• Journal of Welding and Joining
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• v.29 no.4
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• pp.54-60
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• 2011

Adhesive bonding is one of the most promising joining methods which may substitute for conventional metallurgical joining processes, such as welding, brazing and soldering. Curing behavior and mechanical properties of adhesive joint are largely dependent on the curing agent including hardener and catalyst. In this study, effects of curing system on the curing behavior and single-lap shear strength of epoxy adhesive joint are investigated. Dihydrazide, anhydride and dicyandiamide(DICY) were chosen as hardener and imidazole and triphenylphosphine(TPP) were chosen as catalyst. In curing behavior, TPP showed the delay of the curing rate for DICY and ADH at $160^{\circ}C$, compared to imidazole catalyst due to the high curing onset/peak temperature. DICY seemed to be most beneficial in the joint strength for both steel and Al adherends, although the type of adherends affected the shear strength of epoxy adhesive joint.

• Journal of Welding and Joining
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• v.32 no.5
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• pp.44-49
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• 2014

The effect of weldbond hybrid joining process on the mechanical behavior of single lap and L-tensile joints was investigated for the newly developed 1.2GPa grade ultra high strength TRIP(transformation induced plasticity) steel. In the case of single lap shear behavior, the weldbond joint of 1.2GPa TRIP steel showed lower maximum tensile load and elongation than that of the adhesive bonding only. It was considered to be due to the reduction of real adhesion area, which was caused by the degradation of adhesive near the spot weld, and the brittle fracture behavior of the spot weld joint. In the case of L-tensile behavior, however, the maximum tensile load of the weldbond joint of 1.2GPa TRIP steel was dramatically increased and the fracture mode was change to the base metal fracture which is desirable for the spot weld joint. These synergic effect of the weldbond hybrid joining process in 1.2GPa TRIP steel was considered to be due to the stress dissipation around the spot weld joint by the presence of adhesive which resulted in the change of crack propagation path.

• Journal of Welding and Joining
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• v.35 no.3
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• pp.1-6
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• 2017

The effect of metal turnover (MTO) of electroless Ni plating bath on the brittle fracture behavior of electroless nickel electroless palladium immersion gold (ENEPIG)/Sn-3.0wt%Ag-0.5wt%Cu(SAC305) solder joint was evaluated in this study. The MTOs of the electroless Ni for the ENEPIG surface finish were 0 and 3. As the MTO increased, the interfacial IMC thickness increased. The brittle fracture behavior of the ENEPIG/SAC305 solder joint was evaluated with high speed shear (HSS) test. The HSS strength decreased with increasing the MTO of the electroless Ni bath. The brittle fracture increased with increasing the shear speed of the HSS test. The percentage of the brittle fracture for the 3 MTO sample was much higher than that for the 0 MTO sample.

• Journal of Welding and Joining
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• v.33 no.5
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• pp.41-46
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• 2015

The snap cure NCP(non-conducive paste) adhesive material is essentially required for the high productivity flip chip bonding process. In this study, the accessibility of DEA(dielectric analysis) method for the evaluation of snap cure behavior was investigated with comparison to the isothermal DSC(differential scanning calorimetry) method. NCP adhesive was mainly formulated with epoxy resin and imidazole curing agent. Even though there were some noise in the dielectric loss factor curve measured by DEA, the cure start and completion points could be specified clearly through the data processing of cumulation and deviation method. Degree of cure by DEA method which was measured from the variation of the dielectric loss factor of adhesive material was corresponded to about 80% of the degree of cure by DSC method which was measured from the heat of curing reaction. Because the adhesive joint cured to the degree of 80% in the view point of chemical reaction reveals the sufficient mechanical strength, DEA method is expected to be used effectively in the estimation of the high speed curing behavior of snap cure type NCP adhesive material for flip chip bonding.

• Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
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• 2000.10a
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• pp.171-177
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• 2000

It is essential to understand the creep behavior, which shows how long the characteristics of material maintains because press joined molding GMT-Sheet for recycle is usually used in the severe environment. In this study, we predict joining strength of GMT-Sheet for recycle, when lap length was changed. and we will investigate how compression ratio have an effect on creep behavior in press joined molding. The result of experiment of forming condition concerned with joining problem of GMT-Sheet is as followings joining efficiency. of GMT-Sheet, increases as lap joint length I, increases. Increase of compression ratio causes decrease o f joining efficiency after of GMT-Sheet joining. As the result of creep test, GMT-Sheet is easily damaged in high temperature range, because it is sensitive to the temperature

• Nuclear Engineering and Technology
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• v.56 no.1
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• pp.317-327
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• 2024

This study investigated the chloride-induced stress corrosion cracking (CISCC) behavior expected to occur in welds of austenitic stainless steel, which are considered candidate materials for dry storage containers for spent nuclear fuel. The behavior was studied by varying temperature, relative humidity (RH), and chloride concentration. 304L-ER308L welded plates were processed into U-bend specimens and exposed to a cyclic corrosion chamber for 12 weeks. The CISCC behavior was then analyzed using electron microscopy. A previous study by the authors confirmed that CISCC occurred in ER308L at 60 ℃, 30% RH, and 0.6 M NaCl via selective corrosion of δ-ferrite. When the temperature was lowered from 60 ℃ to 50 ℃, CISCC still occurred. However, when the humidity was reduced to 20% RH, CISCC did not happen. This can be attributed to the retardation of the deliquescence of NaCl at lower humidity, which was insufficient to promote CISCC. Furthermore, increased chloride concentration to 1.0 M resulted in the absence of CISCC and widespread surface corrosion with severe pitting corrosion because of the increase in thin film thickness.

• Journal of the Korean Ceramic Society
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• v.51 no.4
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• pp.312-316
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• 2014

The joining behavior of forsterite ceramics to SUS304 alloy using $8PbO-78Bi_2O_3-8B_2O_3-4ZnO-2SiO_2$ (wt%) system glass frit was investigated. The contact angle was smaller than $90^{\circ}$ at a temperature of $460^{\circ}C$. Redox reaction at the interface between forsterite and SUS304 was found to appear when the electrons in the metal part moved toward the glass part and the oxygen ions in glass moved to the metal side. The decrease of the surface tension due to the PbO solubility on the forsterite side contributed to the better wetting behavior at low temperature.

• Journal of the Korean Ceramic Society
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• v.52 no.1
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• pp.19-22
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• 2015

The joining behavior of YSZ ceramics to the glasses used in the $9Al_2O_3-24ZrO_2-51SiO_2-16R_2O$ and $9Al_2O_3-24ZrO_2-51SiO_2-7La_2O_3-9R_2O$ (wt%) glass systems was investigated. The glass transition and softening temperatures were determined to be $430^{\circ}C$ and $760^{\circ}C$, respectively. The behavior of the contact angle was inversely proportional to an increase in the temperature. The Zr element in YSZ acted as a nucleation agent and contributed to the bonding behavior at the interface.

• International Journal of Korean Welding Society
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• v.4 no.1
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• pp.15-22
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• 2004

Metal transfer behavior of three shielded metal arc welding electrodes, AWS El1018, E6013 and E6010, were investigated through the characterization of size distribution of droplets and measurement of arc voltage signals. Of the three electrodes, Ell018 electrode showed the largest droplet size with the smallest amount of spatter, while E6010 electrode showed the smallest droplet size with the largest amount of spatter. Even though Ell0l8 electrode showed a good agreement between the frequencies of voltage drop in FFT processed voltage signals and the transfer rate of droplets, E6013 and E6010 electrodes showed weaker correlation because of their dominant explosive transfer behavior. The type of cathode used and electrode baking time also influenced the metal transfer behavior. Compared to bead-on-plate welding using steel plate as a cathode, welding on a water-cooled copper pipe showed less short-circuiting and higher melting rate in all electrodes because of higher arc potential and/or anode drop. When baked for a long time, E6010 electrode showed much more stable arc with less short-circuiting and explosion due to the loss of gas formation ingredients.

• Journal of Welding and Joining
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• v.18 no.4
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• pp.55-63
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• 2000

This paper presents a study of the solder bumping process. The theoretical model, based on the variational principle instead of solving the Navier-Stokes equation with moving boundaries, was developed to considered the energy dissipation in semi-solid phase and the approximate solidification time of the molten metal droplet. The simulation results revealed that the developed model could reasonably describe the collision behavior of molten metal with solid surface. Simulations were made with variation of initial droplet temperature, substrate metal and initial substrate temerature.