• Journal of Welding and Joining
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• 제31권3호
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• pp.4-10
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• 2013

In electronic industry, the trend of future electronics will be flexible, bendable, wearable electronics. Until now, there is few study on bonding technology and reliability of bonding joint between chip with micro solder bump and flexible substrate. In this study, we investigated joint properties of Si chip with eutectic Sn-58Bi solder bump on Cu pillar bump bonded on flexible substrate finished with ENIG by flip chip process. After flip chip bonding, we observed microstructure of bump joint by SEM and then evaluated properties of bump joint by die shear test, thermal shock test, and bending test. After thermal shock test, we observed that crack initiated between $Cu_6Sn_5IMC$ and Sn-Bi solder and then propagated within Sn-Bi solder and/or interface between IMC and solder. On the other hands, We observed that fracture propated at interface between Ni3Sn4 IMC and solder and/or in solder matrix after bending test.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2009년 추계학술발표대회
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• pp.59-59
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• 2009

The influences of B and Si in the filler metals on microstructure and isothermal solidification during transient liquid-phase (TLP) bonding of a nitrogen-containing duplex stainless steel with MBF-30 (Ni-4.5wt.%Si-3.2wt.%B) and MBF-35 (Ni-7.3wt.%Si-2.2wt.%B), were studied at the temperature range of $1030-1090^{\circ}C$ with various times from 60 s to 3600 s under a vacuum of approximately $10^{-5}$ Torr. In case of the former, BN, $Ni_3B$ and $Ni_3Si$ precipitates were formed in the bonding region. BN and $Ni_3Si$ secondary phases were present in the joint for the latter case. The formation of $Ni_3B$ within the joint centerline is dependent on B content. The morphology of $Ni_3Si$ is dominated by Si concentration. A difference between the times for complete isothermal solidification obtained by the experiments and the conventional TLP bonding diffusion model was observed when using MBF-35. According to the simulated results, the isothermal solidification completion time for MBF-35 case was smaller than that in MBF-30. However, this experimental value obtained using MBF-35 was notably larger than that obtained using MBF-30. Isothermal solidification of liquid MBF-30 is controlled by the first isothermal solidification regime dependent on B diffusion model, whereas that of liquid MBF-35 experiences two isothermal solidification regimes and is mainly controlled by the second isothermal solidification dependent on Si diffusion model. In addition, only if Si content exceeds a critical value, the slower 2nd solidification regime will commence.

• 한국주조공학회지
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• 제21권4호
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• pp.239-245
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• 2001

Microstructure and mechanical properties of Sn-3.1 wt.%Ag-6.9 wt.%Bi system solders on Cu-substrate were studied. The Sn3.1 wt.%Ag-6.9 wt.%Bi alloy was designed by phase diagram and chemical properties and was prepared by melting in argon atmosphere. The mechanical properties of solder/Cu joints were examined by shear strength test, and also creep test. The microstructure of Sn-3.1 wt.%Ag-6.9 wt.%Bi alloy consists of Bi-rich phase and $Ag_3Sn$ precipitate in {\beta}-Sn$ matrix phase. The shear strength of the joint was decreased with aging treatment. Crack path under shear test was through the solder. Similar crack path change mode was observed at the creep test of solder/Cu joint. The creep behavior of Sn-3.1 wt.%Ag-6.9 wt.%Bi alloy represented the inverse primary creep behavior at all test condition. It is suggested that the inverse primary creep behavior is induced from Bi solute atoms in Sn-matrix. The creep resistance of Sn-3.1Ag-6.9Bi alloy is better than that of Sn-3.5 wt.%Ag alloy at all test conditions.

• 한국자동차공학회논문집
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• 제20권5호
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• pp.53-64
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• 2012

Deep and narrow welds can be produced by laser welding at high welding speeds with a narrow heat-affected zone (HAZ) and little distortion of the workpiece. This study aims to evaluate the usefulness of laser welding at automobile component manufacture. Microstructure observation, hardness test, tensile test and fatigue life test are performed by using the fiber laser welded SPFC590 steel sheets which is used widely in the manufacture of automotive seat frame. Three kinds of specimens are only a SPFC590 steel plate, quasi-butt joint plate and lap joint plate by laser welding. The following results that will be helpful to understand the static strength, fatigue crack initiation and growth mechanism were obtained. (1) The tensile strength of quasi butt joint specimens nearly equal to base metal specimens, but lap joint specimens fractured in shear area of weld metal. (2) The fatigue strength of quasi-butt joint specimen was approximately 8 percent lower than that of the base metal specimens. Furthermore, the lap joint specimens were less than 86 percent of the base metal specimens. (3) The lap joint fatigue specimens fractured at shear area in high level stress amplitude, while fractured at normal area in low level stress amplitude. From these results, the applicability of the laser welding to the automobile component is discussed.

• 열처리공학회지
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• 제20권1호
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• pp.17-21
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• 2007

In this study, brazing characteristics of the dissimilar Ti and Cu metals using a Zr-base amorphous filler ($Zr_{41.2}Ti_{13.8}Cu_{12.5}Ni_{10.0}Be_{22.5}$ in at.%) have been investigated for various bonding temperatures. In the sample brazed at $790^{\circ}C$ for 10 min., the Ti-rich phases in the joint were observed, while the Cu-rich phases were obtained in the sample brazed at $825^{\circ}C$ for 10 min.. Such a different microstructure and composition in the joints could be explained by the degree of the dissolution reaction. At $790^{\circ}C$, the reaction between the Zr-rich liquid phase and the Ti base metal was actively occurred to form Ti-rich liquid phase in the joint. As the temperature increased to $825^{\circ}C$, however, the reaction between the Ti-rich liquid phase and the Cu base metal was promoted to form the Cu-rich liquid phase in the joint finally. Such a different interface reaction is attributed to the reactivity or solubility between the Zr as a main element in the filler and the Ti and Cu as a base metal element.

• 마이크로전자및패키징학회지
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• 제30권1호
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• pp.17-29
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• 2023

본 논문에서는 전자제품의 소형화와 고성능화에 따라 패키징 기술에서 핵심적인 역할을 하는 솔더 조인트의 신뢰성 평가 방법을 소개한다. 우선, 다양한 합금 조성과 제품 형태에 따른 솔더의 특성을 설명하고, 여러 패키지에서의 솔더 조인트 구조에 대한 개요를 제시한다. 그 다음 솔더 합금의 조성과 미시구조가 솔더의 열적 및 기계적 특성에 미치는 영향을 분석하며, 솔더 크리프 거동에 대해 간략히 소개한다. 이어서, 신뢰성 평가를 위한 크리프 모델과 피로 모델 등을 고려한 분석 기법들을 소개하고, 솔더 조인트의 신뢰성을 향상시킬 수 있는 방안에 대해 논의한다. 본 연구는 반도체 패키징 기술 분야에서 솔더 조인트의 신뢰성 평가와 개선에 유익한 정보를 제공할 것으로 기대된다.

• 한국산학기술학회논문지
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• 제7권2호
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• pp.113-119
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• 2006

중수로형 핵연료 제조공정 중 연료봉 피복관에 간격체와 지지체 등의 부착물이 브레이징으로 접합된다. 본 연구에서는 베릴륨을 물리 증착법(PVD)으로 접합될 부착물의 표면에 증착한 것과 비정질 용가재[$Zr_{1-x}Be_{x}(0.3{\le}x{\le}0.5)$]를 사용하여 브레이징된 접합부의 미세조직과 경도 등의 특성을 비교하고 브레이징 온도가 접합부에 미치는 영향 조사하였다. 비정질 용가재에 의한 접합층의 두께는 PVD-Be의 경우와 비교하여 더 얇았고, Be 함량이 감소할수록 접합층의 두께는 감소하였으며 모재의 침식은 거의 없었다. PVD-Be의 경우 공정 반응, 액상 출현, 모세관 현상과 확산으로 브레이징 되나 비정질 합금은 용가재 만이 용융되어 액상 접합되는 것으로 사료된다. PVD-Be 접합부의 미세조직은 계면에서 수지상이 형성되어 내부로 성장하나, 비정질 합금에 의한 접합부는 석출된 제2상들이 구상으로 구성되며 브레이징 온도가 증가할수록 구상은 더욱 커졌다. 비정질 합금 접합부의 경도는 Be 함량이 감소할수록 경도는 증가하였다. 본 연구에 사용된 비정질 합금 중 $Zr_{0.7}Be_{0.3}$ 합금은 접합부에서 Be의 모재로의 확산이 적어 부드러운 계면과 모재의 침식이 없었고 높은 경도 때문에 핵연료 피복재 접합에 가장 적합한 용가재로 사료된다.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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• pp.384-389
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• 2002

This study was aimed to evaluate the weldability and optimize the welding conditions for flash butt welding of 780MPa grade steel applied to the automotive bumper reinforcement. And then the relationship between the welding conditions and the joint performance relating specifically to coil-joining steel would be established. The effect of welding conditions between flashing and upsetting process was elucidated. Microstructure observation of the joint indicated that the decarburized band was mainly changed with upsetting process. Width of HAZ was also related to the upsetting conditions rather than the flashing conditions. Generally maximum hardness at HAZ was correlated with $C_{eq}$ of steel and the empirical relationship was obtained to estimate the HAZ properties. Tensile elongation at the joint was usually decreased with increasing the initial clamping distance. Investigation of fracture surface after tensile and bending tests reveal that the origin of cracking at the joint was oxide inclusions composed of $SiO_2$, MnO, $Al_2$ $O_3$, and/or FeO. The amount of inclusions was dependent on the composition ratio of Mn/Si in steel. If this ratio was above 4, the amount of inclusions was low and then the resistance to cracking at the joint was enough to maintain the joint performance. It was obtained that the flashing process influenced the conditions for the energy input to establish uniform or non-uniform molten layer, while the upsetting conditions influenced the joint strength. Heat input variable during flashing process was also discussed with the joint properties.

• Journal of Welding and Joining
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• 제25권1호
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• pp.57-62
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• 2007

In the coarse grained HAZ of conventional TiN steel, most TiN particles are dissolved and austenite grain growth easily occurrs during high heat input welding. To avoid this difficulty, thermal stability of TiN particles is improved by increasing nitrogen content in EH36-TM steel. Increased thermal stability of TiN particle is helpful for preventing austenite grain growth by the pinning effect. In this study, the mechanical properties and microstructures of high heat input welded Tandem EGW joint in EH36-TM steel with high nitrogen content were investigated. The austenite grain size in simulated HAZ of the steel at $1400^{\circ}C$ was much smaller than that of conventional TiN steel. Even for high heat input welding, the microstructure of coarse grained HAZ consisted of fine ferrite and pearlite and the mechanical properties of the joint were sufficient to meet all the requirements specified in classification rule.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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• pp.528-533
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• 2002

The mechanical and metallurgical properties of friction welded joints type 5052 Al alloy/A36 steel have been studied in this paper. The joint strength increased with increasing upset pressure and friction time till it reached the critical value. The joint strength was fixed at low strength compare to that of base metal in the case of increasing friction time. Microstructure of 5052 Al alloy was greatly deformed near the weld interface. The very fine and equaxied grain structure was observed at the near interface. The elongated grain was formed outside dynamic recrystallizatoin region at the peripheral part, while the A36 steel' side was not deformed. The hardness of the near interface was slightly softer than that of 5052 Al alloy base metal. The maximum softening width was about 8mm from the interface. In the present work, the friction welding condition, t$_1$=0.5sec, P$_2$=137.5MPa, showed a maximum joint strength (202MPa) when friction pressure, upset time and rotation speed were fixed at 75MPa, 5sec, 2000rev/min and these were the optimum friction welding condition of 5052Al/A36 steel joints.