• Korean Journal of Materials Research
• /
• v.20 no.12
• /
• pp.681-685
• /
• 2010

The application of flip chip technology has been growing with the trend of miniaturization of electronic packages, especially in mobile electronics. Currently, several types of adhesive are used for flip chip bonding and these adhesives require some special properties; they must be solvent-free and fast curing and must ensure joint reliability against thermal fatigue and humidity. In this study, imidazole and its derivatives were added as curing catalysts to epoxy resin and their effects on the adhesive properties were investigated. Non-isothermal DSC analyses showed that the curing temperatures and the heat of reaction were dependent primarily on the type of catalyst. Isothermal dielectric analyses showed that the curing time was dependent on the amount of catalysts added as well as their type. The die shear strength increased with the increase of catalyst content while the Tg decreased. From this study, imidazole catalysts with low molecular weight are expected to be beneficial for snap curing and high adhesion strength for flip chip bonding applications.

• Nuclear Engineering and Technology
• /
• v.56 no.1
• /
• pp.317-327
• /
• 2024

This study investigated the chloride-induced stress corrosion cracking (CISCC) behavior expected to occur in welds of austenitic stainless steel, which are considered candidate materials for dry storage containers for spent nuclear fuel. The behavior was studied by varying temperature, relative humidity (RH), and chloride concentration. 304L-ER308L welded plates were processed into U-bend specimens and exposed to a cyclic corrosion chamber for 12 weeks. The CISCC behavior was then analyzed using electron microscopy. A previous study by the authors confirmed that CISCC occurred in ER308L at 60 ℃, 30% RH, and 0.6 M NaCl via selective corrosion of δ-ferrite. When the temperature was lowered from 60 ℃ to 50 ℃, CISCC still occurred. However, when the humidity was reduced to 20% RH, CISCC did not happen. This can be attributed to the retardation of the deliquescence of NaCl at lower humidity, which was insufficient to promote CISCC. Furthermore, increased chloride concentration to 1.0 M resulted in the absence of CISCC and widespread surface corrosion with severe pitting corrosion because of the increase in thin film thickness.

• Journal of Welding and Joining
• /
• v.33 no.3
• /
• pp.19-24
• /
• 2015

Joint properties of electric control unit (ECU) module using Sn-Cu-(X)Al(Si) lead-free solder alloy were investigated for automotive electronics module. In this study, Sn-0.5Cu-0.01Al(Si) and Sn-0.5Cu-0.03Al(Si) (wt.%) lead-free alloys were fabricated as bar type by doped various weight percentages (0.01 and 0.03 wt.%) of Al(Si) alloy to Sn-0.5Cu. After fabrications of lead-free alloys, the ball-type solder alloys with a diameter of 450 um were made by rolling and punching. The melting temperatures of 0.01Al(Si) and 0.03Al(Si) were 230.2 and $230.8^{\circ}C$, respectively. To evaluation of properties of solder joint, test printed circuit board (PCB) finished with organic solderability perseveration (OSP) on Cu pad. The ball-type solders were attached to test PCB with flux and reflowed for formation of solder joint. The maximum temperature of reflow was $260^{\circ}C$ for 50s above melting temperature. And then, we measured spreadability and shear strength of two Al(Si) solder materials compared to Sn-0.7Cu solder material used in industry. And also, microstructures in solder and intermetallic compounds (IMCs) were observed. Moreover, thickness and grain size of $Cu_6Sn_5$ IMC were measured and then compared with Sn-0.7Cu. With increasing the amounts of Al(Si), the $Cu_6Sn_5$ thickness was decreased. These results show the addition of Al(Si) could suppress IMC growth and improve the reliability of solder joint.

• Journal of Welding and Joining
• /
• v.32 no.3
• /
• pp.68-73
• /
• 2014

Among through silicon via (TSV) technologies, for replacing Cu filling method, the method of molten solder filling has been proposed to reduce filling cost and filling time. However, because Sn alloy which has a high coefficient of thermal expansion (CTE) than Cu, CTE mismatch between Si and molten solder induced higher thermal stress than Cu filling method. This thermal stress can deteriorate reliability of TSV by forming defects like void, crack and so on. Therefore, we fabricated SiC composite filling material which had a low CTE for reducing thermal stress in TSV. To add SiC nano particles to molten solder, ball-typed SiC clusters, which were formed with Sn powders and SiC nano particles by ball mill process, put into molten Sn and then, nano particle-dispersed SiC composite filling material was produced. In the case of 1 wt.% of SiC particle, the CTE showed a lowest value which was a $14.8ppm/^{\circ}C$ and this value was lower than CTE of Cu. Up to 1 wt.% of SiC particle, Young's modulus increased as wt.% of SiC particle increased. And also, we observed cross-sectioned TSV which was filled with 1 wt.% of SiC particle and we confirmed a possibility of SiC composite material as a TSV filling material.

• Transactions of Materials Processing
• /
• v.29 no.1
• /
• pp.49-54
• /
• 2020

The influence of electric current on the joining properties of aluminum and copper was investigated. Various pulsed electric current conditions were set to the joining specimens followed by pressure. The shear strength of the joint area between aluminum and copper was measured by the lab shear test. In addition, the microstructures of the joint area were observed through a field emission scanning electron microscope, energy dispersive X-ray, and electron backscatter diffraction. The mechanical properties of each phase in the joint region were measured by nano-indentation. As a result, it was confirmed that electrically assisted solid state joining of copper and aluminum could be applied in various industrial fields.

• Journal of Welding and Joining
• /
• v.31 no.1
• /
• pp.21-25
• /
• 2013

Aluminum alloy, Al5083-O, is one of candidate materials for the LNG storage tank, because of its excellent weldability, cryogenic characteristics, and corrosion resistance. The good weldability of Al5083-O is very important in LNG storage tank manufacturing. In this study, high current metal inert gas(MIG) welding process was used to get one pass welding of thick plate aluminum alloy. Bead on plate(BOP) welding was performed to evaluate the effect of welding conditions on the height of bead and depth of penetration. The optimum welding conditions were derived to get one pass welding of the thickness of 14.5mm. The mechanical properties of the welded joint were evaluated. The cross-sectional macro test, tensile test, and bending test satisfied the class rule.

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 2004.10a
• /
• pp.192-195
• /
• 2004

Surface friction welding, SFW, is a newly developed solid state welding technology for joining of thin metal sheets. Workpieces are joined by frictional heat, shear deformation and plastic flow generated by friction between the rotating tool and surface of the workpiece. The SFW is an economical and environmentally conscious technology with high joining speed and excellent properties, and is expected to be used widely in various industries in the near future.

• Proceedings of the KWS Conference
• /
• 2007.11a
• /
• pp.155-157
• /
• 2007

The Friction spot dissimilar welding of galvanized steel/Al6061-T6 was performed to investigate the mechanical characteristics of the joints. The presence of thin film of aluminum oxide on the surface and melting of zinc in the coating, made substandard joint characteristics for dissimilar Friction spot joining(FSJ) performed with out removing the coating. Where as, for dissimilar FSJ of galvanized steel/Al6061-T6 after removing the coating, superior agitation and welding quality has been obtained for a configuration of galvanized steel as the upper plate and Al6061-T6 as lower plate. The results from tensile tests and microscopic examination for various combinations of the welding parameters have been presented.

• Journal of Welding and Joining
• /
• v.30 no.2
• /
• pp.43-46
• /
• 2012

• Journal of Welding and Joining
• /
• v.27 no.4
• /
• pp.49-53
• /
• 2009

For Al 6k21-T4 alloy, linear laser welding produced the lower shear-tensile strength than the base metal. This study improved the shear-tensile strength by using the weaving laser at the optimized welding condition, i.e., 2mm weaving width and 25Hz frequency. The large weaving width increased the weld width, therefore improving the joint strength. For the specimen of low strength, the porosity was distributed continuously along the intersection between the plates and fusion line. However, for the optimized welding condition, large oval-shaped porosities were located only in the advancing track of the concave part. Regardless of the welding condition, solidification cracking was initiated at the intersection and propagated through small porosities in the weld part. furthermore, the concave part had more significant porosity in the weld and HAZ, respectively than the convex part. The continuity of porosities played a key role to determine the strength. And, the weaving width was an important parameter to control the strength.