• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 1997년도 춘계학술강연 및 발표대회 강연 및 발표논문 초록집
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• pp.20-20
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• 1997

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 1998년도 추계학술발표회 초록집
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• pp.32-32
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• 1998

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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• pp.798-802
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• 2002

Metallurgical studies on the bonded interlayer of directionally solidified Ni-base superalloy GTD111 joints were carried out during transient liquid phase bonding. The formation mechanism of solid during solidification process was also investigated. Microstructures at the bonded interlayer of joints were characterized with bonding temperature. In the bonding process held at 1403K, liquid insert metal was eliminated by well known mechanism of isothermal solidification process and formation of the solid from the liquid at the bonded interlayer were achieved by epitaxial growth. In addition, grain boundary formed at bonded interlayer is consistent with those of base metal. However, in the bonding process held at 1453K, extensive formation of the liquid phase was found to have taken place along dendrite boundaries and grain boundaries adjacent to bonded interlayer. Liquid phases were also observed at grain boundaries far from the bonding interface. This phenomenon results in liquation of grain boundaries. With prolonged holding, liquid phases decreased gradually and changed to isolated granules, but did not disappeared after holding for 7.2ks at 1473K. This isothermal solidification occurs by diffusion of Ti to be result in liquation. In addition, grain boundaries formed at bonded interlayer were corresponded with those of base metal. In the GTD-ll1 alloy, bonding mechanism differs with bonding temperature.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 1997년도 춘계학술대회논문집
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• pp.113-118
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• 1997

A new approach to process optimal design in non-isothermal, non-steady state metal forming is presented. In this approach, the optimal design problem is formulated on the basis of the integrated thermo-mechanical finite element process model so as to cover a wide range of the objective functions and design variables, and the derivative based approach is adopted for conducting optimization by design iteration. The process model, the formulation for process optimal design, and the procedures for the evaluation of the design sensitivity and for design iteration for optimization are described.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 1999년도 춘계학술대회논문집
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• pp.140-143
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• 1999

The major objective of the present paper is to develop a channel cutting machine and to establish an analytical technique for actual shearing process. Isothermal finite element(FE)-simulation of the shearing process are carried out using FE software DEFORM. The element-kill method has enabled the achievement of FE-simulation from the initial stage to the final stage of the shearing process. The effects of the punch-die clearance on the shearing process are investigated.

• 한국주조공학회지
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• 제26권5호
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• pp.211-216
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• 2006

The study for thixoextrusion process of 7075, 7003 Al wrought alloys and AZ31 Mg wrought alloy was carried out with respect to reheating rate, isothermal holding temperature and time with an emphasis to the effect of homogenization on thixotropic micro-structures during the partial remelting, especially in the low liquid fraction ($f_L<0.2$). The liquid fraction and average grain size with respect to reheating profile such as reheating rate, isothermal holding temperature and time were almost uniform. It is considered very useful for thixoextrusion in terms of process control such as billet temperature control and actual extrusion time. Micro-structural controls of 7075, 7003 Al wrought alloys and AZ31 Mg wrought alloy before and after homogenization were available and thixotropic microstructures were obtained in both specimens.

• 대한기계학회논문집B
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• 제21권12호
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• pp.1710-1719
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• 1997

An approximate analytical solution for the initial transient process of close-contact melting occurring between a phase change material kept at its melting temperature and an isothermally heated flat surface is derived. The model is so developed that it can cover both rectangular and circular cross-sectional solid blocks. Normalization of simplified model equations in reference to the steady solution enables the solution to be expressed in a generalized form depending on the liquid-to-solid density ratio only. A selected result shows an excellent agreement with the previously reported numerical data, which justifies the present approach. The solution appears to be capable of describing all the fundamental characteristics of the transient process. In particular, dependence of the solid descending velocity oft the density ratio at the early stage of melting is successfully resolved. The effects of other parameters except the density ratio on the transient behaviors are efficiently represented via the steady solution implied in the normalized result. A simple approximate method for estimating the effect of convection on heat transfer across the liquid film is also proposed.

• 한국세라믹학회지
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• 제53권1호
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• pp.24-33
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• 2016

The grafting reaction for maleic anhydride (MA) onto high density polyethylene (HDPE) was investigated from solution process with initiators. The chemical modification of neat HDPE was carried out with various contents of MA (3-21 wt.%) and initiator (0.2-1 wt.%) at different temperature ($80-130^{\circ}C$). The grafting degree was obtained from the titration and the highest grafting degree was 3.1%. The grafting degree increased as the content of MA and initiator increased, however, the highest grafting degree was demonstrated for a particular content of MA and initiator. In the non-isothermal crystallization kinetics, the Ozawa model was unsuitable method to investigate the crystallization behavior of MA onto HDPE, whereas the Avrami and Liu models found effective. The crystallization rate was accelerated as the cooling rate increased, but postponed by combination of MA onto neat HDPE backbone.

• Journal of Welding and Joining
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• 제21권2호
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• pp.82-88
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• 2003

The bonding phenomenon and mechanism in the transient liquid phase bonding(TLP Bonding) of directionally solidified Ni base superalloy, GTD-111 was investigated. At the bonding temperature of 1403K, liquid insert metal was eliminated by isothermal solidification which was controlled by the diffusion of B and Si into the base metal and solids in the bonded interlayer grew epitaxially from mating base metal inward the insert metal. The number of grain boundaries formed at the bonded interlayer was corresponded with those of base metal. The liquation of grain boundary and dendrite boundary occurred at 1433K. At the bonding temperature of 1453K which is higher than liquation temperature of grain boundary, liquids of the Insert metal were connected with liquated grain boundaries and compositions in each region mixed mutually. In Joints held for various time at 1453t phases formed at liquated grain boundary far from the interface were similar to those of bonded interlayer. With prolonged holding time, liquid phases decreased gradually and liquids of continuous band shape divided many island shape. But liquid phases did not disappeared after holding for 7.2ks at 1453k. Isothermal solidification process at the bonding temperature which is higher than the liquation temperature of the grain boundary was controlled by diffusion of Ti to be result in liquation than B or Si. in insert metal. (Received January 15, 2003)

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2003년도 The 8th Asian Symposium on Precision Forging ASPF
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• pp.47-50
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• 2003

Grain size of the $\alpha$ phase is computed during isothermal forging of the TC6 aerofoil blade, by combining FE with the Yada's model of grain size. The present results illustrate the grain size and distribution of the $\alpha$ phase during isothermal forging of the TC6 aerofoil blade' in detail. The computed results show that height reduction, deformation temperature, hammer velocity and friction have significant effect on distribution of the equivalent strain, and that height reduction, deformation temperature and hammer velocity have more significant effect on grain size of the $\alpha$ phase than friction between billet and die.