• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.1
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• pp.85-90
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• 2010

Friction welding is a common practice to join axially symmetrical parts for automobile industry applications. The shaft for automobile reverse idle gear is generally produced by forging steel, SF 45. This method is not so good because of high cost of material and production. In this study, in order to investigate the possibility of application of SM 45C to SF 45 dissimilar friction welding, the dissimilar friction welded joints were performed using 20 mm diameter solid bar in forging steel(SF 45) to carbon steel(SM 45C). The optimal friction welding parameters were selected to ensure reliable quality welds on the basis of visual examination, tensile test, micro-Virkers hardness surveys of the bond of area and optical microstructure investigations for welded joint parts. Finally, post weld heat treatment(PWHT) of the high-frequency induction hardening was performed for the friction welded specimens under the optimal welding conditions. And then, the mechanical properties were compared for as-welded and PWHT in SM 45C to SF 45.

• Journal of the Korean Association of Oral and Maxillofacial Surgeons
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• v.27 no.6
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• pp.491-497
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• 2001

Polymethylmethacrylate(PMMA) is currently commonly used material for the reconstruction of bone defects and fixation of joint prosthetics following congenital and acquired causes. Although PMMA has widespread use, it does not possess the ideal mechanical characteristics with osteoconductivity and osteoinductivity required. In order to overcome these problem, addition of bovine bone drived defatting demineralized bone(BDB) powders to a PMMA bone cement was done for improvement of physical property and bone forming characteristics of composite. In order to investigate the influence of BDB reinforcement on the PMMA, we measured physical property of compressive, tensile, flexural strength, and scanning electron microscopic examinations. The results were obtained as follows: 1. The PMMA forms a solid cellular matrix with open cells about $100{\mu}m$ in variable size and incorporating BDB. BDB aggregates inside the cells form a porous network that is accessible from the outer surface. 2. The physical properties were compressive strength of mean $22.74{\pm}1.69MPa$, tensile strength of mean $22.74{\pm}1.69MPa$, flexural strength of mean $77.53{\pm}6.93MPa$. Scanning electron microscopic examinations were revealed that there was DBD particles form a highly porous agglomerates. BDB can be added PMMA in the form of dried powders, the composites are applicable as bone substitutes. BDB and PMMA mixture is shown to produce a class of composites that due to their microstructure and improved mechanical properties may be suitable for application as bone subsitutes. The mechanical and material properties of the BDB-PMMA bone substitute composites are competitive with those properties of a porous ceramic matrix of other hydroxyapatite and with those of natural bones.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.1
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• pp.77-85
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• 2004

To evaluate the effect of plasma cleaning on the soldering reliability the plasma cleaning using Ar-10vol%$H_2$ gas was applied on a UBM(Under Bump Metallization). The UBM consisted of Au/ Cu/ Ni/ Al layers which were deposited on a Si-wafer with 20 nm/ 4 $\mu\textrm{m}$/ 4 $\mu\textrm{m}$/ 0.4 $\mu\textrm{m}$ thickness respectively. Sn-3.5%Ag, Sn-3.5%Ag-0.7%Cu and Sn-37%Pb solder balls sized of 500 $\mu\textrm{m}$ in diameter were used. Solder balls on the UBM were plasma reflowed under Ar-10%$H_2$ plasma (with or without plasma cleaning). They were compared with air reflowed solder balls with flux. The spreading ratios of plasma reflowed solder with plasma cleaning was 20-40% higher than that of plasma reflowed solder without plasma cleaning. The shear strength of plasma reflowed solder with plasma cleaning was about 58-65MPa. It showed 60-80% higher than that of plasma reflowed solder without plasma cleaning and 15-35% higher than that of air reflowed solder. Thus it was believed that plasma cleaning for the UBM using Ar-10vol%$H_2$ gas was considerably effective for the improvement of the strength of solder ball.

• Proceedings of the KWS Conference
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• 2010.05a
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• pp.24-24
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• 2010

마찰교반접합법은 특정한 회전수로 회전하는 용접 툴을 이용하여 접합하고자 하는 피접합재의 맞댄면에 삽입시킨 후 툴을 이동시키거나 혹은 시편을 견고하게 고정시킨 장치(backing plate)가 움직여 고상 상태에서 접합이 이루어진다. 알루미늄, 마그네슘 등 비교적 융점이 낮은 저융점 재료의 재료에 처음 적용이 되어 많은 연구가 활발히 진행되었고 타 용접방법에 비해 우수한 접합특성을 나타내었다. 최근 이러한 마찰교반접합은 이러한 저융점 재료를 넘어서 스틸, 타이타늄, 니켈 등과 같은 고융점 재료 등에 대한 적용이 늘어나고 있다. 마찰교반접합을 이용하여 이러한 고융점 재료의 접합 경우 내마모성 및 내열성 등의 내구성이 갖추어진 툴과 이러한 툴을 냉각시킬 수 있는 냉각 장치 등이 필요로 하나 경제적 측면이나 접합부의 우수한 특성 등을 고려 할 때 그 적용 및 발전 가능성이 매우 높다고 볼 수 있다. 2상 스테인레스 강은 금속 조직적으로 페라이트와 오스테나이트 상이 거의 1:1의 동등한 비율로 매우 미세하게 결합된 구조를 가지고 있다. 또한 이상 스테인레스 강은 각상의 개개의 특성에 기인하여 염소 분위기에서 응력부식 저항성이 우수하고, 공식과 틈부식에 대한 저항성이 매우 뛰어나다. 그리고 이상 스테인레스 강은 비교적 고가인 Ni이 일반 오스테나이트 스테인리스 강의 약 1/2의 수준으로 적게 포함이 되어 경제적인 이점을 지니고 있으며 또한 용접성이 좋아 산업계의 수요는 현재 점차 증가하고 있는 상황이다. 하지만 이러한 이상 스테인리스 강은 용접 후 페라이트 상의 조대화, 그리고 페라이트 상의 분율이 오스테나이트 상의 분율보다 높아지게 되어 용접부에서의 저온 인성 감소 및 내식성 저하 등의 문제가 발생하게 된다. 그리하여 용접 시 이러한 문제점을 해결하기 위해서는 입열량의 조절이 가장 필요로 하는 것으로 알려져 있다. 본 연구에서는 마찰교반용접을 이용하여 두께 3mm의 대표적인 이상 스테인리스 강인 SAF2205 스테인리스 강에 대해 맞대기 마찰교반접합을 실시하였다. 툴 회전속도를 변수로 하여 접합을 실시하였으며 접합 시 툴은 $Si_3N_4$ 툴을 사용하였다. 접합 후 외관상태 점검, 미세조직 관찰, 경도 및 인장강도 측정 등의 실험을 실시하였고, 이러한 결과를 이용하여 미세조직과 기계적 특성과의 관련성을 조사하였다.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.72-72
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• 2009

전자부품의 내부접속 및 파워반도체의 다이본딩과 같은 1차실장에는 고온환경에서의 사용과 2차실장에서의 재용융방지를 위해 높은 액상선온도 및 고상선온도를 필요로 하여, Pb-5wt%Sn, Pb-2.5wt%Ag로 대표되는 납성분 85%이상의 고온솔더가 널리 사용되고 있다. 생태계와 인체에 대한 납의 유해성이 보고된 이래, 무연솔더에 대한 연구가 활발히 진행되어 왔으나, Sn-Ag-Cu계로 대표되는 Sn계 합금으로 대체 중인 중온용 솔더와는 달리, 고온용 솔더에 대해서는 대체합금에 대한 연구가 미흡한 실정이다. 대체재의 부재로 인해 기존의 납을 다량함유한 솔더로 1차실장이 지속됨으로서, 2차실장의 무연화에도 불구하고 전자부품 및 기기의 재활용에 큰 어려움을 겪고 있다. 지금까지 고온용 무연솔더로서는 융점에 근거해 Au-(Sn, Ge, Si)계, Bi-Ag계, Zn-(Al, Sn)계의 극히 제한된 합금계만이 보고되어 왔다. Au계 솔더는 현재 플럭스를 사용하지 않는 광학, 디스플레이 분야 등 고부가가치 공정에 사용되고 있으나, 합금가격이 매우 비싸며 가공성이 나빠 대체재료로서는 적합하지 않다. Bi-Ag계 솔더 또한 취성합금으로 와이어 및 박판으로 가공하는데 어려움이 크며, 솔더로서 중요한 특성중 하나인 전기전도도 및 열전도도가 나쁜 편이다. 이에 비해, Zn계 합금은 비교적 낮은 합금가격, 적절한 가공성과 뛰어난 인장강도, 우수한 전기전도도 및 열전도도를 지녀, 고온용솔더 대체재료의 유력한 후보로 생각된다.이전 연구에서, 필자의 연구그룹은 Zn-Sn계 합금을 고온용 무연솔더로서 제안한 바 있다. Zn-Sn계 합금은 충분히 높은 융점과 함께, 금속간화합물이 없는 미세조직, 우수한 기계적 특성, 높은 전기전도도 및 열전도도 등의 장점을 나타내었다. 본 연구에서는 기초합금특성상 고온솔더로서 다양한 장점을 지닌 Zn-30wt%Sn합금을 고온용 솔더의 대표적인 적용의 하나인 다이본딩에 적용하여, 접합부의 강도 및 미세조직, 열피로 신뢰성에 대해 분석을 함으로서 실제 공정에의 적용가능성에 대해 검토하였다. Zn-30wt%Sn을 이용해 Au/TiN(Titanium nitride) 코팅한 Si다이를 AlN-DBC(aluminum nitride-direct bonded copper)기판에 접합한 결과, 양측에 완전히 젖은 기공이 없는 양호한 다이접합부를 얻었으며, 솔더내부에는 금속간화합물을 형성하지 않았다. Si다이와의 계면에는 TiN만이 존재하였으며, Cu와의 계면에는 Cu로부터 $Cu_5Zn_8,\;CuZn_5$의 반응층을 형성하였다. 온도사이클시험을 통한 열피로특성평가에서, Zn-30wt%Sn를 이용한 다이접합부는 1500사이클 지점에서 Cu와 Cu-Zn금속간화합물의 사이에서 피로균열이 형성되며, 접합강도가 크게 감소하였다. 열피로특성 향상을 위해 Cu표면에 TiN코팅을 하여 Zn-30wt%Sn 솔더로 다이접합한 결과, Si다이와 기판 양측에 TiN만으로 구성된 계면을 형성하였으며, TEM관찰을 통해 Zn-30wt%Sn과 극히 미세한 접합계면이 형성하고 있음을 확인하였다. Zn-wt%30Sn솔더와 TiN층의 병용으로 2000사이클까지 미세조직의 변화 및 강도저하가 없는 극히 안정된 고신뢰성의 다이접합부를 얻을 수가 있었다.

• Korean Journal of Materials Research
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• v.9 no.10
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• pp.1018-1024
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• 1999

The effects of operating temperature and stress on degradation of components in high temperature steam generator were investigated. Several 2.25CrlMo tubes which had operated over 20 years and an unused 9CrlMoVNb tube were tested. For the former samples, the amount of $\textrm{M}_{6}\textrm{C}$ carbide and its size are increased with the aging or operating time. The precipitation behavior of carbides ($\textrm{M}_{2}\textrm{O}$, $\textrm{M}_{6}\textrm{C}$) is changed with the operating temperature of the tubes. However, unused 9CrlMoVNb samples show a different carbide precipitation process due to high chromium, vanadium, and niobium contents. The amount of Cr-rich $\textrm{M}_{23}\textrm{C}_{6}$ carbide is significantly increased with aging time, but that of $\textrm{M}_{6}\textrm{C}$ type carbide is rarely changed with aging time at elevated temperatures.

• Plant Journal
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• v.10 no.2
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• pp.48-59
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• 2014

Coupons which have same figure as weld joint of the forged steel valves and 1 inch nominal weld thickness were manufactured using ASTM A182 F92 material. After welding with GTAW method, the welded specimens have been post-weld heat treated at $705^{\circ}C$, $735^{\circ}C$, $750^{\circ}C$, $765^{\circ}C$, $795^{\circ}C$ and $825^{\circ}C$ for 1 hour per 1 inch nominal weld thickness each (Group 1) to evaluate characteristics of welds based on various holding temperature. Indeed, 3 welded specimens were post-weld heat treated for 30 minutes, 1 hour and 2 hour (Group 2) at $735^{\circ}C$ to evaluate characteristics of welds based on various holding time. Hardness values were measured at the weld metal, heat affected zone and base metal to observe hardness change depending on the condition. As a result of the evaluation, appropriate holding temperature for PWHT is proved as $750^{\circ}C$ and $765^{\circ}C$ for 1hour per 1 inch nominal weld thickness. Indeed, holding for 1 hour per 1 inch nominal weld thickness was insufficient for PWHT effect when the holding temperature was at $735^{\circ}C$. The microstructure of post-weld heat treated weld metal was determined as tempered-martensite structure.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.4
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• pp.163-169
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• 2019

Sn-Pb solder alloys in electronics rapidly has been replaced to Pb free solder alloys because of various environmental regulations such as restriction of hazardous substances directive (RoHS), European Union waste electrical, waste electrical and electronic equipment (WEEE), registration evaluation authorization and of chemicals (REACH) etc. Because Sn58%Bi (in wt.%) solder alloy has low melting point and higher mechanical properties than that of Sn-Pb solder, it has been studied to manufacture electronic components. However, the reliability of Sn58%Bi solder could be lowered because of the brittleness of Bi element included in the solder alloy. Therefore, we observed the microstructures of Sn58%Bi composite solders with various contents of Sn-decorated multiwalled carbon nanotube (Sn-MWCNT) particles and evaluated bonding strength of the FR-4 components assembled with Sn58%Bi composite solder. Also, microstructures and bonding strengths of the Sn58%Bi composite solder joints were evaluated with the number of reflows from 1 to 7 times, respectively. Bonding strengths and fracture energies of the Sn58%Bi composite solder joints were measured by die shear test. Microstructures and fracture modes were observed with scanning electron microscope (SEM). Microstructures in the Sn58%Bi composite solder joints were finer than that of only Sn58%Bi solder joint. Bonding strength and fracture energy of Sn58%Bi composite solder including 0.1 wt.% of Sn-decorated MWCNT particles increased up to 20.4% and 15.4% at 5 times in reflow, respectively.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.640-644
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• 2000

The microstructure, wettability, shear strength and aging effect of Sn-3.5Ag/Cu and Alloy42 lead-frame solder joints were measured for comparison. In the case of Sn-3.5Ag/Cu, Ag$_3$Sn and Cu$\sub$6/Sn$\sub$5/ phases in the matrix Sn and 1∼2$\mu\textrm{m}$ thick Cu$\sub$6/Sn$\sub$5/ Phase at the interface of solder/lead-frame were formed. In the case of Sn-3.5AAg/A11oy42, only Ag$_3$Sn Phase of low density in the matrix Sn and 0.5∼1.5$\mu\textrm{m}$ thick FeSn$_2$phase at the interface of solder/lead-frame were formed. Comparing to Cu, Alloy42 shear strength of Alloy 42 solder joints was smaller than that of Cu and all declined after aging. After aging at 180$^{\circ}C$ for 1 week, η-Cu$\sub$6/Sn$\sub$5/ layer was formed on Cu lead-frame, while AgSn$_3$ phase in the matrix and thickened FeSn$_2$at the interface were formed on Alloy42 lead-frame.

• Archives of Metallurgy and Materials
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• v.65 no.4
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• pp.1317-1322
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• 2020

The present study investigated various thermodynamic parameters, microstructures and electrochemical behaviors of TiMoVCrZr and Ti-rich TiMoVCrZr high-entropy alloys (HEAs) prepared by vacuum arc remelting. The microstructures of the alloys were analyzed using X-ray diffraction (XRD) analysis, field emission scanning electron microscopy (FE-SEM), and potentiodynamic polarization tests. The determined thermodynamic values of the Ω-parameter and the atomic size difference (δ) for the HEAs were determined to be in the range of Ω ≥ 1.1, and δ ≤ 6.6% with valance electron configuration (VEC) ≤ 5.0, suggesting the HEAs were effective at forming solid solutions. XRD patterns of the equiatomic Ti₂₀Mo₂₀V₂₀Cr₂₀Zr₂₀ HEA revealed four phases consisting of the body centered cubic1 (BCC₁), BCC₂, hexagonal close-packed (HCP), and intermetallic compound Cr₂Zr phases. Three phases were observed in the XRD patterns of Ti-rich Ti₄₀Mo₁₅V₁₅Cr₁₅Zr₁₅ (BCC, HCP, and Cr₂Zr) and a single BCC phase was observed in Ti-rich Ti₆₀Mo₁₀V₁₀Cr₁₀Zr₁₀ HEAs. The backscattered-electron (BSE) images on the equiatomic Ti₂₀Mo₂₀V₂₀Cr₂₀Zr₂₀ HEA revealed BCC and HCP phases with Cr₂Zr precipitates, suggesting precipitation from the HCP solid solution during the cooling. The micro-segregation of Ti-rich Ti₆₀Mo₁₀V₁₀C₁₀Zr₁₀ HEAs appeared to decrease remarkably. The alloying elements in the HEAs were locally present and no phase changes occurred even after additional HIP treatment. The lowest current density obtained in the polarization potential test of Ti-rich Ti₄₀Mo₁₅V₁₅Cr₁₅Zr₁₅ HEA was 7.12×10^-4 mA/cm² was obtained. The studied TiMoVCrZr HEAs showed improved corrosion characteristics as compared to currently available joint replacement material such as ASTM F75 alloy.