Kim;Heon-Su Kim;Tae-Wan Kim;Hak-Sung Kim
    • Journal of the Microelectronics and Packaging Society
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    • v.30 no.1
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    • pp.17-29
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    • 2023
  • In this paper, a method for evaluating the reliability of solder joints is introduced, as they play a crucial role in packaging technology due to the miniaturization and high-performance requirements of electronic device. Firstly, properties of solder based on various alloy compositions and solder types are described, followed by an analysis of solder joint structures in different packages. Next, the influence of solder alloy composition and microstructure on the thermal and mechanical properties of solder is analyzed, and solder creep behavior is briefly introduced. Subsequently, analytical techniques considering creep models and fatigue models for reliability evaluation are presented, and various ways to improve the reliability of solder joints are discussed. This study is expected to provide valuable information for evaluating and enhancing the reliability of solder joints in the semiconductor packaging technology field.

A Study on the Comparison of Brazed Joint of Zircaloy-4 with PVD-Be and Zr-Be Amorphous alloys as Filler Metals (PVD-Be와 비정질 Zr-Be 합금을 용가재로 사용한 Zircaloy-4의 브레이징 접합부의 비교 연구)

  • Hwang, Yong-Hwa;Kim, Jae-Yong;Lee, Hyung-Kwon;Koh, Jin-Hyun;Oh, Se-Yong
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.7 no.2
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    • pp.113-119
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    • 2006
  • Brazing is an important manufacturing process in the fabrication of Heavy Water Reactor fuel rods, in which bearing and spacer pads are joined to Zircaloy-4 cladding tubes. The physical vapor deposition(PVD) technique is currently used to deposit metallic Be on the surfaces of pads as a filler metal. Amorphous Zr-Be binary alloys which are manufactured by rapid solidification process are under developing to substitute the conventional PVD-Be coating. In the present study, brazed joint with PVD and amorphous alloys of $Zr_{1-x}Be_{x}(0.3{\le}x{\le}0.5)$ as filler metals are compared by mechanism, microstructure and hardness. The thickness of brazed joint with amorphous alloys became much smaller than that of PVD-Be. The erosion of base metal did not occur in the brazed joint with amorphous alloys. The brazing mechanism for PVD-Be seems to be Be diffusion into Zr-4 with capillary action resulting from eutectic reaction while that for amorphous alloys are associated with the liquid phase formation in the brazed joint. The brazed joint microstructure with PVD-Be consists of dendrite while that with amorphous alloys is globular. The $Zr_{0.7}Be_{0.3}$ alloy shows the smooth interface with little erosion in the base metal and is recommended a most suitable brazing filler metal for Zircaloy-4.

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EFFECT OF FLASHING AND UPSETTING PARAMETERS ON THE FLASH BUTT WELDING OF HIGH STRENGTH STEEL

  • Kim, Young-Sub;Kang, Moon-Jin
    • Proceedings of the KWS Conference
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    • 2002.10a
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    • pp.384-389
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    • 2002
  • This study was aimed to evaluate the weldability and optimize the welding conditions for flash butt welding of 780MPa grade steel applied to the automotive bumper reinforcement. And then the relationship between the welding conditions and the joint performance relating specifically to coil-joining steel would be established. The effect of welding conditions between flashing and upsetting process was elucidated. Microstructure observation of the joint indicated that the decarburized band was mainly changed with upsetting process. Width of HAZ was also related to the upsetting conditions rather than the flashing conditions. Generally maximum hardness at HAZ was correlated with $C_{eq}$ of steel and the empirical relationship was obtained to estimate the HAZ properties. Tensile elongation at the joint was usually decreased with increasing the initial clamping distance. Investigation of fracture surface after tensile and bending tests reveal that the origin of cracking at the joint was oxide inclusions composed of $SiO_2$, MnO, $Al_2$ $O_3$, and/or FeO. The amount of inclusions was dependent on the composition ratio of Mn/Si in steel. If this ratio was above 4, the amount of inclusions was low and then the resistance to cracking at the joint was enough to maintain the joint performance. It was obtained that the flashing process influenced the conditions for the energy input to establish uniform or non-uniform molten layer, while the upsetting conditions influenced the joint strength. Heat input variable during flashing process was also discussed with the joint properties.

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Mechanical Properties and Microstructures of High Heat Input Welded Tandem EGW Joint in EH36-TM Steel (대입열 EH36-TM강의 Tandem EGW 용접부 미세조직 및 기계적 성질)

  • Jeong, Hong-Chul;Park, Young-Hwan;An, Young-Ho;Lee, Jong-Bong
    • Journal of Welding and Joining
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    • v.25 no.1
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    • pp.57-62
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    • 2007
  • In the coarse grained HAZ of conventional TiN steel, most TiN particles are dissolved and austenite grain growth easily occurrs during high heat input welding. To avoid this difficulty, thermal stability of TiN particles is improved by increasing nitrogen content in EH36-TM steel. Increased thermal stability of TiN particle is helpful for preventing austenite grain growth by the pinning effect. In this study, the mechanical properties and microstructures of high heat input welded Tandem EGW joint in EH36-TM steel with high nitrogen content were investigated. The austenite grain size in simulated HAZ of the steel at $1400^{\circ}C$ was much smaller than that of conventional TiN steel. Even for high heat input welding, the microstructure of coarse grained HAZ consisted of fine ferrite and pearlite and the mechanical properties of the joint were sufficient to meet all the requirements specified in classification rule.

EVALUATION OF FRICTION WELDABILITY OF TYPE 5052 ALALLOY/LOW CARBON STEEL JOINT.

  • Kim, Kyung-Kyun;Lee, Won-Bae;Yeon, Yun-Mo;Kim, Dae-Up;Jung, Seung-Boo
    • Proceedings of the KWS Conference
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    • 2002.10a
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    • pp.528-533
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    • 2002
  • The mechanical and metallurgical properties of friction welded joints type 5052 Al alloy/A36 steel have been studied in this paper. The joint strength increased with increasing upset pressure and friction time till it reached the critical value. The joint strength was fixed at low strength compare to that of base metal in the case of increasing friction time. Microstructure of 5052 Al alloy was greatly deformed near the weld interface. The very fine and equaxied grain structure was observed at the near interface. The elongated grain was formed outside dynamic recrystallizatoin region at the peripheral part, while the A36 steel' side was not deformed. The hardness of the near interface was slightly softer than that of 5052 Al alloy base metal. The maximum softening width was about 8mm from the interface. In the present work, the friction welding condition, t$_1$=0.5sec, P$_2$=137.5MPa, showed a maximum joint strength (202MPa) when friction pressure, upset time and rotation speed were fixed at 75MPa, 5sec, 2000rev/min and these were the optimum friction welding condition of 5052Al/A36 steel joints.

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